公开(公告)号：US09139902B2

公开(公告)日：2015-09-22

申请号：US13044621

申请日：2011-03-10

申请人： Seung-Hee Han ,  Ji-Young Byun ,  Hyun-Kwang Seok ,  Jun-Hyun Han ,  Yu-Chan Kim ,  Sung-Bai Lee ,  Jin-Young Choi

发明人： Seung-Hee Han ,  Ji-Young Byun ,  Hyun-Kwang Seok ,  Jun-Hyun Han ,  Yu-Chan Kim ,  Sung-Bai Lee ,  Jin-Young Choi

IPC分类号： C23C14/34 ,  C23C14/35 ,  H01J37/34 ,  H01J37/32 ,  C23C14/48 ,  C23C14/16

CPC分类号： C23C14/35 ,  C23C14/16 ,  C23C14/48 ,  H01J37/32532 ,  H01J37/3438 ,  H01J37/3467

摘要： Disclosed are an apparatus and a method for plasma ion implantation of a solid element, which enable plasma ion implantation of a solid element. According to the apparatus and method, a sample is placed on a sample stage in a vacuum chamber, and the inside of the vacuum chamber is maintained as a vacuum state. And, gas is supplied in the vacuum chamber, a first pulsed DC power is applied to a magnetron sputtering source so as to generate plasma ions of a solid element. The plasma ions of a solid element sputtered from the source are implanted on the surface of the sample. The first power is a pulse DC power capable of applying a high power the moment a pulse is applied while maintaining low average power. And, simultaneously with the applying of the first pulse power, a second power may be supplied to the sample stage, which is a high negative voltage pulse accelerating plasma ions of a solid element to the sample and synchronized to the pulse DC power for magnetron sputtering source. And, inductively coupled plasma may be generated in the vacuum chamber via antenna so as to increase ionization rate of a solid element and lower operation pressure of magnetron sputtering source.

摘要翻译： 公开了固体元素的等离子体离子注入的装置和方法，其能够实现固体元素的等离子体离子注入。 根据该装置和方法，将样品放置在真空室中的样品台上，并将真空室的内部保持为真空状态。 并且，在真空室中供应气体，将第一脉冲DC功率施加到磁控溅射源，以产生固体元素的等离子体离子。 从源极溅射的固体元素的等离子体离子注入到样品的表面上。 第一功率是脉冲直流电力，能够在维持低平均功率的同时施加脉冲施加高功率。 并且，与施加第一脉冲功率同时，可以将第二功率提供给样品台，该样品台是将固体元素的等离子体离子加速至样品的高负电压脉冲，并与用于磁控溅射的脉冲直流电力同步 资源。 并且，可以通过天线在真空室中产生电感耦合等离子体，以增加固体元素的电离速率和降低磁控管溅射源的操作压力。

公开(公告)号：US20120228123A1

公开(公告)日：2012-09-13

申请号：US13044621

申请日：2011-03-10

申请人： Seung-Hee HAN ,  Ji-Young Byun ,  Hyun-Kwang Seok ,  Jun-Hyun Han ,  Yu-Chan Kim ,  Sung-Bai Lee ,  Jin-Young Choi

发明人： Seung-Hee HAN ,  Ji-Young Byun ,  Hyun-Kwang Seok ,  Jun-Hyun Han ,  Yu-Chan Kim ,  Sung-Bai Lee ,  Jin-Young Choi

IPC分类号： C23C14/48 ,  C23C14/35

CPC分类号： C23C14/35 ,  C23C14/16 ,  C23C14/48 ,  H01J37/32532 ,  H01J37/3438 ,  H01J37/3467

摘要： Disclosed are an apparatus and a method for plasma ion implantation of a solid element, which enable plasma ion implantation of a solid element.According to the apparatus and method, a sample is placed on a sample stage in a vacuum chamber, and the inside of the vacuum chamber is maintained as a vacuum state. And, gas is supplied in the vacuum chamber, a first pulsed DC power is applied to a magnetron sputtering source so as to generate plasma ions of a solid element. The plasma ions of a solid element sputtered from the source are implanted on the surface of the sample. The first power is a pulse DC power capable of applying a high power the moment a pulse is applied while maintaining low average power. And, simultaneously with the applying of the first pulse power, a second power may be supplied to the sample stage, which is a high negative voltage pulse accelerating plasma ions of a solid element to the sample and synchronized to the pulse DC power for magnetron sputtering source. And, inductively coupled plasma may be generated in the vacuum chamber via antenna so as to increase ionization rate of a solid element and lower operation pressure of magnetron sputtering source.

