Optical waveguide device
    2.
    发明授权
    Optical waveguide device 有权
    光波导器件

    公开(公告)号:US07706653B2

    公开(公告)日:2010-04-27

    申请号:US11857262

    申请日:2007-09-18

    IPC分类号: G02B6/10

    CPC分类号: G02B6/1226 B82Y20/00

    摘要: Provided is an optical waveguide device including: a core having a stacked structure of at least three layers in which first thin films having a finite width and thickness and formed of a material having a relatively high electric conductivity and a second thin film having the same width as the first thin films and formed of a material having a lower conductivity than the material forming the first thin films are stacked in sequence, the first thin films being disposed in a first layer and an uppermost layer and adjacent to each other for interaction of surface plasmons; and a clad disposed around the core and formed of a material having a lower conductivity than the material forming the first thin films and a higher refractive index than the material forming the second thin film. The thin metal films of at least two layers having a high electric conductivity in the optical waveguide device can generate a combined surface plasmon mode and propagate the generated surface plasmon mode in the length direction of the thin metal films. Thus, a propagated signal suffers from a smaller propagation loss than a surface plasmon mode supported by a single thin film.

    摘要翻译: 本发明提供一种光波导装置,其特征在于,包括:具有层叠结构的至少3层的芯,其中具有有限宽度和厚度的第一薄膜由具有较高导电性的材料形成,并且具有相同宽度的第二薄膜 因为第一薄膜并且由具有比形成第一薄膜的材料的导电性低的材料形成的材料依次层叠,所以第一薄膜被布置在第一层和最上层中并且彼此相邻以相互作用 等离子体激元 以及围绕芯部设置的包层,其由比形成第一薄膜的材料低的导电性材料形成,并且比形成第二薄膜的材料具有更高的折射率。 在光波导器件中具有高电导率的至少两层的金属薄膜可以产生组合的表面等离子体激元模式,并且在薄金属薄膜的长度方向上传播产生的表面等离子体激元模式。 因此,传播信号比由单个薄膜支持的表面等离子体模式传播损耗更小。

    OPTO-ELECTRIC BUS MODULE AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    OPTO-ELECTRIC BUS MODULE AND METHOD OF MANUFACTURING THE SAME 有权
    光电总线模块及其制造方法

    公开(公告)号:US20080226222A1

    公开(公告)日:2008-09-18

    申请号:US12049261

    申请日:2008-03-14

    IPC分类号: G02B6/12 B05D5/06

    CPC分类号: G02B6/423 G02B6/4214 G02B6/43

    摘要: Provided are an opto-electric bus module and a method of manufacturing the opto-electric bus module. The opto-electric bus module includes an opto-electric interconnection unit where a concave-shaped micro structure is formed on a lower surface of a polymer structure and an optical bench where a convex-shaped micro structure is formed in a position corresponding to the concave-shaped micro structure, at least one second electric interconnection for electric connection with a semiconductor chip is formed, and the semiconductor chip and an opto-electric device can be mounted. Thus, automatic, efficient, high-speed, and high-integration optical communication and electric communication between multi-chips can be completed at the same time by using the opto-bus module which provides low-speed electric communication while manually maintaining solid optical coupling.

    摘要翻译: 提供了一种光电总线模块和一种制造光电总线模块的方法。 光电总线模块包括光电互连单元,其中在聚合物结构的下表面上形成凹形微结构,在其上形成凸形微结构在与凹部对应的位置 形成微型结构,形成至少一个用于与半导体芯片电连接的第二电互连,并且可以安装半导体芯片和光电装置。 因此,可以通过使用提供低速电气通信的光总线模块同时完成多芯片之间的自动,高效,高集成度的光通信和电通信,同时手动保持固体光耦合 。

    Opto-electric bus module and method of manufacturing the same
    4.
    发明授权
    Opto-electric bus module and method of manufacturing the same 有权
    光电总线模块及其制造方法

    公开(公告)号:US07916984B2

    公开(公告)日:2011-03-29

    申请号:US12049261

    申请日:2008-03-14

    IPC分类号: G02B6/12

    CPC分类号: G02B6/423 G02B6/4214 G02B6/43

    摘要: Provided are an opto-electric bus module and a method of manufacturing the opto-electric bus module. The opto-electric bus module includes an opto-electric interconnection unit where a concave-shaped micro structure is formed on a lower surface of a polymer structure and an optical bench where a convex-shaped micro structure is formed in a position corresponding to the concave-shaped micro structure, at least one second electric interconnection for electric connection with a semiconductor chip is formed, and the semiconductor chip and an opto-electric device can be mounted. Thus, automatic, efficient, high-speed, and high-integration optical communication and electric communication between multi-chips can be completed at the same time by using the opto-bus module which provides low-speed electric communication while manually maintaining solid optical coupling.

    摘要翻译: 提供了一种光电总线模块和一种制造光电总线模块的方法。 光电总线模块包括光电互连单元,其中在聚合物结构的下表面上形成凹形微结构,在其上形成凸形微结构在与凹部对应的位置 形成微型结构,形成至少一个用于与半导体芯片电连接的第二电互连,并且可以安装半导体芯片和光电装置。 因此,可以通过使用提供低速电气通信的光总线模块同时完成多芯片之间的自动,高效,高集成度的光通信和电通信,同时手动保持固体光耦合 。

    OPTICAL TOUCH PANEL
    5.
    发明申请
    OPTICAL TOUCH PANEL 审中-公开
    光触控面板

    公开(公告)号:US20120146952A1

    公开(公告)日:2012-06-14

    申请号:US13206620

    申请日:2011-08-10

    IPC分类号: G06F3/042

    CPC分类号: G06F3/042 G06F2203/04103

    摘要: Provided is an optical touch panel. The optical touch panel includes: an optical waveguide including a core delivering an optical signal and a clad surrounding the core; a light generator delivering the optical signal into the optical waveguide; and a light detector measuring the optical signal passing through the optical waveguide, wherein the optical waveguide includes a sensing part having a sensing surface and a passing part having a non-sensing surface; the core includes a sensing core portion in the sensing part and a passing core portion in the passing part; and a distance between the sensing surface and a top surface of the sensing core portion is shorter than that between the non-sensing surface and a top surface of the passing core portion.

    摘要翻译: 提供了一种光学触摸面板。 光学触摸面板包括:光波导,包括传送光信号的核和围绕芯的包层; 将光信号传送到光波导中的光发生器; 以及测量通过光波导的光信号的光检测器,其中所述光波导包括具有感测表面的感测部分和具有非感测表面的通过部分; 芯部包括感测部分中的感测芯部分和通过部分中的通过芯部分; 并且感测表面和感测芯部分的顶表面之间的距离比非传感表面和通过芯部分的顶表面之间的距离短。