Split-gate memory cells and fabrication methods thereof
    3.
    发明申请
    Split-gate memory cells and fabrication methods thereof 有权
    分离栅存储单元及其制造方法

    公开(公告)号:US20080121975A1

    公开(公告)日:2008-05-29

    申请号:US11592290

    申请日:2006-11-03

    IPC分类号: H01L29/788

    CPC分类号: H01L27/115 H01L27/11521

    摘要: Split-gate memory cells and fabrication methods thereof. A split-gate memory cell comprises a plurality of isolation regions formed on a semiconductor substrate along a first direction, between two adjacent isolation regions defining an active region having a pair of drains and a source region. A pair of floating gates are disposed on the active regions and self-aligned with the isolation regions, wherein a top level of the floating gate is equal to a top level of the isolation regions. A pair of control gates are self-aligned with the floating gates and disposed on the floating gates along a second direction. A source line is disposed between the pair of control gates along the second direction. A pair of select gates are disposed on the outer sidewalls of the pair of control gates along the second direction.

    摘要翻译: 分离栅存储单元及其制造方法。 分离栅极存储单元包括沿着第一方向形成在半导体衬底上的多个隔离区域,在限定具有一对漏极和源极区域的有源区域的两个相邻隔离区域之间。 一对浮置栅极设置在有源区上并与隔离区自对准,其中浮置栅极的顶层等于隔离区的顶层。 一对控制栅极与浮动栅极自对准并沿着第二方向设置在浮动栅极上。 源极线沿第二方向设置在该对控制栅极之间。 一对选择栅极沿着第二方向设置在该对控制栅极的外侧壁上。

    Split-gate memory cells and fabrication methods thereof
    4.
    发明申请
    Split-gate memory cells and fabrication methods thereof 失效
    分离栅存储单元及其制造方法

    公开(公告)号:US20080105917A1

    公开(公告)日:2008-05-08

    申请号:US11785382

    申请日:2007-04-17

    IPC分类号: H01L29/788 H01L27/115

    CPC分类号: H01L27/115 H01L27/11521

    摘要: Split-gate memory cells and fabrication methods thereof. A split-gate memory cell comprises a plurality of isolation regions formed on a semiconductor substrate along a first direction, between two adjacent isolation regions defining an active region having a pair of drains and a source region. A top level of the active regions is lower than a top level of the isolation regions. A pair of floating gates is disposed on the active regions and aligned with the isolation regions, wherein a passivation layer is disposed on the floating gate to prevent thinning from CMP. A pair of control gates is self-aligned with the floating gates and disposed on the floating gates along a second direction. A source line is disposed between the pair of control gates along the second direction. A pair of select gates is disposed on the outer sidewalls of the pair of control gates along the second direction.

    摘要翻译: 分离栅存储单元及其制造方法。 分离栅极存储单元包括沿着第一方向形成在半导体衬底上的多个隔离区域,两个相邻的隔离区域限定具有一对漏极和源极区域的有源区域。 活动区域的顶层低于隔离区域的顶层。 一对浮置栅极设置在有源区上并与隔离区对准,其中钝化层设置在浮栅上以防止CMP变薄。 一对控制栅极与浮动栅极自对准,并沿第二方向设置在浮动栅极上。 源极线沿第二方向设置在该对控制栅极之间。 一对选择栅极沿着第二方向设置在该对控制栅极的外侧壁上。

    Split-gate memory cells and fabrication methods thereof
    5.
    发明授权
    Split-gate memory cells and fabrication methods thereof 失效
    分离栅存储单元及其制造方法

    公开(公告)号:US07667261B2

    公开(公告)日:2010-02-23

    申请号:US11785382

    申请日:2007-04-17

    IPC分类号: H01L29/788

    CPC分类号: H01L27/115 H01L27/11521

    摘要: Split-gate memory cells and fabrication methods thereof. A split-gate memory cell comprises a plurality of isolation regions formed on a semiconductor substrate along a first direction, between two adjacent isolation regions defining an active region having a pair of drains and a source region. A top level of the active regions is lower than a top level of the isolation regions. A pair of floating gates is disposed on the active regions and aligned with the isolation regions, wherein a passivation layer is disposed on the floating gate to prevent thinning from CMP. A pair of control gates is self-aligned with the floating gates and disposed on the floating gates along a second direction. A source line is disposed between the pair of control gates along the second direction. A pair of select gates is disposed on the outer sidewalls of the pair of control gates along the second direction.

