利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

20 条记录 (耗时 0.028 秒)

    METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING
    2.
    发明申请
    METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 审中-公开
    通过闭环液体辅助空气冷却与直接液体冷却组合来冷却设备外壳的方法和装置

    公开(公告)号：US20080055856A1

    公开(公告)日：2008-03-06

    申请号：US11862308

    申请日：2007-09-27

    申请人： Shawn Hall ,  Shurong Tian ,  Paul Coteus ,  John Karidis ,  Evan Colgan ,  Robert Guernsey

    发明人： Shawn Hall ,  Shurong Tian ,  Paul Coteus ,  John Karidis ,  Evan Colgan ,  Robert Guernsey

    IPC分类号： H05K7/20 ,  H05K5/02

    CPC分类号： H05K7/20754 ,  G06F1/20 ,  G06F2200/201

    摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

    摘要翻译： 优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。 由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片 例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

    METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP, LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING
    3.
    发明申请
    METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP, LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 有权
    用于通过闭环冷却设备外壳的方法和装置，液体辅助的空气冷却与直接液体冷却的组合

    公开(公告)号：US20070002536A1

    公开(公告)日：2007-01-04

    申请号：US11427384

    申请日：2006-06-29

    申请人： Shawn Hall ,  Shurong Tian ,  Paul Coteus ,  John Karidis ,  Evan Colgan ,  Robert Guernsey

    发明人： Shawn Hall ,  Shurong Tian ,  Paul Coteus ,  John Karidis ,  Evan Colgan ,  Robert Guernsey

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20754 ,  G06F1/20 ,  G06F2200/201

    摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

    摘要翻译： 优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。 由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片 例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

    Efficiency of static core turn-off in a system-on-a-chip with variation
    4.
    发明授权
    Efficiency of static core turn-off in a system-on-a-chip with variation 失效
    在具有变化的片上系统中静态磁芯关断的效率

    公开(公告)号：US08571847B2

    公开(公告)日：2013-10-29

    申请号：US12727984

    申请日：2010-03-19

    申请人： Chen-Yong Cher ,  Paul W. Coteus ,  Alan Gara ,  Eren Kursun ,  David P. Paulsen ,  Brian A. Schuelke ,  John E. Sheets, II ,  Shurong Tian

    发明人： Chen-Yong Cher ,  Paul W. Coteus ,  Alan Gara ,  Eren Kursun ,  David P. Paulsen ,  Brian A. Schuelke ,  John E. Sheets, II ,  Shurong Tian

    IPC分类号： G06G7/75

    CPC分类号： G06F1/3203 ,  G06F1/206 ,  G06F1/3237 ,  G06F11/24 ,  Y02D10/128 ,  Y02D10/16

    摘要： A processor-implemented method for improving efficiency of a static core turn-off in a multi-core processor with variation, the method comprising: conducting via a simulation a turn-off analysis of the multi-core processor at the multi-core processor's design stage, wherein the turn-off analysis of the multi-core processor at the multi-core processor's design stage includes a first output corresponding to a first multi-core processor core to turn off; conducting a turn-off analysis of the multi-core processor at the multi-core processor's testing stage, wherein the turn-off analysis of the multi-core processor at the multi-core processor's testing stage includes a second output corresponding to a second multi-core processor core to turn off; comparing the first output and the second output to determine if the first output is referring to the same core to turn off as the second output; outputting a third output corresponding to the first multi-core processor core if the first output and the second output are both referring to the same core to turn off.

    摘要翻译： 一种用于提高多核处理器中的静态核心关断的效率的处理器实现的方法，所述方法包括：通过模拟在多核处理器的设计处进行多核处理器的关断分析 其中所述多核处理器的设计阶段的所述多核处理器的关断分析包括对应于第一多核处理器核的第一输出关闭; 在多核处理器的测试阶段对多核处理器进行关断分析，其中多核处理器的测试阶段的多核处理器的关断分析包括对应于第二多核处理器的第二多输出 核心处理器核心关闭; 比较第一输出和第二输出以确定第一输出是否指相同的磁芯作为第二输出关闭; 如果第一输出和第二输出均指向相同的核来关闭，则输出对应于第一多核处理器核心的第三输出。

    FOLDED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES
    7.
    发明申请
    FOLDED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES 失效
    用于封闭热封装置的折叠式金属热源

    公开(公告)号：US20080123300A1

    公开(公告)日：2008-05-29

    申请号：US11564353

    申请日：2006-11-29

    申请人： Shurong Tian ,  Shawn A. Hall ,  Paul W. Coteus

    发明人： Shurong Tian ,  Shawn A. Hall ,  Paul W. Coteus

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3672 ,  G11C5/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.

    摘要翻译： 用于冷却发热装置的折叠式散热器。 折叠式散热器包括具有第一端和第二端的基本平坦的基座。 底座旨在与一个或多个发热装置的暴露的，基本平坦的表面热接触地固定。 折叠的散热器还包括两个肩部，每个肩部具有近端和远端。 肩部的近端从基座的第一端和第二端基本成直角地突出。 折叠的散热器还包括两个臂，每个臂具有近端和远端。 臂的近端从肩部的远端基本上以直角突出，使得基部，肩部和臂从近似接近的矩形管由连续的金属片形成。