公开(公告)号：US07264407B2

公开(公告)日：2007-09-04

申请号：US10980154

申请日：2004-11-04

申请人： Shigeki Okamoto ,  Masaya Tateyanagi ,  Masanori Mimamio ,  Kiyoshi Fujihara ,  Hiroyuki Ishida ,  Toshiyuki Fukuda

发明人： Shigeki Okamoto ,  Masaya Tateyanagi ,  Masanori Mimamio ,  Kiyoshi Fujihara ,  Hiroyuki Ishida ,  Toshiyuki Fukuda

IPC分类号： G02B6/36 ,  G02B6/12

CPC分类号： H01L31/022408 ,  H01L31/02002 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.

摘要翻译： 光学装置包括铜板，安装在铜板上的光接收元件，安装在光接收元件上的发光元件，弯曲成覆盖铜板的上表面和侧表面的部分的柔性基板，以及定位框架 用于将柔性基板和铜板彼此固定的金属。 由于定位框架固定柔性基板和铜板以防止移动，所以可以在不使用树脂模制结构的情况下获得薄的光学装置。

公开(公告)号：US20050152634A1

公开(公告)日：2005-07-14

申请号：US10980154

申请日：2004-11-04

申请人： Shigeki Okamoto ,  Masaya Tateyanagi ,  Masanori Mimamio ,  Kiyoshi Fujihara ,  Hiroyuki Ishida ,  Toshiyuki Fukuda

发明人： Shigeki Okamoto ,  Masaya Tateyanagi ,  Masanori Mimamio ,  Kiyoshi Fujihara ,  Hiroyuki Ishida ,  Toshiyuki Fukuda

IPC分类号： H01S5/022 ,  G02B6/12 ,  H01L21/50 ,  H01L23/00 ,  H01L31/02 ,  H01S5/026 ,  H05K7/14

CPC分类号： H01L31/022408 ,  H01L31/02002 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.

摘要翻译： 光学装置包括铜板，安装在铜板上的光接收元件，安装在光接收元件上的发光元件，弯曲成覆盖铜板的上表面和侧表面的部分的柔性基板，以及定位框架 用于将柔性基板和铜板彼此固定的金属。 由于定位框架固定柔性基板和铜板以防止移动，所以可以在不使用树脂模制结构的情况下获得薄的光学装置。

公开(公告)号：US20100091633A1

公开(公告)日：2010-04-15

申请号：US12525217

申请日：2008-03-10

申请人： Junya FuruyashikiI ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya FuruyashikiI ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/135 ,  H01L21/50 ,  H01L23/28

CPC分类号： H01L31/0203 ,  G11B7/123 ,  G11B7/1275 ,  G11B7/13 ,  H01L21/4803 ,  H01L23/055 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A flat pre-board plate including connection electrodes, internal interconnections, and external-connection portions is prepared. This pre-board plate is cut at portions each located between adjacent ones of the connection electrodes, thereby forming trenches. A plurality of semiconductor elements are placed in each of the trenches. Electrode pads and the connection electrodes are connected to each other by metal wires. Transparent lids are placed on, and bonded to, spacers to cover the semiconductor elements. Thereafter, two lines of the connection electrodes arranged between adjacent ones of the trenches are separated from each other. Subsequently, adjacent ones of the semiconductor elements are also separated from each other.

摘要翻译： 制备包括连接电极，内部互连和外部连接部分的平板预板板。 将该预板板切割成相邻的连接电极之间的部分，从而形成沟槽。 多个半导体元件被放置在每个沟槽中。 电极焊盘和连接电极通过金属线彼此连接。 将透明盖放置在隔离物上并结合到覆盖半导体元件上。 此后，布置在相邻的沟槽之间的两条连接电极彼此分离。 随后，相邻的半导体元件也彼此分离。

公开(公告)号：US20100091630A1

公开(公告)日：2010-04-15

申请号：US12525227

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/00 ,  H01L21/78 ,  H01L23/29

CPC分类号： G11B7/1275 ,  H01L21/4803 ,  H01L23/055 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A plurality of parallel rib prototypes are provided on a flat base plate. A plurality of semiconductor elements are placed in each trench between adjacent ones of the rib prototypes, and a transparent member is bonded to each of the semiconductor elements. Electrode pads of the semiconductor elements are wire bonded to connection electrodes. The trenches are then filled with an encapsulating resin. Thereafter, middle portions, in the longitudinal direction, of the rib prototypes are cut with a dicing saw, and adjacent ones of the semiconductor elements are separated from each other, thereby obtaining semiconductor devices.