    摘要翻译: 分离栅存储单元及其制造方法。 分离栅存储器单元包括沿着第一方向在半导体衬底上形成的多个隔离区域,在限定具有一对漏极和源极区域的有源区域的两个相邻隔离区域之间。 活动区域的顶层低于隔离区域的顶层。 一对浮置栅极设置在有源区上并与隔离区对准,其中钝化层设置在浮栅上以防止CMP变薄。 一对控制栅极与浮动栅极自对准,并沿第二方向设置在浮动栅极上。 源极线沿第二方向设置在该对控制栅极之间。 一对选择栅极沿着第二方向设置在该对控制栅极的外侧壁上。

    Split-gate memory cells and fabrication methods thereof
    6.
    发明授权
    Split-gate memory cells and fabrication methods thereof 有权
    分离栅存储单元及其制造方法

    公开(公告)号:US07652318B2

    公开(公告)日:2010-01-26

    申请号:US11592290

    申请日:2006-11-03

    IPC分类号: H01L29/788

    CPC分类号: H01L27/115 H01L27/11521

    摘要: Split-gate memory cells and fabrication methods thereof. A split-gate memory cell comprises a plurality of isolation regions formed on a semiconductor substrate along a first direction, between two adjacent isolation regions defining an active region having a pair of drains and a source region. A pair of floating gates are disposed on the active regions and self-aligned with the isolation regions, wherein a top level of the floating gate is equal to a top level of the isolation regions. A pair of control gates are self-aligned with the floating gates and disposed on the floating gates along a second direction. A source line is disposed between the pair of control gates along the second direction. A pair of select gates are disposed on the outer sidewalls of the pair of control gates along the second direction.

    摘要翻译: 分离栅存储单元及其制造方法。 分离栅极存储单元包括沿着第一方向形成在半导体衬底上的多个隔离区域,两个相邻的隔离区域限定具有一对漏极和源极区域的有源区域。 一对浮置栅极设置在有源区上并与隔离区自对准,其中浮置栅极的顶层等于隔离区的顶层。 一对控制栅极与浮动栅极自对准并沿着第二方向设置在浮动栅极上。 源极线沿第二方向设置在该对控制栅极之间。 一对选择栅极沿着第二方向设置在该对控制栅极的外侧壁上。

    CMOS IMAGE SENSOR AND METHOD FOR MANUFACTURING SAME
    7.
    发明申请
    CMOS IMAGE SENSOR AND METHOD FOR MANUFACTURING SAME 审中-公开
    CMOS图像传感器及其制造方法

    公开(公告)号:US20090189233A1

    公开(公告)日:2009-07-30

    申请号:US12020149

    申请日:2008-01-25

    IPC分类号: H01L31/0232 H01L31/18

    摘要: An optical image sensor is fabricated by forming a pixel array and a peripheral region surrounding the pixel array on a semiconductor substrate, the peripheral region containing peripheral circuitry. An inter-level-dielectric layer is formed over the substrate and a plurality of interconnect wiring layers are formed over the inter-level-dielectric layer. Each interconnect wiring layer includes interconnecting metal features and a layer of inter-level-dielectric material covering the interconnecting metal features. The plurality of interconnect wiring layers are provided in a manner that there are N levels of wiring layers in the peripheral region and 1 to (N−1) levels of wiring layers over the pixel array. An etch-stop layer is formed over the top-most level interconnecting metal features in the peripheral region.

    摘要翻译: 通过在半导体衬底上形成围绕像素阵列的像素阵列和外围区域来制造光学图像传感器,该外围区域包含外围电路。 层间电介质层形成在衬底之上,并且在层间电介质层之上形成多个互连布线层。 每个互连布线层包括互连金属特征和覆盖互连金属特征的层间电介质材料层。 多个互连布线层的设置方式是在像素阵列的周边区域中有N层布线层和布线层的1层(N-1)层。 在外围区域中最顶层的互连金属特征上形成蚀刻停止层。

    Method of forming MIM capacitor electrodes
    8.
    发明申请
    Method of forming MIM capacitor electrodes 有权
    形成MIM电容器电极的方法

    公开(公告)号:US20050215004A1

    公开(公告)日:2005-09-29

    申请号:US10811657

    申请日:2004-03-29

    摘要: A novel method for forming electrodes in the fabrication of an MIM (metal-insulator-metal) capacitor, is disclosed. The method improves MIM capacitor performance by preventing plasma-induced damage to a dielectric layer during deposition of a top electrode on the dielectric layer, as well as by reducing or preventing the formation of an interfacial layer between the dielectric layer and the electrode or electrodes, in fabrication of the MIM capacitor. The method typically includes the patterning of crown-type capacitor openings in a substrate; depositing a bottom electrode in each of the crown openings; subjecting the bottom electrode to a rapid thermal processing (RTP) or furnace anneal step; depositing a dielectric layer on the annealed bottom electrode; depositing a top electrode on the dielectric layer using a plasma-free CVD (chemical vapor deposition) or ALD (atomic layer deposition) process; and patterning the top electrode of each MIM capacitor.