摘要翻译： 公开了固体元素的等离子体离子注入的装置和方法，其能够实现固体元素的等离子体离子注入。 根据该装置和方法，将样品放置在真空室中的样品台上，并将真空室的内部保持为真空状态。 并且，在真空室中供应气体，将第一脉冲DC功率施加到磁控溅射源，以产生固体元素的等离子体离子。 从源极溅射的固体元素的等离子体离子注入到样品的表面上。 第一功率是脉冲直流电力，能够在维持低平均功率的同时施加脉冲施加高功率。 并且，与施加第一脉冲功率同时，可以将第二功率提供给样品台，该样品台是将固体元素的等离子体离子加速至样品的高负电压脉冲，并与用于磁控溅射的脉冲直流电力同步 资源。 并且，可以通过天线在真空室中产生电感耦合等离子体，以增加固体元素的电离速率和降低磁控管溅射源的操作压力。

公开(公告)号：US08617290B2

公开(公告)日：2013-12-31

申请号：US12909914

申请日：2010-10-22

申请人： Ji-Young Byun ,  Yoon-Bae Kim ,  Hyun-Kwang Seok ,  Jang-Won Kim ,  Dow-Bin Hyun ,  Heon-Phil Ha ,  Do-Hyung Kim

发明人： Ji-Young Byun ,  Yoon-Bae Kim ,  Hyun-Kwang Seok ,  Jang-Won Kim ,  Dow-Bin Hyun ,  Heon-Phil Ha ,  Do-Hyung Kim

IPC分类号： B22F9/16

CPC分类号： B22F9/16

摘要： The present invention relates to a method for manufacturing a Fe—Si alloy powder. A method for manufacturing a Fe—Si alloy powder includes: providing a mixture of an Al2O3 powder, an active agent powder, a Si powder, and a Fe powder; heating the mixture with a temperature of 700° C. to 1200° C. in the hydrogen atomosphere; magnetically separating a Fe-containing material from the mixture; and separating a Fe—Si alloy powder by soaking the Fe-containing material in an alkali solution. In the heating of the mixture, the Si powder is deposited on the surface of the Fe powder and diffused into the Fe powder.

摘要翻译： 本发明涉及一种Fe-Si合金粉末的制造方法。 Fe-Si合金粉末的制造方法包括：提供Al 2 O 3粉末，活性剂粉末，Si粉末和Fe粉末的混合物; 在氢气氛中以700℃至1200℃的温度加热混合物; 从混合物中磁性分离含Fe材料; 并通过将含Fe材料浸入碱溶液中分离Fe-Si合金粉末。 在混合物的加热中，将Si粉末沉积在Fe粉末的表面上并扩散到Fe粉末中。

公开(公告)号：US06759269B2

公开(公告)日：2004-07-06

申请号：US10285465

申请日：2002-11-01

申请人： Hyun-Kwang Seok ,  Jae-Chul Lee ,  Ho-In Lee ,  Jin-Kook Yoon ,  Ji-Young Byun

发明人： Hyun-Kwang Seok ,  Jae-Chul Lee ,  Ho-In Lee ,  Jin-Kook Yoon ,  Ji-Young Byun

IPC分类号： H01L2144

CPC分类号： B22F1/0003 ,  B22F2998/00 ,  B22F2999/00 ,  C22C2001/1073 ,  H01L23/06 ,  H01L2924/01079 ,  H01L2924/16195 ,  B22F3/14 ,  C22C1/1036 ,  B22F3/105

摘要： In a method for fabricating a Si—Al alloy packaging material, by adding Al—Si alloy powders to Si powders and pressurizing-forming it, or by pressurizing-filling Si powders or a preforming body of Si powders with Al—Si alloy melt, a Si—Al alloy packaging material having good characteristics can be obtained.

