-
1.发明授权Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling 有权将大规模集成（VLSI）芯片封装安装到计算机冷却用的方法和装置
公开(公告)号：US5969944A
公开(公告)日：1999-10-19
申请号：US148034
申请日：1998-09-03
CPC分类号： G06F1/20 , G06F1/189 , G06F2200/201
摘要： A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.
摘要翻译： 提供了一种用于在计算机机箱的背面上安装诸如微处理器的超大规模集成（VLSI）芯片的方法和装置。 在一个实施例中，计算机机箱上的安装被配置为提供电流供应连接，用于通过计算机机箱从当前源将高电平的电流传送到微处理器。 还提供了一种用于将诸如微处理器的VLSI芯片安装在计算机系统的底盘上以便通过计算机机箱从VLSI芯片散发到计算机系统外部的环境的方法和装置。 还提供了一种或多个VLSI芯片之间的信号互连的方法和装置，例如安装在计算机的机箱上的微处理器，以提供具有强烈完整性的信号容量。 还提供了用于将用于VLSI芯片封装的电源安装在计算机的后机架上的方法和装置。
-
公开(公告)号：US6018465A
公开(公告)日：2000-01-25
申请号：US777251
申请日：1996-12-31
CPC分类号： H05K1/0263 , G06F1/183 , H01L23/4006 , H01L2023/4087 , H01L2224/16225 , H01L2924/00014 , H01L2924/15174 , H05K2201/10272 , H05K2201/10424 , H05K2201/10492 , H05K2201/10704 , H05K2201/10734
摘要： An apparatus is provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided is an apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided is an apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided is an apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.
摘要翻译： 提供了一种用于在计算机机箱的背面上安装诸如微处理器的超大规模集成（VLSI）芯片的装置。 在一个实施例中，计算机机箱上的安装被配置为提供电流供应连接，用于通过计算机机箱从当前源将高电平的电流传送到微处理器。 还提供了一种用于将诸如微处理器的VLSI芯片安装在计算机系统的底盘上的装置，以便通过计算机机箱从VLSI芯片散发到计算机系统外部的环境。 还提供了一种用于一个或多个VLSI芯片之间的信号互连的装置，例如安装在计算机的机架上的微处理器，以提供具有强烈完整性的信号容量。 还提供了一种用于在计算机的后机箱上安装用于VLSI芯片封装的电源的装置。
-
搜索结果
2 条记录 (耗时 0.021 秒)
