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    Semiconductor laser unit and optical pickup device
    3.
    发明申请
    Semiconductor laser unit and optical pickup device 失效
    半导体激光单元和光学拾取装置

    公开(公告)号：US20070008862A1

    公开(公告)日：2007-01-11

    申请号：US11480478

    申请日：2006-07-05

    申请人： Kiyoshi Fujihara ,  Masaya Tateyanagi ,  Shigeki Okamoto

    发明人： Kiyoshi Fujihara ,  Masaya Tateyanagi ,  Shigeki Okamoto

    IPC分类号： G11B7/00

    CPC分类号： G11B7/127 ,  H01L2224/48091 ,  H01S5/02248 ,  H01L2924/00014

    摘要： The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a second opening and fixing the flexible substrate in the state of being bent along from the top surface to both side faces of the metal plate; and an optical element covering the second opening. The flexible substrate is fixed so that the first opening extends over the top surface and both side faces of the center portion.

    摘要翻译： 半导体激光单元包括：具有比其余部分宽的中心部分的金属板; 具有第一开口的柔性基板; 安装在中心部分上的基板; 放置在基板上的半导体激光器; 具有第二开口的框架，并且在从所述金属板的顶面向两侧面弯曲的状态下固定所述柔性基板; 以及覆盖所述第二开口的光学元件。 柔性基板被固定，使得第一开口在中心部分的顶表面和两个侧面上延伸。

    Optical device and method of manufacturing the same
    4.
    发明申请
    Optical device and method of manufacturing the same 有权
    光学装置及其制造方法

    公开(公告)号：US20060092812A1

    公开(公告)日：2006-05-04

    申请号：US11253602

    申请日：2005-10-20

    申请人： Masaya Tateyanagi ,  Masanori Minamio ,  Shigeki Okamoto ,  Kiyoshi Fujihara

    发明人： Masaya Tateyanagi ,  Masanori Minamio ,  Shigeki Okamoto ,  Kiyoshi Fujihara

    IPC分类号： G11B7/00

    CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K1/147 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.

    摘要翻译： 铜框架板（2）具有中央框架板（2a）和从中央框架板的两端弯曲的一对侧框架板（2c）。 柔性基板（3）具有覆盖中心框架​​板的中心基板（3a）和从中心基板弯曲的弯曲基板（3b），以覆盖侧框架板。 光学元件（4）安装在中央框架板上。 连接到光学元件的多个内部布线端子（9）设置在中心基板上并且沿着一对侧框板彼此相对的宽度方向（W）布置。 用于与外部设备连接的多个外部接线端子（11）设置在弯曲的基板上并且沿与宽度方向正交的长度方向（L）布置。

    Optical device and method of manufacturing the same
    5.
    发明授权
    Optical device and method of manufacturing the same 有权
    光学装置及其制造方法

    公开(公告)号：US07440386B2

    公开(公告)日：2008-10-21

    申请号：US11253602

    申请日：2005-10-20

    申请人： Masaya Tateyanagi ,  Masanori Minamio ,  Shigeki Okamoto ,  Kiyoshi Fujihara

    发明人： Masaya Tateyanagi ,  Masanori Minamio ,  Shigeki Okamoto ,  Kiyoshi Fujihara

    IPC分类号： G11B7/00

    CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K1/147 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.

    摘要翻译： 铜框架板（2）具有中央框架板（2a）和从中央框架板的两端弯曲的一对侧框架板（2c）。 柔性基板（3）具有覆盖中心框架​​板的中心基板（3a）和从中心基板弯曲的弯曲基板（3b），以覆盖侧框架板。 光学元件（4）安装在中央框架板上。 连接到光学元件的多个内部布线端子（9）设置在中心基板上并且沿着一对侧框板彼此相对的宽度方向（W）布置。 用于与外部设备连接的多个外部接线端子（11）设置在弯曲的基板上并且沿与宽度方向正交的长度方向（L）布置。

    Semiconductor laser unit and optical pickup device including the semiconductor laser unit
    7.
    发明申请
    Semiconductor laser unit and optical pickup device including the semiconductor laser unit 审中-公开
    包括半导体激光单元的半导体激光单元和光学拾取装置

    公开(公告)号：US20060078021A1

    公开(公告)日：2006-04-13

    申请号：US11247283

    申请日：2005-10-12

    申请人： Kiyoshi Fujihara ,  Masanori Minamio ,  Masaya Tateyanagi ,  Shigeki Okamoto