摘要翻译： 多个平行肋原型设置在平坦的基板上。 多个半导体元件被放置在相邻的肋原型之间的每个沟槽中，并且透明构件被结合到每个半导体元件。 半导体元件的电极焊盘被引线接合到连接电极。 然后用封装树脂填充沟槽。 此后，用切割锯切割肋骨原型的纵向中间部分，并且相邻的半导体元件彼此分离，从而获得半导体器件。

公开(公告)号：US20070217476A1

公开(公告)日：2007-09-20

申请号：US11708478

申请日：2007-02-21

申请人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

发明人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

IPC分类号： H01S3/06

CPC分类号： H01S5/02272 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L33/20 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32057 ,  H01L2224/48 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/157 ,  H01L2924/3511 ,  H01S5/0071 ,  H01S5/0207 ,  H01S5/02216 ,  H01S5/0224 ,  H01S5/02292 ,  H01S5/02476 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An optical semiconductor device includes a semiconductor laser chip, a base for mounting the semiconductor laser chip and a solder layer sandwiched between the top surface of the base and the bottom surface of the semiconductor laser chip. The semiconductor laser chip is warped in upward convex shape.

摘要翻译： 光半导体器件包括半导体激光器芯片，用于安装半导体激光器芯片的基座和夹在基底的顶表面和半导体激光器芯片的底表面之间的焊料层。 半导体激光芯片翘曲成向上凸出的形状。

公开(公告)号：US20100001174A1

公开(公告)日：2010-01-07

申请号：US12525499

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： H01J3/14 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L27/14683 ,  G11B7/1275 ,  G11B7/13 ,  H01L23/055 ,  H01L23/10 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2224/85 ,  H01L2924/00

摘要： In a semiconductor device, a semiconductor element is mounted on a substantially rectangular package. First ribs are respectively provided on a pair of opposite external edges of a mounting surface and project upward from the pair of opposite external edges. External edges of a lid are placed on the upper surfaces of the first ribs, and fixed thereto with an adhesive. Dams are provided on external edges of the first rib upper surfaces. The adhesive is continuously present from side surfaces of the lid to the dams.

摘要翻译： 在半导体器件中，半导体元件安装在大致矩形的封装上。 第一肋分别设置在安装表面的一对相对的外边缘上并从该对相对的外边缘向上突出。 盖的外边缘放置在第一肋的上表面上，并用粘合剂固定在其上。 大坝设置在第一肋上表面的外边缘上。 粘合剂从盖的侧表面连续存在于坝。

公开(公告)号：US07359416B2

公开(公告)日：2008-04-15

申请号：US11708478

申请日：2007-02-21

申请人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

发明人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

IPC分类号： H01S3/14 ,  H01S3/07

CPC分类号： H01S5/02272 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L33/20 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32057 ,  H01L2224/48 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/157 ,  H01L2924/3511 ,  H01S5/0071 ,  H01S5/0207 ,  H01S5/02216 ,  H01S5/0224 ,  H01S5/02292 ,  H01S5/02476 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An optical semiconductor device includes a semiconductor laser chip, a base for mounting the semiconductor laser chip and a solder layer sandwiched between the top surface of the base and the bottom surface of the semiconductor laser chip. The semiconductor laser chip is warped in upward convex shape.

摘要翻译： 光半导体器件包括半导体激光器芯片，用于安装半导体激光器芯片的基座和夹在基底的顶表面和半导体激光器芯片的底表面之间的焊料层。 半导体激光芯片翘曲成向上凸出的形状。

公开(公告)号：US20100008203A1

公开(公告)日：2010-01-14

申请号：US12525779

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/00 ,  H01L31/02 ,  H01L21/50

CPC分类号： H01L27/14618 ,  G11B7/12 ,  H01L23/055 ,  H01L23/3185 ,  H01L24/97 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2224/85 ,  H01L2924/00

摘要： A semiconductor element is mounted on a rectangular base of a package including the base and ribs provided on a pair of opposite external edges of the base. Electrode pads of the semiconductor element and connection electrodes provided on rib upper surfaces are connected to each other by metal wires. On the rib upper surfaces, spacers are provided at locations closer to the outside than the connection electrodes. A transparent lid adheres to the upper surfaces of the spacers to cover the entire surface of the package. The height of the spacers is greater than the diameter of the metal wires.

