摘要:
A battery with a soaking plate for a thermally and electrically conductive channel includes a plurality of battery rolls and two cap assemblies. Each of the battery rolls includes a central member and at least one electrode piece. Each of two ends of the central member has a bending portion. The electrode piece at least includes a positive electrode layer and a negative electrode layer. The electrode piece is winding around the central member. The battery rolls are disposed in parallel, and the bending portions at the two ends are formed as terminal disposed portions. The two cap assemblies are disposed at the terminal disposed portions.
摘要:
A battery with a soaking plate for a thermally and electrically conductive channel includes a plurality of battery rolls and two cap assemblies. Each of the battery rolls includes a central member and at least one electrode piece. Each of two ends of the central member has a bending portion. The electrode piece at least includes a positive electrode layer and a negative electrode layer. The electrode piece is winding around the central member. The battery rolls are disposed in parallel, and the bending portions at the two ends are formed as terminal disposed portions. The two cap assemblies are disposed at the terminal disposed portions.
摘要:
A membrane probe card is provided. The membrane probe card includes a pressure mechanism having an upper-housing and a support block. The support block has a spring system for providing a distance of travel to the support block. A printed circuit board is coupled to the pressure mechanism for providing electrical connection to a test apparatus. A membrane assembly is coupled to the pads on a wafer for providing electric connection to the printed circuit board. The membrane assembly is a replaceable and modularized component for application to integrated circuits with various layouts and dimensions.
摘要:
An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises the following components. (1) A base unit, consisting of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) An interposer, comprising flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) An adapter unit, capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit. (4) A cover unit is located over the base, the interposer and the adapter unit, and including a cover and a spring such that the cover is coupled to the depressor of the adapter unit and being capable of vertically moving up and down.