    摘要翻译: 公开了一种用于在MIM(金属 - 绝缘体 - 金属)电容器的制造中形成电极的新颖方法。 该方法通过在电介质层上的顶部电极沉积期间防止等离子体对电介质层的损伤,以及通过减少或防止介电层和电极或电极之间的界面层的形成来改善MIM电容器性能, 在MIM电容器的制造中。 该方法通常包括在衬底中图案化冠状电容器开口; 在每个冠状开口中沉积底部电极; 对底部电极进行快速热处理(RTP)或炉退火步骤; 在退火的底部电极上沉​​积介电层; 使用无等离子体CVD(化学气相沉积)或ALD(原子层沉积)工艺在电介质层上沉积顶部电极; 并对每个MIM电容器的顶部电极进行构图。

    HDP gap-filling process for structures with extra step at side-wall
    9.
    发明授权
    HDP gap-filling process for structures with extra step at side-wall 失效
    HDP间隙填充过程,用于侧壁额外加工的结构

    公开(公告)号:US06780731B1

    公开(公告)日:2004-08-24

    申请号:US10225803

    申请日:2002-08-22

    IPC分类号: H01L2176

    CPC分类号: H01L21/76224

    摘要: A multi-step HDP deposition and sputtering process for void-free filling of high aspect ratio trenches having stepped cross-sectional profiles. The method is particularly applicable to filling trenches formed in triply layered substrates comprising a silicon first layer, an oxide second layer and a nitride third layer, wherein the nitride layer is pulled back from the edge of the trench opening and forms a step. The method allows the void-free filling of such a trench without dam aging the nitride layer in the process. Briefly, the essence of the method is the formation of deposited layers on the side walls of the trench wherein the first layer is deposited with a high deposition to sputtering ratio and low bias power to form a layer with an overhang at the upper surface of the trench. This deposition if followed by a sputtering process to form an enlarged opening in that overhang. This approach is found to prevent the formation of an overhang at the position of the step, whereat it would cause progressive restriction of the trench throat and void formation.

    摘要翻译: 一种多步骤HDP沉积和溅射方法,用于无缝填充具有阶梯形横截面轮廓的高纵横比沟槽。 该方法特别适用于填充形成在包括硅第一层,氧化物第二层和氮化物第三层的三层分层衬底中的沟槽,其中氮化物层从沟槽开口的边缘被拉回并形成一个台阶。 该方法允许这种沟槽的无空隙填充,而不会使该过程中的氮化物层老化。 简而言之,该方法的本质是在沟槽的侧壁上形成沉积层,其中第一层以高沉积至溅射比沉积,并且具有低偏压能力以在上表面形成具有突出端的层 沟。 该沉积如果随后是溅射工艺以在该突出端形成扩大的开口。 发现这种方法可以防止在台阶位置形成突出端,从而导致沟槽喉部和空隙形成的逐渐限制。

    METHOD AND APPARATUS OF HOLDING A DEVICE
    10.
    发明申请
    METHOD AND APPARATUS OF HOLDING A DEVICE 有权
    控制装置的方法和装置

    公开(公告)号:US20100248446A1

    公开(公告)日:2010-09-30

    申请号:US12414861

    申请日:2009-03-31

    IPC分类号: H01L21/30 B25B11/00

    CPC分类号: H01L21/6838 H01L21/304

    摘要: Provided is an apparatus and a method of holding a device. The apparatus includes a wafer chuck having first and second holes that extend therethrough, and a pressure control structure that can independently and selectively vary a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure. The method includes providing a wafer chuck having first and second holes that extend therethrough, and independently and selectively varying a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure.

    摘要翻译: 提供了一种保持装置的装置和方法。 该装置包括具有穿过其延伸的第一和第二孔的晶片卡盘,以及压力控制结构,其能够在高于和低于环境压力的压力之间独立地和选择性地改变在第一和第二孔中的每一个中的流体压力。 该方法包括提供具有延伸穿过其中的第一和第二孔的晶片卡盘,并且在高于和低于环境压力的压力之间独立地和选择性地改变在每个第一和第二孔中的流体压力。