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    IC socket with attached electronic component
    2.
    发明授权
    IC socket with attached electronic component 有权
    IC插座带有电子元件

    公开(公告)号：US08051554B2

    公开(公告)日：2011-11-08

    申请号：US12104038

    申请日：2008-04-16

    申请人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    发明人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    IPC分类号： B23P19/00 ,  H01L21/44

    CPC分类号： B25B27/14 ,  H05K7/1061 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53943

    摘要： An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.

    摘要翻译： 一种IC插座，其中电子部件附接到IC插座的预定位置，IC插座包括固定部分，该固定部分包括接触销，当电子部件的位置与电子部件的位置对准时，该接触销连接到电子部件的端子 所述IC插座的预定位置使用电子部件安装工具，所述接触销包括在所述固定部的上表面上的一对端部; 可移动部分，当可移动部分被向下推动时，可移动到固定部分，以向固定部分的接触销施加力，以将接触销的一对端部彼此分离; 以及形成在可动部上并与电子部件安装工具接合的标准部分，当电子部件的位置与IC插座的预定位置对准时，将电子部件安装工具的位置对准标准部件 使用电子连接工具，标准部件具有基本上不依赖于电子部件的外部形状的形状。

    Probe card and method of testing wafer having a plurality of semiconductor devices
    5.
    发明授权
    Probe card and method of testing wafer having a plurality of semiconductor devices 有权
    探针卡和测试具有多个半导体器件的晶片的方法

    公开(公告)号：US06563330B1

    公开(公告)日：2003-05-13

    申请号：US09540870

    申请日：2000-03-31

    申请人： Shigeyuki Maruyama ,  Daisuke Koizumi ,  Naoyuki Watanabe ,  Yoshito Konno ,  Eiji Yoshida ,  Toshiyuki Honda ,  Toshimi Kawahara ,  Kenichi Nagashige

    发明人： Shigeyuki Maruyama ,  Daisuke Koizumi ,  Naoyuki Watanabe ,  Yoshito Konno ,  Eiji Yoshida ,  Toshiyuki Honda ,  Toshimi Kawahara ,  Kenichi Nagashige

    IPC分类号： G01R3102

    CPC分类号： G01R31/2886 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/11 ,  H05K3/326

    摘要： A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board. Displacements of the internal terminal resulting from the temperature load applied during testing of the wafer are compensated by the level transitioning portion of the first wiring. Unevenness involved with the contact between the contact electrodes on the probe card and the electrodes on the chips are compensated by the contact electrodes and/or elastic material according to the present invention. An electrode pitch of the contact electrodes is expanded by the first wiring.

    摘要翻译： 一种用于测试形成多个半导体芯片的晶片的探针卡，所述探针卡包括基板和多层基板。 探针卡还可以包括柔性基底。 在其中一个芯片上与电极相对设置的接触电极设置在柔性基板的上方或下方，或者可以设置在多层基板上的弹性材料上。 第一布线具有连接到接触电极的第一部分，从第一部分的电平延伸到较低电平的多层基板的电平转换部分，以及连接到电平转换部分的端部处的连接端子 多层基板上的内部端子。 多层基板中的第二布线将内部端子连接到多层基板的外围的外部端子。 电路板上的第三个接线将多层基板上的外部端子连接到电路板上的外部连接端子。 在晶片测试期间施加的温度负载导致的内部端子的位移由第一布线的电平转换部分补偿。 涉及探针卡上的接触电极和芯片上的电极之间的接触的不均匀性由根据本发明的接触电极和/或弹性材料补偿。 接触电极的电极间距由第一布线扩大。

    METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ATTACHING TOOL
    6.
    发明申请
    METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ATTACHING TOOL 失效
    连接电子元件和电子元器件连接工具的方法

    公开(公告)号：US20120005883A1

    公开(公告)日：2012-01-12

    申请号：US13242647

    申请日：2011-09-23

    申请人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    发明人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    IPC分类号： B23P19/00

    CPC分类号： B25B27/14 ,  H05K7/1061 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53943

    摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

    摘要翻译： 准备适用于半导体器件外形的电子部件安装工具。 电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。 电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。 然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。 准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。

    Electronic component attaching tool
    10.
    发明授权
    Electronic component attaching tool 有权
    电子元件连接工具

    公开(公告)号：US07430798B2

    公开(公告)日：2008-10-07

    申请号：US11126246

    申请日：2005-05-11

    申请人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    发明人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    IPC分类号： B23P19/00 ,  H01L21/44

    CPC分类号： B25B27/14 ,  H05K7/1061 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53943

    摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

    摘要翻译： 准备适用于半导体器件外形的电子部件安装工具。 电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。 电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。 然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。 准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。