公开(公告)号：US06806723B2

公开(公告)日：2004-10-19

申请号：US10369705

申请日：2003-02-21

申请人： Shigeyuki Maruyama ,  Keisuke Fukuda ,  Naoyuki Watanabe ,  Takumi Kumatabara ,  Naohisa Matsushita ,  Masayuki Imakado ,  Kyohei Tamaki ,  Hiroshi Nozawa

发明人： Shigeyuki Maruyama ,  Keisuke Fukuda ,  Naoyuki Watanabe ,  Takumi Kumatabara ,  Naohisa Matsushita ,  Masayuki Imakado ,  Kyohei Tamaki ,  Hiroshi Nozawa

IPC分类号： G01R3102

CPC分类号： G01R1/0675 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00

摘要： Contact electrodes having a predetermined shape are formed by irradiating a laser beam onto the contact electrodes that are formed of a conductive material. The laser beam can be irradiated, after joining an end of each contact electrode opposite to a contact end to a contact board, so as to deform the contact electrode so that the contact end is located at a predetermined position. The laser beam may be irradiated while heating or cooling a portion of the contact electrode opposite to a portion onto which the laser beam is irradiated.

摘要翻译： 通过将激光照射到由导电材料形成的接触电极上而形成具有预定形状的接触电极。 在将与接触端相对的每个接触电极的端部接合到接触板之后，可以照射激光束，以使接触电极变形，使得接触端位于预定位置。 可以在加热或冷却接触电极的与照射激光束的部分相对的部分的同时照射激光束。

公开(公告)号：US07151788B2

公开(公告)日：2006-12-19

申请号：US10327643

申请日：2002-12-24

申请人： Masayuki Imakado ,  Naohisa Matsushita

发明人： Masayuki Imakado ,  Naohisa Matsushita

IPC分类号： H01S3/10 ,  H01S3/08

CPC分类号： B23K26/073

摘要： The invention relates to a laser processing device that can change the diameter of a beam spot on an object to be processed, without using a mechanism for changing a distance between a condensing lens and the object. A beam emitted from a laser beam source is condensed by the condensing lens, and is made incident to an optical fiber. The beam emitted from the optical fiber is condensed by a condensing optical system onto an object to be processed. The object is welded using the condensed beam. The laser processing device comprises an adjusting unit that can change the angle of divergence of the beam on the emission surface of the optical fiber. The adjusting unit changes the angle of divergence of the beam, thereby to change the diameter of the beam spot formed on the surface of the object.

公开(公告)号：US20090195934A1

公开(公告)日：2009-08-06

申请号：US12335932

申请日：2008-12-16

申请人： Toshikazu Furui ,  Naohisa Matsushita

发明人： Toshikazu Furui ,  Naohisa Matsushita

IPC分类号： G11B21/16 ,  B21D37/16 ,  B23K26/00

CPC分类号： G11B5/4833 ,  Y10T29/49041

摘要： A spring member manufacturing device that manufactures the spring member by laser irradiation includes a laser irradiation unit including a plurality of laser irradiation devices that perform predetermined laser irradiation with respect to the spring member. In the spring member manufacturing device, the laser irradiation devices are configured so that laser irradiated conditions different from each other are preset for the respective laser irradiation devices, and are arranged so that the respective irradiated positions do not overlap each other. The laser irradiation apparatus is constituted by combining laser irradiation devices having laser irradiation conditions being 2 to the (n−1)th power, n being a positive integer,of predetermined minimum adjustment amount for adjusting load on the spring member. The combination of the laser irradiation devices are selected in accordance with load adjusting amount required for the spring member.

摘要翻译： 通过激光照射制造弹簧构件的弹簧构件制造装置包括：激光照射单元，包括相对于弹簧构件执行预定的激光照射的多个激光照射装置。 在弹簧部件制造装置中，对各激光照射装置预先设定激光照射条件彼此不同的激光照射装置，并且配置为使得各照射位置不重叠。 激光照射装置通过将具有激光照射条件为2的激光照射装置组合成具有预定的最小调节量的第（n-1）次功率n为正整数的激光照射装置，用于调节弹簧部件上的负载。 激光照射装置的组合根据弹簧构件所需的负载调整量来选择。

