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公开(公告)号:US08757845B2
公开(公告)日:2014-06-24
申请号:US13194538
申请日:2011-07-29
申请人: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
发明人: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号: F21V7/07
CPC分类号: F21K9/50 , F21K9/60 , F21K9/90 , F21V3/02 , F21V3/0625 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
摘要: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.
摘要翻译: 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管(LED)装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖,其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。
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公开(公告)号:US08794791B2
公开(公告)日:2014-08-05
申请号:US13151857
申请日:2011-06-02
申请人: Sheng-Shin Guo , Wei-Yu Yeh , Chih-Hsuan Sun , Pei-Wen Ko
发明人: Sheng-Shin Guo , Wei-Yu Yeh , Chih-Hsuan Sun , Pei-Wen Ko
CPC分类号: F21K9/64 , F21K9/232 , F21V3/08 , F21V7/041 , F21W2121/00 , F21Y2101/00 , F21Y2107/60 , F21Y2115/10
摘要: The embodiments of a light-emitting-diode-based (LED-based) light bulb and an LED assembly described provide mechanisms of reflecting generated by LED emitters toward the back of the LED-based light bulb. An upper substrate and a lower substrate are used to support upper and lower LED emitters. A slanted and reflective surface between the upper substrate and the lower substrate reflects light generated by the lower LED emitters toward the backside of the LED-based light bulb.
摘要翻译: 基于发光二极管(LED)的灯泡和LED组件的实施例提供了由LED发射器朝向基于LED的灯泡背面产生的反射机制。 上基板和下基板用于支撑上下LED发射器。 上基板和下基板之间的倾斜和反射表面将由下LED发射器产生的光朝向基于LED的灯泡的背面反射。
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公开(公告)号:US20130027946A1
公开(公告)日:2013-01-31
申请号:US13194538
申请日:2011-07-29
申请人: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
发明人: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
CPC分类号: F21K9/50 , F21K9/60 , F21K9/90 , F21V3/02 , F21V3/0625 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
摘要: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.
摘要翻译: 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管(LED)装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖,其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。
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公开(公告)号:US09006770B2
公开(公告)日:2015-04-14
申请号:US13110642
申请日:2011-05-18
申请人: Wei-Yu Yeh , Pei-Wen Ko , Chih-Hsuan Sun , Hsueh-Hung Fu
发明人: Wei-Yu Yeh , Pei-Wen Ko , Chih-Hsuan Sun , Hsueh-Hung Fu
CPC分类号: H01L33/641 , H01L33/62 , H01L2924/0002 , H01L2933/0075 , H05K1/0203 , H05K1/0206 , H05K1/05 , H05K2201/10106 , H05K2201/10969 , H01L2924/00
摘要: A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.
摘要翻译: 发光二极管(LED)载体组件包括安装在硅基座上的LED管芯,设置在硅基座下方的导热和电隔离的中间层以及设置在中间层下方的印刷电路板(PCB)。 中间层与硅基座和PCB结合。
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公开(公告)号:US20130094180A1
公开(公告)日:2013-04-18
申请号:US13275550
申请日:2011-10-18
申请人: Chih-Hsuan Sun , Wei-Yu Yeh , Pei-Wen Ko , Hsueh-Hung Fu
发明人: Chih-Hsuan Sun , Wei-Yu Yeh , Pei-Wen Ko , Hsueh-Hung Fu
CPC分类号: F21V3/12 , F21K9/232 , F21K9/60 , F21V3/02 , F21V3/062 , F21V3/10 , F21V5/04 , F21V7/22 , F21V13/02 , F21V29/75 , F21V29/773 , F21Y2115/10 , Y10T29/49885
摘要: The present disclosure provides an illumination device. The illumination device includes a light emitting device (LED) on a substrate. A heat sink is thermally connected to the LED device. A cap is secured over the substrate and covers the LED device. The cap includes a coating material that comprises both diffusion and reflection characteristics.