摘要翻译： 半导体元件安装在包装件的矩形基座上，该基座和肋设置在基座的一对相对的外缘上。 设置在肋上表面上的半导体元件和连接电极的电极焊盘通过金属线彼此连接。 在肋上表面上，间隔件设置在比连接电极更靠近外部的位置处。 透明盖粘附到间隔物的上表面以覆盖整个包装的整个表面。 间隔件的高度大于金属丝的直径。

公开(公告)号：US08390117B2

公开(公告)日：2013-03-05

申请号：US12331467

申请日：2008-12-10

申请人： Yoshiaki Shimizu ,  Yuichiro Yamada ,  Toshiyuki Fukuda

发明人： Yoshiaki Shimizu ,  Yuichiro Yamada ,  Toshiyuki Fukuda

IPC分类号： H01L23/482 ,  H01L23/488 ,  H01L21/44

CPC分类号： H05K3/38 ,  B29C43/18 ,  B29C45/02 ,  B29C45/14655 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3511 ,  H05K3/3457 ,  H05K2201/0379 ,  H05K2201/10515 ,  H05K2201/10977 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2924/0695

摘要： A semiconductor device capable of realizing highly reliable three-dimensional mounting, and a method of manufacturing the same, are provided. A projected electrode 9 is formed in a region outside of an element mounting region of a substrate 5. The projected electrode 9 includes a protruding portion that protrudes from the front face of a molding resin portion 10. The distal end of the protruding portion is a flat face 13. In addition, a portion of the projected electrode 9 whose cross section is larger than the protruding portion is positioned inside the molding resin portion 10.

摘要翻译： 提供能够实现高度可靠的三维安装的半导体器件及其制造方法。 突起电极9形成在基板5的元件安装区域的外侧的区域中。突出电极9包括从模制树脂部分10的前表面突出的突出部分。突出部分的远端是 另外，突出电极9的横截面大于突出部分的部分位于模制树脂部分10的内部。

公开(公告)号：US20110254094A1

公开(公告)日：2011-10-20

申请号：US13067721

申请日：2011-06-22

申请人： Takayuki Yoshida ,  Kimihito Kuwabara ,  Takuma Motofuji ,  Toshiyuki Fukuda

发明人： Takayuki Yoshida ,  Kimihito Kuwabara ,  Takuma Motofuji ,  Toshiyuki Fukuda

IPC分类号： H01L29/772

CPC分类号： H01L21/823807 ,  H01L21/823871 ,  H01L24/10 ,  H01L29/7842 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device 20 formed on a semiconductor chip substrate 30 has a plurality of circuit blocks made up of circuits each containing at least a metal oxide semiconductor (MOS) transistor 36, the circuit blocks being covered on top with a protective film 41 to protect the circuits. A plurality of bumps 23a, 23b, 23c are formed, at least via the protective film 41, only on circuit blocks whose current-carrying ability and threshold voltage do not satisfy predetermined values and which are in need of performance enhancement. The bumps 23a, 23b, 23c impose stresses on the MOS transistors 36, increasing the mobility of the MOS transistors 36 and thereby improving the performance of the semiconductor device 20.

摘要翻译： 形成在半导体芯片基板30上的半导体装置20具有由至少包含金属氧化物半导体（MOS）晶体管36的电路构成的多个电路块，电路块由保护膜41覆盖在顶部，以保护 电路。 至少通过保护膜41仅形成多个凸起23a，23b，23c，其电流承载能力和阈值电压不满足预定值并且需要性能提高的电路块。 凸起23a，23b，23c在MOS晶体管36上施加应力，增加MOS晶体管36的迁移率，从而提高半导体器件20的性能。