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公开(公告)号：US09505084B2
公开(公告)日：2016-11-29
申请号：US14345031
申请日：2012-07-10
IPC分类号： B23K35/12 , B23K20/233 , B23K20/02 , B23K20/16 , B23K20/24
CPC分类号： B23K20/2333 , B23K20/026 , B23K20/16 , B23K20/2336 , B23K20/24 , B23K26/037 , B23K26/211 , B23K26/244 , B23K2101/18 , B23K2103/10 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , Y10T403/479 , Y10T428/12493 , H01L2924/00014 , H01L2924/00
摘要： In joining members to be joined (1, 1) by heating the members to be joined (1, 1) that are mated with intervening an insert (2) while applying opposing loads to the members to be joined (1, 1), so as to allow eutectic reaction to occur between the members to be joined (1, 1) and the insert (2) to discharge a eutectic melt from a joining plane along with an oxide film (1a) of the members to be joined, the members to be joined (1) are brought into contact with the insert (2) so that the oxide film (1a) is broken by a stress concentrating means previously provided at least one of joining portions breaks to produce a starting point of the eutectic reaction.
摘要翻译： 在通过加热与介入插入件（2）配合的构件（1,1）来连接要连接的构件（1,1），同时向待连接构件（1,1）施加相反的载荷，因此 为了允许待连接的构件（1,1）和插入件（2）之间发生共晶反应，以便与要连接的构件的氧化膜（1a）一起从接合平面排出共晶熔体，构件 （1）与插入件（2）接触，使得氧化膜（1a）被预先设置有至少一个接合部分断裂的应力集中装置断裂以产生共晶反应的起始点。
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公开(公告)号：US20140348576A1
公开(公告)日：2014-11-27
申请号：US14345031
申请日：2012-07-10
IPC分类号： B23K20/233 , B23K20/24
CPC分类号： B23K20/2333 , B23K20/026 , B23K20/16 , B23K20/2336 , B23K20/24 , B23K26/037 , B23K26/211 , B23K26/244 , B23K2101/18 , B23K2103/10 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , Y10T403/479 , Y10T428/12493 , H01L2924/00014 , H01L2924/00
摘要： In joining members to be joined (1, 1) by heating the members to be joined (1, 1) that are mated with intervening an insert (2) while applying opposing loads to the members to be joined (1, 1), so as to allow eutectic reaction to occur between the members to be joined (1, 1) and the insert (2) to discharge a eutectic melt from a joining plane along with an oxide film (1a) of the members to be joined, the members to be joined (1) are brought into contact with the insert (2) so that the oxide film (1a) is broken by a stress concentrating means previously provided at least one of joining portions breaks to produce a starting point of the eutectic reaction.
摘要翻译： 在通过加热与介入插入件（2）配合的构件（1,1）来连接要连接的构件（1,1），同时向待连接构件（1,1）施加相反的载荷，因此 为了允许待连接的构件（1,1）和插入件（2）之间发生共晶反应，以便与要连接的构件的氧化膜（1a）一起从接合平面排出共晶熔体，构件 （1）与插入件（2）接触，使得氧化膜（1a）被预先设置有至少一个接合部分断裂的应力集中装置断裂以产生共晶反应的起始点。
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公开(公告)号：US10556292B2
公开(公告)日：2020-02-11
申请号：US13819390
申请日：2011-08-30
申请人： Toshikazu Nanbu , Kenji Miyamoto , Masayuki Inoue , Chika Yamamoto , Yoshitaka Uehara , Akio Hirose
发明人： Toshikazu Nanbu , Kenji Miyamoto , Masayuki Inoue , Chika Yamamoto , Yoshitaka Uehara , Akio Hirose
IPC分类号： B23K20/00 , B23K35/28 , B23K35/00 , B23K20/16 , B23K20/233 , B23K20/02 , B23K35/26 , B23K103/10
摘要： An inexpensive bonding method is provided to bond materials constituted of an aluminum-based metal to each other at a low temperature and a low pressure while inhibiting deformation, without requiring the use of a flux and minimizing the influence on the base materials and the periphery. Also provided are various bonded parts obtained by the bonding method. An insert material comprising Zn as an element that undergoes a eutectic reaction with Al is interposed between two materials constituted of an aluminum-based metal. The two materials are heated, while being pressed against each other, to a temperature at which the eutectic reaction takes place, thereby generating, at the bonding interface between the two materials, a melt due to the eutectic reaction with some of the Al contained in the base materials and discharging the Al oxide films from the bonding interface together with the melt. Thus, the two materials are bonded.
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公开(公告)号：US20140030634A1
公开(公告)日：2014-01-30
申请号：US13819390
申请日：2011-08-30
申请人： Toshikazu Nanbu , Kenji Miyamoto , Masayuki Inoue , Chika Yamamoto , Yoshitaka Uehara , Akio Hirose
发明人： Toshikazu Nanbu , Kenji Miyamoto , Masayuki Inoue , Chika Yamamoto , Yoshitaka Uehara , Akio Hirose
IPC分类号： B23K20/00
摘要： An inexpensive bonding method is provided to bond materials constituted of an aluminum-based metal to each other at a low temperature and a low pressure while inhibiting deformation, without requiring the use of a flux and minimizing the influence on the base materials and the periphery. Also provided are various bonded parts obtained by the bonding method. An insert material comprising Zn as an element that undergoes a eutectic reaction with Al is interposed between two materials constituted of an aluminum-based metal. The two materials are heated, while being pressed against each other, to a temperature at which the eutectic reaction takes place, thereby generating, at the bonding interface between the two materials, a melt due to the eutectic reaction with some of the Al contained in the base materials and discharging the Al oxide films from the bonding interface together with the melt. Thus, the two materials are bonded.
