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公开(公告)号：US07501617B2
公开(公告)日：2009-03-10
申请号：US11374093
申请日：2006-03-14
CPC分类号： G01J1/42 , G01J1/02 , G01J1/0271 , G01J2001/4247
摘要： A tester according to the present invention can conduct a test on optical devices each having a different positional relation between a position of a contact face of an external contact terminal and a direction of light emitted from a semiconductor laser element.
摘要翻译： 根据本发明的测试器可以对在外部接触端子的接触面的位置和从半导体激光元件发射的光的方向之间具有不同位置关系的光学器件进行测试。
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2.发明申请公开(公告)号：US20090161712A1
公开(公告)日：2009-06-25
申请号：US12332770
申请日：2008-12-11
申请人： Isao Hayami , Masaya Tateyanagi
发明人： Isao Hayami , Masaya Tateyanagi
IPC分类号： H01S5/022
CPC分类号： G11B7/123 , H01L2224/48091 , H01S5/02208 , H01S5/02216 , H01S5/32341 , H01L2924/00014
摘要： A cap 25 having a piece of glass 26 formed at a laser irradiating position and covering a laser irradiating direction and an upper face of a package 24, is mounted onto the package 24 having lateral faces of a frame body 30 formed in three directions other than the laser irradiating direction, so as to reduce the distance between a semiconductor element 22 and the piece of glass and to reduce a radius 32 of the piece of glass 26. The profile of the semiconductor device can be therefore lowered while maintaining the characteristics of a semiconductor laser. In addition, by mounting the semiconductor device, the profile of an optical pickup device can also be lowered.
摘要翻译： 具有形成在激光照射位置并覆盖激光照射方向的玻璃片26和封装24的上表面的盖25安装在封装件24上，该封装件24具有形成在框架主体30以外的三个方向的侧面 激光照射方向，以便减小半导体元件22和玻璃片之间的距离并减小玻璃片26的半径32.因此可以降低半导体器件的轮廓，同时保持半导体元件22的特性 半导体激光器。 此外，通过安装半导体器件，也可以降低光学拾取器件的轮廓。
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公开(公告)号：US20060208183A1
公开(公告)日：2006-09-21
申请号：US11374093
申请日：2006-03-14
CPC分类号： G01J1/42 , G01J1/02 , G01J1/0271 , G01J2001/4247
摘要： A tester according to the present invention can conduct a test on optical devices each having a different positional relation between a position of a contact face of an external contact terminal and a direction of light emitted from a semiconductor laser element.
摘要翻译： 根据本发明的测试器可以对在外部接触端子的接触面的位置和从半导体激光元件发射的光的方向之间具有不同位置关系的光学器件进行测试。
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公开(公告)号：US20100103802A1
公开(公告)日：2010-04-29
申请号：US12571778
申请日：2009-10-01
CPC分类号： G11B7/1275 , G11B7/123 , G11B2007/0006
摘要： An optical unit includes: a first light emitting device configured to emit a first beam; and a second light emitting device configured to emit a second beam in a direction the same as a direction of the first beam where the second beam is different in wavelength from the first beam. An emission surface of the second light emitting device is arranged at a distance from an emission surface of the first light emitting device in an opposite direction to the direction of the first beam.
摘要翻译： 光学单元包括：配置成发射第一光束的第一发光器件; 以及第二发光器件，被配置为沿与第一光束的波长与第一光束不同的第一光束的方向相同的方向发射第二光束。 第二发光器件的发射表面在与第一光束的方向相反的方向上被布置在与第一发光器件的发射表面一定距离处。
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公开(公告)号：US20070008862A1
公开(公告)日：2007-01-11
申请号：US11480478
申请日：2006-07-05
IPC分类号： G11B7/00
CPC分类号： G11B7/127 , H01L2224/48091 , H01S5/02248 , H01L2924/00014
摘要： The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a second opening and fixing the flexible substrate in the state of being bent along from the top surface to both side faces of the metal plate; and an optical element covering the second opening. The flexible substrate is fixed so that the first opening extends over the top surface and both side faces of the center portion.
摘要翻译： 半导体激光单元包括：具有比其余部分宽的中心部分的金属板; 具有第一开口的柔性基板; 安装在中心部分上的基板; 放置在基板上的半导体激光器; 具有第二开口的框架，并且在从所述金属板的顶面向两侧面弯曲的状态下固定所述柔性基板; 以及覆盖所述第二开口的光学元件。 柔性基板被固定，使得第一开口在中心部分的顶表面和两个侧面上延伸。
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公开(公告)号：US20060092812A1
公开(公告)日：2006-05-04
申请号：US11253602
申请日：2005-10-20
IPC分类号： G11B7/00
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2924/3025 , H05K1/147 , H05K1/189 , H01L2924/00014 , H01L2924/00
摘要： A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.
摘要翻译： 铜框架板（2）具有中央框架板（2a）和从中央框架板的两端弯曲的一对侧框架板（2c）。 柔性基板（3）具有覆盖中心框架板的中心基板（3a）和从中心基板弯曲的弯曲基板（3b），以覆盖侧框架板。 光学元件（4）安装在中央框架板上。 连接到光学元件的多个内部布线端子（9）设置在中心基板上并且沿着一对侧框板彼此相对的宽度方向（W）布置。 用于与外部设备连接的多个外部接线端子（11）设置在弯曲的基板上并且沿与宽度方向正交的长度方向（L）布置。
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公开(公告)号：US07440386B2
公开(公告)日：2008-10-21
申请号：US11253602
申请日：2005-10-20
IPC分类号： G11B7/00
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2924/3025 , H05K1/147 , H05K1/189 , H01L2924/00014 , H01L2924/00
摘要： A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.
