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    Multi-chip module with stacked redundant power
    2.
    发明申请
    Multi-chip module with stacked redundant power 失效

    公开(公告)号：US20060109626A1

    公开(公告)日：2006-05-25

    申请号：US10996478

    申请日：2004-11-24

    申请人： Shaun Harris ,  Steven Belson ,  Eric Peterson ,  Gary Williams ,  Christian Belady

    发明人： Shaun Harris ,  Steven Belson ,  Eric Peterson ,  Gary Williams ,  Christian Belady

    IPC分类号： H05K7/20

    CPC分类号： H05K7/1092 ,  Y10T307/505

    摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.

    Processor module for system board
    10.
    发明申请
    Processor module for system board 有权
    系统板处理器模块

    公开(公告)号：US20060133041A1

    公开(公告)日：2006-06-22

    申请号：US11021504

    申请日：2004-12-21

    申请人： Christian Belady ,  Gary Williams ,  Shaun Harris ,  Steven Belson ,  Eric Peterson

    发明人： Christian Belady ,  Gary Williams ,  Shaun Harris ,  Steven Belson ,  Eric Peterson

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/045 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2203/1572

    摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

    摘要翻译： 实施例包括用于系统板的处理器模块的装置，方法和系统。 在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。 第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。 散热装置通过热交换从处理器散热。 第二部分设置在第一部分和系统板之间产生的空间中。 第二部分具有用于向处理器提供电力的电力系统板。 电源系统板相邻并平行于PCB的第二侧延伸。