摘要翻译: 本公开提供一种照明装置。 照明装置包括在基板上的发光装置(LED)。 散热片与LED器件热连接。 盖子固定在基板上并覆盖LED装置。 盖包括包括扩散和反射特性的涂层材料。
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公开(公告)号:US09222640B2
公开(公告)日:2015-12-29
申请号:US13275550
申请日:2011-10-18
申请人: Chih-Hsuan Sun , Wei-Yu Yeh , Pei-Wen Ko , Hsueh-Hung Fu
发明人: Chih-Hsuan Sun , Wei-Yu Yeh , Pei-Wen Ko , Hsueh-Hung Fu
IPC分类号: F21V9/16 , F21V3/04 , F21V3/02 , F21V7/22 , F21K99/00 , F21V29/75 , F21V29/77 , F21V5/04 , F21Y101/02 , F21V13/02
CPC分类号: F21V3/12 , F21K9/232 , F21K9/60 , F21V3/02 , F21V3/062 , F21V3/10 , F21V5/04 , F21V7/22 , F21V13/02 , F21V29/75 , F21V29/773 , F21Y2115/10 , Y10T29/49885
摘要: The present disclosure provides an illumination device. The illumination device comprises a light-emitting diode (LED) device on a substrate, a heat sink and a cap. The heat sink is thermally connected to the LED device. The cap is secured over the substrate and covering the LED device. The cap includes a coating material having diffusion and reflection characteristics, and the coating material is free of being in direct contact with the LED device. The coating material is applied on a first portion of an inner surface of the cap, but not on a second portion of the inner surface of the cap.
摘要翻译: 本公开提供一种照明装置。 照明装置包括在基板上的发光二极管(LED)装置,散热器和盖。 散热器与LED器件热连接。 盖子固定在基板上并覆盖LED装置。 盖包括具有扩散和反射特性的涂层材料,并且涂层材料不与LED装置直接接触。 涂层材料施加在盖的内表面的第一部分上,而不是在盖的内表面的第二部分上。
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公开(公告)号:US08721097B2
公开(公告)日:2014-05-13
申请号:US13111222
申请日:2011-05-19
申请人: Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
发明人: Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
CPC分类号: F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
摘要: The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.
摘要翻译: 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管(LED)光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。
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公开(公告)号:US20120293978A1
公开(公告)日:2012-11-22
申请号:US13111222
申请日:2011-05-19
申请人: Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
发明人: Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
CPC分类号: F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
摘要: The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.
摘要翻译: 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管(LED)光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。
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公开(公告)号:US08702278B2
公开(公告)日:2014-04-22
申请号:US13326766
申请日:2011-12-15
申请人: Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
发明人: Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
IPC分类号: F21V29/00
CPC分类号: F21V17/02 , F21K9/20 , F21K9/60 , F21V5/007 , F21V13/04 , F21V29/74 , F21V29/75 , F21V29/763 , F21V29/83 , F21W2131/103 , F21Y2101/00 , F21Y2113/00 , F21Y2115/10 , Y02B20/72
摘要: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.
摘要翻译: 本公开涉及路灯。 路灯包括基座,连接到基座的灯柱和联接到灯柱的灯头。 灯头包括壳体和设置在壳体内的多个LED灯模块。 LED灯模块是独立的并且彼此独立。 每个LED灯模块包括用作灯的光源的LED阵列。 每个LED灯模块还包括热耦合到LED的散热器。 散热器可操作以在操作期间散发由LED产生的热量。 每个LED灯模块还包括具有多个开口的导热盖。 每个LED与相应的一个开口对齐并设置在其中。
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公开(公告)号:US20130155673A1
公开(公告)日:2013-06-20
申请号:US13326766
申请日:2011-12-15
申请人: Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
发明人: Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
CPC分类号: F21V17/02 , F21K9/20 , F21K9/60 , F21V5/007 , F21V13/04 , F21V29/74 , F21V29/75 , F21V29/763 , F21V29/83 , F21W2131/103 , F21Y2101/00 , F21Y2113/00 , F21Y2115/10 , Y02B20/72
摘要: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.
摘要翻译: 本公开涉及路灯。 路灯包括基座,连接到基座的灯柱和联接到灯柱的灯头。 灯头包括壳体和设置在壳体内的多个LED灯模块。 LED灯模块是独立的并且彼此独立。 每个LED灯模块包括用作灯的光源的LED阵列。 每个LED灯模块还包括热耦合到LED的散热器。 散热器可操作以在操作期间散发由LED产生的热量。 每个LED灯模块还包括具有多个开口的导热盖。 每个LED与相应的一个开口对齐并设置在其中。
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