公开(公告)号：US06717098B2

公开(公告)日：2004-04-06

申请号：US10271581

申请日：2002-10-17

申请人： Naohisa Matsushita

发明人： Naohisa Matsushita

IPC分类号： B23K2600

CPC分类号： B23K26/032 ,  B23K26/03 ,  B23K26/10 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4237

摘要： A laser beam welding apparatus includes a component holding unit which holds components that are to be welded. A laser irradiation unit performs welding of the components by irradiating a welding laser beam to a welding zone of the components. A stress detection unit detects stress data that indicate a stress condition of the components held by the component holding unit. A stress correction unit controls irradiation of a correcting laser beam to the welding zone, based on a result of comparison between reference stress data, detected when positions of the components are aligned in proper position before the welding, and post-welding stress data, detected after the welding is performed by the laser irradiation unit, so that the post-welding stress data, obtained after the irradiation of the correcting laser beam, matches with the reference stress data.

摘要翻译： 激光束焊接装置包括保持要被焊接的部件的部件保持单元。 激光照射单元通过将焊接激光束照射到部件的焊接区域来进行部件的焊接。 应力检测单元检测表示由构件保持单元保持的构件的应力状态的应力数据。 应力校正单元基于将检测到的部件的位置在焊接前的正确位置对准的基准应力数据与检测到的焊接后应力数据的比较结果对控制到焊接区域的修正激光束的照射进行控制 在通过激光照射单元执行焊接之后，使得在校正激光束的照射之后获得的后焊接应力数据与参考应力数据相匹配。

公开(公告)号：US20050269731A1

公开(公告)日：2005-12-08

申请号：US10967234

申请日：2004-10-19

申请人： Naohisa Matsushita ,  Toshikazu Furui

发明人： Naohisa Matsushita ,  Toshikazu Furui

IPC分类号： H01L21/301 ,  B29C37/00 ,  B81C1/00

CPC分类号： B81C1/00873

摘要： A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.

摘要翻译： 制造具有诸如MEMS器件的微结构的元件的方法使用其状态随着温度变化而变化的材料。 其表面上具有微结构的片状构件通过粘合片固定到真空吸盘，并且将其状态随温度变化而改变的材料施加到片状构件的表面，然后将材料冷却固化 在片状构件的表面和片状构件被切割成多个元件的同时材料处于固化状态，然后将分离的元件从粘合片上移除。

公开(公告)号：US06552302B2

公开(公告)日：2003-04-22

申请号：US09897382

申请日：2001-07-02

申请人： Naohisa Matsushita

发明人： Naohisa Matsushita

IPC分类号： B23K2600

CPC分类号： G11B5/102 ,  G11B5/6005 ,  G11B21/21

摘要： A method for correcting an outer surface of a magnetic slider mainly made of ceramic to a desired surface shape, wherein a laser beam is applied to an outer face of a work piece (10) to partially melt a ceramic base, the melted part (20) is resolidfied, and the surface shape of the slider is exactly corrected to the desired shape by using shrinkage stress during the resolidification.

摘要翻译： 一种用于将主要由陶瓷制成的磁性滑动器的外表面校正为所需表面形状的方法，其中激光束施加到工件（10）的外表面以部分地熔化陶瓷基体，熔融部分（20 ），并且通过在再凝固期间使用收缩应力将滑块的表面形状精确地校正为期望的形状。

公开(公告)号：US06428385B1

公开(公告)日：2002-08-06

申请号：US09638430

申请日：2000-08-14

申请人： Motoichi Watanuki ,  Naohisa Matsushita

发明人： Motoichi Watanuki ,  Naohisa Matsushita

IPC分类号： B24B4900

CPC分类号： B24B37/048 ,  B24B7/228 ,  B24B49/04 ,  B24B49/10 ,  B24B49/16 ,  G11B5/1871 ,  G11B5/3103 ,  G11B5/3163 ,  G11B5/3166 ,  G11B5/3903

摘要： The grinding machine and the method of grinding are capable of grinding a bar member for a magnetic head with higher grinding accuracy. In the grinding machine, a holding frame holds a bar member and heads a first face of the bar member, which is to be ground, downward. A grinding plate grinds the first face of the bar member. An actuator presses a second face of the bar member held by the holding frame so as to press the first face onto the grinding plate. A resistance monitor monitors a resistance value of a sensing part of an ELG element section of the bar member so as to adjust a strip height of a magnetic head section of the bar member.