摘要翻译： 提供廉价的接合方法，以便在不需要使用助焊剂并且最小化对基材和周边的影响的同时，在低温和低压下将由铝基金属构成的材料彼此粘合，同时抑制变形。 还提供了通过接合方法获得的各种粘合部件。 包含Zn作为与Al发生共晶反应的元素的插入材料插入由铝基金属构成的两种材料之间。 将这两种材料在彼此挤压的同时加热到发生共晶反应的温度，从而在两种材料之间的结合界面处产生熔体，这是由于与包含在其中的一些Al的共晶反应 基材并与熔融物一起从接合界面排出Al氧化物膜。 因此，两种材料结合。
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公开(公告)号：US20130323531A1
公开(公告)日：2013-12-05
申请号：US13993889
申请日：2011-12-05
CPC分类号： B32B7/12 , B23K20/021 , B23K20/023 , B23K2103/10 , B23K2103/15 , B23K2103/18 , B23K2103/20 , B32B15/012 , B32B15/016 , B32B15/017 , Y10T428/12708 , Y10T428/12722 , Y10T428/12729 , Y10T428/12736 , Y10T428/12757 , Y10T428/12764
摘要： A bonded body of electrically conductive materials including a bonding interface structure in which paired bonded members (10, 20) made respectively of electrically conductive materials are surface-bonded to each other. The bonding interface structure has at least: a diffusion bonding region in which the electrically conductive materials are mutually diffused; and a plastic flow bonding region which has a pressure bonded and recrystallized structure through plastic flow of the electrically conductive materials.
摘要翻译： 导电材料的接合体包括接合界面结构，其中分别由导电材料制成的成对接合构件（10,20）彼此表面结合。 接合界面结构至少具有：导电材料相互扩散的扩散接合区域; 以及通过导电材料的塑性流动而具有压接和再结晶结构的塑性流动粘合区域。
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6.发明申请公开(公告)号：US20080026247A1
公开(公告)日：2008-01-31
申请号：US11781555
申请日：2007-07-23
申请人： Shigeyuki Nakagawa , Minoru Kasukawa , Kenji Miyamoto , Hiroshi Sakurai , Chika Yamamoto , Takashi Miyamoto , Akira Fukushima
发明人： Shigeyuki Nakagawa , Minoru Kasukawa , Kenji Miyamoto , Hiroshi Sakurai , Chika Yamamoto , Takashi Miyamoto , Akira Fukushima
CPC分类号： B23K11/20 , B23K11/115 , B23K33/008 , B23K2103/20 , Y10T428/12493 , Y10T428/12729 , Y10T428/12736 , Y10T428/12778
摘要： A method of bonding dissimilar metals, a bonding structure formed by such a method and a bonding apparatus for performing such a method. The resulting bond is capable of preventing corrosion (e.g., electric corrosion) resulting from contact of the dissimilar metals and obtains a dissimilar material joint exhibiting anti-corrosive property and bonding strength at low costs. The method includes overlapping two materials made from dissimilar metals having a seal material interposed therebetween and discharging the seal material from a bonding interface and bonding the two materials in direct contact with each other.
摘要翻译： 一种接合不同金属的方法，通过这种方法形成的接合结构和用于执行这种方法的接合装置。 所得到的结合能够防止由异种金属的接触引起的腐蚀（例如电腐蚀），并以低成本获得具有抗腐蚀性和接合强度的异种材料接合体。 该方法包括将由异种金属制成的两种材料重叠在一起，其间具有密封材料，并将密封材料从接合界面排出，并将两种材料彼此直接接触。
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7.发明授权公开(公告)号：US08476549B2
公开(公告)日：2013-07-02
申请号：US11781555
申请日：2007-07-23
申请人： Shigeyuki Nakagawa , Minoru Kasukawa , Kenji Miyamoto , Hiroshi Sakurai , Chika Yamamoto , Takashi Miyamoto , Akira Fukushima
发明人： Shigeyuki Nakagawa , Minoru Kasukawa , Kenji Miyamoto , Hiroshi Sakurai , Chika Yamamoto , Takashi Miyamoto , Akira Fukushima
CPC分类号： B23K11/20 , B23K11/115 , B23K33/008 , B23K2103/20 , Y10T428/12493 , Y10T428/12729 , Y10T428/12736 , Y10T428/12778
摘要： A method of bonding dissimilar metals, a bonding structure formed by such a method and a bonding apparatus for performing such a method. The resulting bond is capable of preventing corrosion (e.g., electric corrosion) resulting from contact of the dissimilar metals and obtains a dissimilar material joint exhibiting anti-corrosive property and bonding strength at low costs. The method includes overlapping two materials made from dissimilar metals having a seal material interposed therebetween and discharging the seal material from a bonding interface and bonding the two materials in direct contact with each other.
摘要翻译： 一种接合不同金属的方法，通过这种方法形成的接合结构和用于执行这种方法的接合装置。 所得到的结合能够防止由异种金属的接触引起的腐蚀（例如电腐蚀），并以低成本获得具有抗腐蚀性和接合强度的异种材料接合体。 该方法包括将由异种金属制成的两种材料重叠在一起，其间具有密封材料，并将密封材料从接合界面排出，并将两种材料彼此直接接触。
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