摘要翻译： 在制造Si-Al合金包装材料的方法中，通过将Al-Si合金粉末加入到Si粉末中并对其进行加压成形，或者通过用Al-Si合金熔体加压Si粉末或Si粉末预成型体， 可以获得具有良好特性的Si-Al合金包装材料。

公开(公告)号：US08842347B2

公开(公告)日：2014-09-23

申请号：US13612011

申请日：2012-09-12

申请人： Ji-Young Byun ,  Ho-bin Hwang

发明人： Ji-Young Byun ,  Ho-bin Hwang

IPC分类号： H04N1/04 ,  H04N1/00

CPC分类号： H04N1/00588 ,  H02P6/06 ,  H02P6/30 ,  H04N1/00599 ,  H04N1/00652

摘要： An image scanning apparatus includes a scanning unit which scans paper, a paper transfer unit which transfers the paper to the scanning unit using a BLDC (Brushless DC) motor, a sensor unit which senses driving information of the BLDC motor, a scan controlling unit which controls operations of the scanning unit, and generates a control command including information regarding a driving direction of the BLDC motor, a driving signal unit which generates a driving signal for controlling the BLDC motor, and a digital controlling unit which controls operations of the driving signal unit in a digital method based on a generated control command, sensed driving information and a digital gain value according to a driving direction of the BLDC motor.

摘要翻译： 一种图像扫描装置，包括扫描纸的扫描单元，使用BLDC（无刷直流）马达将纸张传送到扫描单元的纸张传送单元，感测BLDC马达的驱动信息的传感器单元，扫描控制单元， 控制扫描单元的操作，并且产生包括关于BL​​DC电动机的驱动方向的信息的控制命令，产生用于控制BLDC电动机的驱动信号的驱动信号单元和控制驱动信号的操作的数字控制单元 基于所生成的控制命令的数字方式的单元，根据BLDC电动机的驱动方向的感测驱动信息和数字增益值。

公开(公告)号：US07468122B2

公开(公告)日：2008-12-23

申请号：US11322881

申请日：2005-12-29

申请人： Ji-Young Byun ,  Kyung-Tae Hong ,  Jung-Man Doh ,  Heon-Phil Ha ,  Kyoung-Tae Kim

发明人： Ji-Young Byun ,  Kyung-Tae Hong ,  Jung-Man Doh ,  Heon-Phil Ha ,  Kyoung-Tae Kim

IPC分类号： C25D15/00

CPC分类号： C25D15/02

摘要： The present invention relates to a composite layer including a metal and inorganic powders, and a method for manufacturing the same. The method for manufacturing a composite layer including a metal and inorganic powders includes step of preparing an electrolyte which includes nickel sulfamate [Ni(NH2SO4)] at 50.0 g/l˜300.0 g/l, boric acid at 10.0 g/l˜20.0 g/l, nickel chloride (NiCl2) at 1.0 g/l˜10.0 g/l, coumarin (C9H6O2) at 0.02 g/l˜0.5 g/l, sodium dodecyl sulfate [CH3—(CH2)11—OSONa] at 4.0 g/l˜60.0 g/l, sulfuric acid at 0.0 ml/l˜150.0 ml/l, one or more inorganic powders selected from the group of alumina (Al2O3) and silicon carbide (SiC) at 20.0 g/l˜70.0 g/l, and the remainder being distilled water. A basic metal to be coated with the composite metal is dipped into the electrolyte, and power is applied to the basic metal to electroplate the basic metal with the electrolyte to form a composite layer on the basic metal.

摘要翻译： 本发明涉及包含金属和无机粉末的复合层及其制造方法。 制造包含金属和无机粉末的复合层的方法包括制备电解质的步骤包括：以50.0g / l〜300.0g / l的氨基磺酸镍[Ni（NH 2 SO 4）]，10.0g / l〜20.0g的硼酸 1.0g / l〜10.0g / l的氯化镍（NiCl 2），0.02g / l〜0.5g / l的香豆素（C 9 H 6 O 2），十四烷基硫酸钠[CH 3 - （CH 2）11 -OSONa] 0.01g / l〜150.0ml / l的硫酸，0.1g / l〜70.0g / l的一种或多种选自氧化铝（Al 2 O 3）和碳化硅（SiC）的无机粉末， 1，其余为蒸馏水。 用复合金属涂覆的基本金属被浸入电解质中，并且将功率施加到碱性金属上，以电解碱性金属以形成碱性金属上的复合层。