摘要翻译： 研磨机和研磨方法能够以更高的研磨精度研磨用于磁头的棒构件。 在研磨机中，保持框架保持杆构件并朝向要被研磨的杆构件的第一面朝下。 研磨板研磨杆构件的第一面。 致动器按压由保持框架保持的杆构件的第二面，以将第一面按压到研磨板上。 电阻监视器监视杆构件的ELG元件部分的感测部分的电阻值，以调节杆构件的磁头部分的带材高度。

公开(公告)号：US20080012185A1

公开(公告)日：2008-01-17

申请号：US11898258

申请日：2007-09-11

申请人： Susumu Iida ,  Naohisa Matsushita ,  Toshikazu Furui

发明人： Susumu Iida ,  Naohisa Matsushita ,  Toshikazu Furui

IPC分类号： B29C35/08

CPC分类号： B29C35/0894 ,  B29C2035/0827 ,  B29C2791/001 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

摘要： Light is irradiated to a light curing resin material within a mold. The light penetrates through the light curing resin material at a position off a mask. The light curing resin material gets cured at the position off the mask. The mold in this manner serves to form the contour of a molded product. On the other hand, the mask partly blocks the light. An uncured section is established in the light curing resin material behind the mask. When the light curing resin material is removed from the uncured section, the uncured section provides a hole, for example. If the mask is finely formed, it is possible to form a fine hole in an easier manner in a shorter time. It is possible to realize the mass production of a molded product having a fine hole.

摘要翻译： 将光照射到模具内的光固化树脂材料上。 该光穿过光固化树脂材料在掩模的一个位置处。 光固化树脂材料在掩模的位置固化。 以这种方式的模具用于形成模制产品的轮廓。 另一方面，掩模部分地遮挡光。 在掩模后面的光固化树脂材料中建立未固化部分。 当光固化树脂材料从未固化部分移除时，未固化部分例如提供孔。 如果掩模精细地形成，则可以在更短的时间内以更容易的方式形成细孔。 可以实现具有细孔的成型体的批量生产。

公开(公告)号：US20060076105A1

公开(公告)日：2006-04-13

申请号：US11245048

申请日：2005-10-07

申请人： Toshikazu Furui ,  Naohisa Matsushita

发明人： Toshikazu Furui ,  Naohisa Matsushita

IPC分类号： C03B33/00 ,  B32B37/00 ,  B32B38/04

CPC分类号： B32B43/003 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50 ,  B32B38/04 ,  B32B2310/0843 ,  B32B2457/14 ,  B81C1/00873 ,  C03B33/07 ,  C03B33/091 ,  H01L21/67092 ,  Y10T83/0304 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0414 ,  Y10T83/0476 ,  Y10T83/0495 ,  Y10T83/97 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/12 ,  Y10T156/1348

摘要： A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

公开(公告)号：US20050115940A1

公开(公告)日：2005-06-02

申请号：US10994635

申请日：2004-11-23

申请人： Naohisa Matsushita ,  Susumu Iida

发明人： Naohisa Matsushita ,  Susumu Iida

IPC分类号： B23K26/00 ,  B23K26/42 ,  G01J1/42 ,  H01S3/00 ,  B23K26/02

CPC分类号： G01J1/4257 ,  B23K26/705

摘要： A laser beam machine and a laser beam machine capable of monitoring the effective energy of a laser beam oscillator, with which an object to be machined is irradiated, and the state of oscillation without affecting the properties of a laser beam, is disclosed. A laser beam machine comprises: a laser beam oscillator; a laser beam transmission path; a collimator lens; a machining condenser lens; at least one optical detection sensor provided along the laser beam transmission path; and an arithmetic control section for receiving the output of the optical detection sensor and performing a predetermined process to obtain the characteristic of a laser beam.

摘要翻译： 公开了一种激光束机和能够监测激光束振荡器的有效能量的激光束机，激光束振荡器与被加工物体被照射，并且振荡状态不影响激光束的特性。 激光束机包括：激光束振荡器; 激光束传输路径; 准直透镜; 加工聚光透镜; 沿着激光束传输路径设置的至少一个光学检测传感器; 以及用于接收光学检测传感器的输出并执行预定处理以获得激光束的特性的算术控制部分。