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公开(公告)号：US06806723B2
公开(公告)日：2004-10-19
申请号：US10369705
申请日：2003-02-21
申请人： Shigeyuki Maruyama , Keisuke Fukuda , Naoyuki Watanabe , Takumi Kumatabara , Naohisa Matsushita , Masayuki Imakado , Kyohei Tamaki , Hiroshi Nozawa
发明人： Shigeyuki Maruyama , Keisuke Fukuda , Naoyuki Watanabe , Takumi Kumatabara , Naohisa Matsushita , Masayuki Imakado , Kyohei Tamaki , Hiroshi Nozawa
IPC分类号： G01R3102
CPC分类号： G01R1/0675 , G01R1/06733 , G01R1/07342 , G01R3/00
摘要： Contact electrodes having a predetermined shape are formed by irradiating a laser beam onto the contact electrodes that are formed of a conductive material. The laser beam can be irradiated, after joining an end of each contact electrode opposite to a contact end to a contact board, so as to deform the contact electrode so that the contact end is located at a predetermined position. The laser beam may be irradiated while heating or cooling a portion of the contact electrode opposite to a portion onto which the laser beam is irradiated.
摘要翻译： 通过将激光照射到由导电材料形成的接触电极上而形成具有预定形状的接触电极。 在将与接触端相对的每个接触电极的端部接合到接触板之后，可以照射激光束，以使接触电极变形，使得接触端位于预定位置。 可以在加热或冷却接触电极的与照射激光束的部分相对的部分的同时照射激光束。
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公开(公告)号：US20080136433A1
公开(公告)日：2008-06-12
申请号：US11979305
申请日：2007-11-01
CPC分类号： G01R1/0483 , G01R1/0441
摘要： A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
摘要翻译： 公开了一种被配置为电连接到电子部件的端子的接触器。 连接器包括与电子部件的端子接触的多个接触电极和各自由导电性弹性体构成的多个弹性电极。 弹性电极产生用于将接触电极压靠在电子部件的端子上的按压力。 接触电极可与弹性电极分离。
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公开(公告)号：US07309996B2
公开(公告)日：2007-12-18
申请号：US10854172
申请日：2004-05-27
IPC分类号： G01R31/02
CPC分类号： G01R1/0483 , G01R1/0441
摘要： A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
摘要翻译： 公开了一种被配置为电连接到电子部件的端子的接触器。 连接器包括与电子部件的端子接触的多个接触电极和各自由导电性弹性体构成的多个弹性电极。 弹性电极产生用于将接触电极压靠在电子部件的端子上的按压力。 接触电极可与弹性电极分离。
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公开(公告)号：US07518388B2
公开(公告)日：2009-04-14
申请号：US11979305
申请日：2007-11-01
CPC分类号： G01R1/0483 , G01R1/0441
摘要： A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
摘要翻译： 公开了一种被配置为电连接到电子部件的端子的接触器。 连接器包括与电子部件的端子接触的多个接触电极和各自由导电性弹性体构成的多个弹性电极。 弹性电极产生用于将接触电极压靠在电子部件的端子上的按压力。 接触电极可与弹性电极分离。
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5.发明授权Semiconductor device protection cover, and semiconductor device unit including the cover 有权半导体器件保护盖和包括盖的半导体器件单元公开(公告)号：US07382046B2
公开(公告)日：2008-06-03
申请号：US10800630
申请日：2004-03-16
IPC分类号： H01L23/12
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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公开(公告)号：US20120005875A1
公开(公告)日：2012-01-12
申请号：US13240508
申请日：2011-09-22
IPC分类号： B23P11/00
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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7.发明授权公开(公告)号：US07807481B2
公开(公告)日：2010-10-05
申请号：US12081961
申请日：2008-04-24
IPC分类号： H01L21/66
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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公开(公告)号：US08164181B2
公开(公告)日：2012-04-24
申请号：US12872131
申请日：2010-08-31
IPC分类号： H01L23/12
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种半导体器件封装结构，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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9.发明申请公开(公告)号：US20080203558A1
公开(公告)日：2008-08-28
申请号：US12081961
申请日：2008-04-24
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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公开(公告)号：US08268670B2
公开(公告)日：2012-09-18
申请号：US13240508
申请日：2011-09-22
IPC分类号： H01L21/44
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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