公开(公告)号：US20070108059A1

公开(公告)日：2007-05-17

申请号：US11322881

申请日：2005-12-29

申请人： Ji-Young Byun ,  Kyung-Tae Hong ,  Jung-Man Doh ,  Heon-Phil Ha ,  Kyoung-Tae Kim

发明人： Ji-Young Byun ,  Kyung-Tae Hong ,  Jung-Man Doh ,  Heon-Phil Ha ,  Kyoung-Tae Kim

IPC分类号： C25D5/12

CPC分类号： C25D15/02

摘要： The present invention relates to a composite layer including a metal and inorganic powders, and a method for manufacturing the same. The method for manufacturing a composite layer including a metal and inorganic powders includes steps of preparing an electrolyte including nickel sulfamate [Ni(NH2SO4)] at 50.0 g/l˜300.0 g/l, boric acid at 10.0 g/l˜20.0 g/l, nickel chloride (NiCl2) at 1.0 g/l˜10.0 g/l, coumarin (C9H6O2) at 0.02 g/l˜0.5 g/l, sodium dodecyl sulfate [CH3—(CH2)11—OSONa] at 4.0 g/l˜60.0 g/l, sulfuric acid at 0.0 ml/l˜150.0 ml/l, one or more inorganic powders selected from the group of alumina (Al2O3) and silicon carbide (SiC) at 20.0 g/l˜70.0 g/l, and the remainder being distilled water; dipping a basic metal into the electrolyte; supplying a powder to the basic metal and electroplating the basic material; and forming the composite layer on the basic metal.

摘要翻译： 本发明涉及包含金属和无机粉末的复合层及其制造方法。 制备包含金属和无机粉末的复合层的方法包括以50.0g / l的速度制备包含氨基磺酸镍[Ni（NH 2 SO 4 H 4）]的电解质的步骤 约300.0g / l，10.0g / l〜20.0g / l的硼酸，1.0g / l〜10.0g / l的氯化镍（NiCl 2 N 2），香豆素（C 9 以0.02g / l〜0.5g / l，十二烷基硫酸钠[CH 3 N 3 - （CH 3）2 H 2 O 2〜11个氨基甲酸酯，4.0g / l〜60.0g / l，硫酸0.0ml / l〜150.0ml / l，选择一种或多种无机粉末 来自氧化铝（Al 2 O 3 O 3）和20.0g / l〜70.0g / l的碳化硅（SiC），其余为蒸馏水; 将碱性金属浸入电解液中; 向碱性金属供应粉末并电镀基材; 并在基体金属上形成复合层。

公开(公告)号：US20050196633A1

公开(公告)日：2005-09-08

申请号：US11024601

申请日：2004-12-29

申请人： Jung-Man Doh ,  Ji-Young Byun ,  Jin-Kook Yoon ,  Ju-Yong Jung

发明人： Jung-Man Doh ,  Ji-Young Byun ,  Jin-Kook Yoon ,  Ju-Yong Jung

IPC分类号： B23K20/16 ,  B32B5/18 ,  B32B15/01

CPC分类号： B23K11/002 ,  B23K11/20 ,  B32B15/01 ,  Y10T428/12493

摘要： Corrosion resistant multi-layered clad plates or sheets with high bonding strength is disclosed. According to the present invention, clad metals with high corrosion resistance such as Ti, Nb, V, or Zr and their alloys can be bonded with a cheap substrate such as Fe, Cu, or Ni and their alloys by the resistance seam welding. Using the insert metal causing the eutectic reaction, the clad metal can be strongly bonded with the substrate. Especially, corrosion resistant clad plates with excellent bonding strength can be fabricated by controlling the thickness and the microstructures of the eutectic reaction layer at the interface between the clad metal and the substrate or between the clad metal and the insert metal.

摘要翻译： 公开了具有高粘合强度的耐腐蚀多层复合板或片。 根据本发明，可以用诸如Fe，Cu或Ni等廉价的基材和它们的合金通过电阻缝焊接而与Ti，Nb，V或Zr等耐蚀性高的复合金属及其合金结合。 使用引起共晶反应的插入金属，复合金属可以与基板牢固地结合。 特别地，通过控制包层金属与衬底之间或复合金属与插入金属之间的界面处的共晶反应层的厚度和微观结构，可以制造具有优异结合强度的耐腐蚀复合板。