    发明人： Kiyoshi Fujihara ,  Masanori Minamio ,  Masaya Tateyanagi ,  Shigeki Okamoto

    IPC分类号： H01S5/00

    CPC分类号： H01S5/02216 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01S5/02248 ,  H01S5/02288 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The present invention provides a semiconductor laser unit which realizes efficient heat dissipation, reduction in size, high-density integration of optical elements, prevention of a light-receiving element from being polluted with dust, and simple structure for easy assembly. The semiconductor laser unit includes: (a) a metal plate having a first recessed portion in a central part of an upper surface of the metal plate; (b) a flexible printed circuit which has wiring patterns, and a first aperture positioned on the first recessed portion, and is bent at both ends and in contact with the first recessed portion and a pair of side surfaces of the metal plate; (c) a light-emitting/receiving unit which includes a light-emitting element and a light-receiving element, and is placed on the first recessed portion through the first aperture; (d) a frame having: side portions for fixing firmly, on the side surfaces of the metal plate, the flexible printed circuit which is in contact with the side surfaces; and a top portion which has a second aperture and is placed on a protruding portion of the metal plate so that the first recessed portion is covered with the top portion and the second aperture faces toward the first recessed portion; and (e) an optical element which covers the second aperture.

    摘要翻译： 本发明提供一种实现高效散热，尺寸减小，光学元件的高密度集成，防止受光元件被灰尘污染的半导体激光器单元，以及易于组装的简单结构。 半导体激光单元包括：（a）在金属板的上表面的中心部分具有第一凹部的金属板; （b）具有布线图案的柔性印刷电路和位于第一凹部上的第一孔，并且在两端弯曲并与金属板的第一凹部和一对侧面接触; （c）发光/接收单元，其包括发光元件和光接收元件，并通过第一孔放置在第一凹部上; （d）框架，其具有：用于在所述金属板的所述侧表面上牢固固定的侧部，所述柔性印刷电路与所述侧表面接触; 以及顶部，其具有第二孔，并且被放置在所述金属板的突出部分上，使得所述第一凹部被所述顶部覆盖，并且所述第二孔朝向所述第一凹部; 和（e）覆盖第二孔的光学元件。

    Process for laser welding of aluminum based elements
    8.
    发明授权
    Process for laser welding of aluminum based elements 失效
    铝基元件激光焊接工艺

    公开(公告)号：US4760240A

    公开(公告)日：1988-07-26

    申请号：US12156

    申请日：1987-02-09

    申请人： Tsutomu Iikawa ,  Takeaki Sakai ,  Isao Kawamura ,  Katsuhide Natori ,  Takeshi Nagai ,  Shigeki Okamoto

    发明人： Tsutomu Iikawa ,  Takeaki Sakai ,  Isao Kawamura ,  Katsuhide Natori ,  Takeshi Nagai ,  Shigeki Okamoto

    IPC分类号： B23K1/005 ,  B23K26/00 ,  B23K26/32 ,  B23K35/28

    CPC分类号： B23K35/286 ,  B23K1/0056 ,  B23K26/32 ,  B23K2201/34 ,  B23K2203/10

    摘要： A process for laser welding a cover and a casing, each made of aluminum or an aluminum-based alloy, via a nickel layer plated thereon, thereby forming a package for electronic devices, the process comprising the steps of: boring holes in sides of the casing, thereby providing holes through which input/output and source terminals can be inserted and be soldered hermetically to the casing; plating a nickel layer on the surface of the casing; mounting electronic devices in the casing and forming necessary connections between the devices and the terminals; and, welding the cover and the casing together by pulsed YAG laser beam, thereby forming a weld zone containing 1.5 to 10.0% of nickel by weight, and sealing the cover and the casing hermetically.

    摘要翻译： 一种用铝或铝基合金制成的覆盖物和壳体的激光焊接方法，其上镀镍层，形成电子器件的封装，该方法包括以下步骤：在 从而提供孔，通过该孔可以将输入/输出端子和源极端子插入并密封地焊接到壳体上; 在壳体的表面上镀镍层; 将电子设备安装在壳体中并在设备和终端之间形成必要的连接; 并且通过脉冲YAG激光束将盖和壳体焊接在一起，从而形成包含1.5至10.0重量％的镍的焊接区域，并且密封盖和壳体。