摘要翻译： 铜框架板（2）具有中央框架板（2a）和从中央框架板的两端弯曲的一对侧框架板（2c）。 柔性基板（3）具有覆盖中心框架板的中心基板（3a）和从中心基板弯曲的弯曲基板（3b），以覆盖侧框架板。 光学元件（4）安装在中央框架板上。 连接到光学元件的多个内部布线端子（9）设置在中心基板上并且沿着一对侧框板彼此相对的宽度方向（W）布置。 用于与外部设备连接的多个外部接线端子（11）设置在弯曲的基板上并且沿与宽度方向正交的长度方向（L）布置。
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公开(公告)号：US07280573B2
公开(公告)日：2007-10-09
申请号：US11480478
申请日：2006-07-05
IPC分类号： H01S3/04
CPC分类号： G11B7/127 , H01L2224/48091 , H01S5/02248 , H01L2924/00014
摘要： The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a second opening and fixing the flexible substrate in the state of being bent along from the top surface to both side faces of the metal plate; and an optical element covering the second opening. The flexible substrate is fixed so that the first opening extends over the top surface and both side faces of the center portion.
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9.发明申请Semiconductor laser unit and optical pickup device including the semiconductor laser unit 审中-公开包括半导体激光单元的半导体激光单元和光学拾取装置公开(公告)号：US20060078021A1
公开(公告)日：2006-04-13
申请号：US11247283
申请日：2005-10-12
IPC分类号： H01S5/00
CPC分类号： H01S5/02216 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01S5/02248 , H01S5/02288 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a semiconductor laser unit which realizes efficient heat dissipation, reduction in size, high-density integration of optical elements, prevention of a light-receiving element from being polluted with dust, and simple structure for easy assembly. The semiconductor laser unit includes: (a) a metal plate having a first recessed portion in a central part of an upper surface of the metal plate; (b) a flexible printed circuit which has wiring patterns, and a first aperture positioned on the first recessed portion, and is bent at both ends and in contact with the first recessed portion and a pair of side surfaces of the metal plate; (c) a light-emitting/receiving unit which includes a light-emitting element and a light-receiving element, and is placed on the first recessed portion through the first aperture; (d) a frame having: side portions for fixing firmly, on the side surfaces of the metal plate, the flexible printed circuit which is in contact with the side surfaces; and a top portion which has a second aperture and is placed on a protruding portion of the metal plate so that the first recessed portion is covered with the top portion and the second aperture faces toward the first recessed portion; and (e) an optical element which covers the second aperture.
摘要翻译： 本发明提供一种实现高效散热，尺寸减小，光学元件的高密度集成，防止受光元件被灰尘污染的半导体激光器单元，以及易于组装的简单结构。 半导体激光单元包括：（a）在金属板的上表面的中心部分具有第一凹部的金属板; （b）具有布线图案的柔性印刷电路和位于第一凹部上的第一孔，并且在两端弯曲并与金属板的第一凹部和一对侧面接触; （c）发光/接收单元，其包括发光元件和光接收元件，并通过第一孔放置在第一凹部上; （d）框架，其具有：用于在所述金属板的所述侧表面上牢固固定的侧部，所述柔性印刷电路与所述侧表面接触; 以及顶部，其具有第二孔，并且被放置在所述金属板的突出部分上，使得所述第一凹部被所述顶部覆盖，并且所述第二孔朝向所述第一凹部; 和（e）覆盖第二孔的光学元件。
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10.发明授权公开(公告)号：US07852900B2
公开(公告)日：2010-12-14
申请号：US12332770
申请日：2008-12-11
申请人： Isao Hayami , Masaya Tateyanagi
发明人： Isao Hayami , Masaya Tateyanagi
CPC分类号： G11B7/123 , H01L2224/48091 , H01S5/02208 , H01S5/02216 , H01S5/32341 , H01L2924/00014
摘要： A cap 25 having a piece of glass 26 formed at a laser irradiating position and covering a laser irradiating direction and an upper face of a package 24, is mounted onto the package 24 having lateral faces of a frame body 30 formed in three directions other than the laser irradiating direction, so as to reduce the distance between a semiconductor element 22 and the piece of glass 26 and to reduce a radius 32 of the piece of glass 26. The profile of the semiconductor device can be therefore lowered while maintaining the characteristics of a semiconductor laser. In addition, by mounting the semiconductor device, the profile of an optical pickup device can also be lowered.
摘要翻译： 具有形成在激光照射位置并覆盖激光照射方向的玻璃片26和封装24的上表面的盖25安装在封装件24上，该封装件24具有形成在框架主体30以外的三个方向的侧面 激光照射方向，以便减小半导体元件22和玻璃片26之间的距离并减小玻璃片26的半径32.因此可以降低半导体器件的轮廓，同时保持其特性 半导体激光器。 此外，通过安装半导体器件，也可以降低光学拾取器件的轮廓。
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