公开(公告)号：US5508557A

公开(公告)日：1996-04-16

申请号：US296585

申请日：1994-08-29

Applicant: Shigemasa Sunada

Inventor： Shigemasa Sunada

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/34 ,  H01L24/97 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/1532 ,  H01L2924/181

Abstract: A surface mounting type diode is provided which comprises: a diode chip; a pair of leads held in electrical conduction with the diode chip, each of the leads including an inner end, an outer end, a first bend closer to the inner end, a second bend closer to the outer end, and an intermediate portion between the first and second bends; and a resin package enclosing the diode chip together with part of the respective leads, the resin package having a flat bottom surface. The inner end, first bend, second bend and intermediate portion of the lead are contained in the resin package. Further, the outer end of the lead has an exposed flat mounting surface flush with the bottom surface of the resin package.

Abstract translation: 提供一种表面安装型二极管，其包括：二极管芯片; 与二极管芯片保持导通的一对引线，每个引线包括内端，外端，靠近内端的第一弯曲部分，更接近外端的第二弯曲部， 第一和第二弯; 以及将所述二极管芯片与部分引线封装的树脂封装，所述树脂封装具有平坦的底面。 引线的内端，第一弯曲，第二弯曲和中间部分包含在树脂封装中。 此外，引线的外端具有与树脂封装的底表面齐平的暴露的平坦安装表面。

公开(公告)号：US5625223A

公开(公告)日：1997-04-29

申请号：US577511

申请日：1995-12-22

Applicant: Shigemasa Sunada

Inventor： Shigemasa Sunada

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/34 ,  H01L24/97 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/1532 ,  H01L2924/181

Abstract: A surface mounting type diode is provided which comprises: a diode chip; a pair of leads held in electrical conduction with the diode chip, each of the leads including an inner end, an outer end, a first bend closer to the inner end, a second bend closer to the outer end, and an intermediate portion between the first and second bends; and a resin package enclosing the diode chip together with part of the respective leads, the resin package having a flat bottom surface. The inner end, first bend, second bend and intermediate portion of the lead are contained in the resin package. Further, the outer end of the lead has an exposed flat mounting surface flush with the bottom surface of the resin package.

Abstract translation: 提供表面安装型二极管，其包括：二极管芯片; 与二极管芯片保持导通的一对引线，每个引线包括内端，外端，靠近内端的第一弯曲部分，更接近外端的第二弯曲部， 第一和第二弯; 以及将所述二极管芯片与部分引线封装的树脂封装，所述树脂封装具有平坦的底面。 引线的内端，第一弯曲，第二弯曲和中间部分包含在树脂封装中。 此外，引线的外端具有与树脂封装的底表面齐平的暴露的平坦安装表面。

公开(公告)号：US6143676A

公开(公告)日：2000-11-07

申请号：US214894

申请日：1999-01-14

Applicant: Norio Ohashi ,  Michiyo Kuriyama ,  Shigeru Yamagata ,  Shigemasa Sunada

Inventor： Norio Ohashi ,  Michiyo Kuriyama ,  Shigeru Yamagata ,  Shigemasa Sunada

IPC: C03B19/14 ,  C03B23/047 ,  C03B32/00 ,  C03C3/06 ,  C03B9/10 ,  G02B1/00

CPC classification number: C03C3/06 ,  C03B19/1453 ,  C03B23/047 ,  C03B32/00 ,  C03B2201/07 ,  C03B2201/075 ,  C03B2201/20 ,  C03B2201/21 ,  C03B2201/23 ,  C03B2207/32 ,  C03C2201/11 ,  C03C2201/21 ,  C03C2201/23 ,  C03C2203/52

Abstract: An object of the present invention is to provide a synthetic silica glass optical material which exhibits excellent transmittance as well as durability for high output power vacuum ultraviolet rays, being emitted from, for example, ArF excimer lasers and Xe.sub.2 excimer lamps, and to provide a method for producing the same. A synthetic silica glass optical material for high output power vacuum ultraviolet rays made from ultra high purity synthetic silica glass for use in the wavelength region of from 165 to 195 nm, containing OH groups at a concentration of from 5 to 300 wtppm with a fluctuation width in OH group concentration (.DELTA.OH/cm) of 10 wtppm or less, containing hydrogen molecules at a concentration of from 1.times.10.sup.17 to 1.times.10.sup.19 molecule/cm.sup.3 with a fluctuation width in hydrogen molecule concentration (.DELTA.H.sub.2 /cm) of 1.times.10.sup.17 molecule/cm.sup.3 or lower, and containing chlorine at a concentration of 50 wtppm or lower. Also claimed is a method for producing the same.

Abstract translation: PCT No.PCT / EP98 / 02965 Sec。 371日期1999年1月14日第 102（e）日期1999年1月14日PCT提交1998年5月20日PCT公布。 第WO98 / 52879号公报 日期：1998年11月26日本发明的目的是提供一种合成石英玻璃光学材料，其表现出优异的透射率以及从例如ArF准分子激光器和Xe2准分子灯发射的高输出功率真空紫外线的耐久性 并提供其制造方法。 一种用于高浓度合成石英玻璃的高输出功率真空紫外线的合成二氧化硅玻璃光学材料，用于波长范围为165至195nm的OH基，其浓度为5至300重量ppm，具有波动宽度 OH分子浓度（DELTA OH / cm）为10重量ppm以下，含有浓度为1×10 17〜1×10 19分子/ cm 3的氢分子，氢分子浓度的波动宽度（DELTA H2 / cm）为1×10 17分子/ cm 3， 较低，含有浓度为50重量ppm以下的氯。 还要求保护其的方法。

公开(公告)号：US5382754A

公开(公告)日：1995-01-17

申请号：US34371

申请日：1993-03-18

Applicant: Shigemasa Sunada

Inventor： Shigemasa Sunada

IPC: B23K26/00 ,  H05K3/30 ,  H05K13/04 ,  H05K5/06

CPC classification number: H05K3/305 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2203/107 ,  Y02P70/613

Abstract: A central region of the bottom surface of a resin in which a diode chip and a base end portion of each of two lead terminals electrically connected to the chip is burning-treated by irradiating a laser beam in order to remove fat and oil existing in the bottom surface. Thereby, the deterioration of adhesive strength of an adhesive agent for fixing the bottom surface of the resin to a circuit board is prevented.

Abstract translation: 树脂的底面的中央区域，其中通过照射激光束对与芯片电连接的两个引线端子中的每一个的二极管芯片和基端部进行燃烧处理，以便除去存在于该芯片中的脂肪和油 底面。 因此，防止了将树脂的底面固定到电路板上的粘合剂的粘合强度的劣化。