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28 条记录 (耗时 0.071 秒)

    Integrated cooling system for electronic devices
    1.
    发明授权
    Integrated cooling system for electronic devices 有权
    电子设备集成冷却系统

    公开(公告)号：US07215547B2

    公开(公告)日：2007-05-08

    申请号：US10919168

    申请日：2004-08-16

    申请人： Shih-Chia Chang ,  Bruce A. Myers ,  Darrel E. Peugh ,  Carl W. Berlin ,  M. Ray Fairchild

    发明人： Shih-Chia Chang ,  Bruce A. Myers ,  Darrel E. Peugh ,  Carl W. Berlin ,  M. Ray Fairchild

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

    摘要： The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.

    摘要翻译： 本发明提供一种用于制造电子组件和具有用于散热的集成冷却系统的电子组件的方法。 电子组件包括基座; 以及至少一个附接到基座的电气部件。 基座限定了一个集成的冷却系统，其具有横跨在基座内的流体通道和与流体通道热连通的至少一个热交换器。 集成冷却系统还可以包括附接到基座的泵，用于引导流体在流体通道内的流动，以及与流体通道流体连通的端口，用于从外部源接收流体。

    Method for Lowering the Sublimation Point of a Small-Molecular Organic Semiconducting Material
    2.
    发明申请
    Method for Lowering the Sublimation Point of a Small-Molecular Organic Semiconducting Material 审中-公开
    降低小分子有机半导体材料升华点的方法

    公开(公告)号：US20100200391A1

    公开(公告)日：2010-08-12

    申请号：US12503320

    申请日：2009-07-15

    申请人： Tu Lee ,  Shih-Chia Chang

    发明人： Tu Lee ,  Shih-Chia Chang

    IPC分类号： B01J19/10

    CPC分类号： B01J19/10 ,  H01L51/001 ,  H01L51/0081

    摘要： Disclosed herein is a method of lowering the sublimation point of a small-molecular organic semiconducting material. The method comprises the steps of forming a suspension solution of the small-molecular organic semiconducting material in a polar solvent, and sonicating the suspension solution with an ultrasound wave under low temperature.

    摘要翻译： 本文公开了降低小分子有机半导体材料的升华点的方法。 该方法包括以下步骤：在极性溶剂中形成小分子有机半导体材料的悬浮溶液，并在低温下用超声波超声处理悬浮溶液。

    STACKED THERMOCOUPLE STRUCTURE AND SENSING DEVICES FORMED THEREWITH
    4.
    发明申请
    STACKED THERMOCOUPLE STRUCTURE AND SENSING DEVICES FORMED THEREWITH 审中-公开
    堆积的热电偶结构和传感装置

    公开(公告)号：US20050016576A1

    公开(公告)日：2005-01-27

    申请号：US10710250

    申请日：2004-06-29

    申请人： Qin Jiang ,  Han Lee ,  James Logsdon ,  Dan Chilcott ,  David Lambert ,  Shih-Chia Chang

    发明人： Qin Jiang ,  Han Lee ,  James Logsdon ,  Dan Chilcott ,  David Lambert ,  Shih-Chia Chang

    IPC分类号： G01K7/02 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L37/00

    CPC分类号： G01K7/021

    摘要： A thermocouple structure capable of providing a more compact thermopile-based thermal sensor. The thermocouple structure has a stacked configuration that includes a plurality of first conductors on a surface, a dielectric layer on each of the first conductors, and a plurality of second conductors on the dielectric layer and formed of a different material than the first conductors. Each first conductor has first and second ends, and each second conductor has a first end overlying and contacting the first end of one of the first conductors, and a second end overlying but separated from the second end of the first conductor by the dielectric layer. A plurality of third conductors electrically interconnect one of the second ends of the second conductors with one of the second ends of the first conductors. Each third conductors is thicker than the second conductors to promote the robustness of the connection.

    摘要翻译： 能够提供更紧凑的基于热电堆的热传感器的热电偶结构。 热电偶结构具有层叠结构，其包括表面上的多个第一导体，每个第一导体上的电介质层和介电层上的多个第二导体，并且由不同于第一导体的材料形成。 每个第一导体具有第一端和第二端，并且每个第二导体具有覆盖并接触第一导体中的一个的第一端的第一端，以及通过介电层覆盖但与第一导体的第二端分离的第二端。 多个第三导体将第二导体的第二端中的一个与第一导体的第二端之一电互连。 每个第三导体比第二导体厚，以促进连接的鲁棒性。

    Semiconductor gas sensor having thermally isolated site
    5.
    发明授权
    Semiconductor gas sensor having thermally isolated site 失效
    具有热隔离位置的半导体气体传感器

    公开(公告)号：US4706493A

    公开(公告)日：1987-11-17

    申请号：US808546

    申请日：1985-12-13

    申请人： Shih-Chia Chang ,  David B. Hicks

    发明人： Shih-Chia Chang ,  David B. Hicks

    IPC分类号： G01N27/12 ,  G01N27/06

    CPC分类号： G01N27/12

    摘要： A preferred semiconductor gas sensor of this invention features a gas interaction site comprising a gas sensitive semiconductor thin film and means for heating the film to an operative temperature. The thin film and heating means are carried upon a region of a substrate that is etched opposite the site to reduce the thickness of the region and thereby reduce heat flow from the region into a surrounding region.

    摘要翻译： 本发明优选的半导体气体传感器具有包括气体敏感半导体薄膜的气体相互作用位置和用于将膜加热到操作温度的装置。 薄膜和加热装置承载在与该部位相对地蚀刻的基板的区域上以减小该区域的厚度，从而减少从该区域到周围区域的热流。

    Integrated cooling system for electronic devices
    8.
    发明申请
    Integrated cooling system for electronic devices 有权
    电子设备集成冷却系统

    公开(公告)号：US20060034052A1

    公开(公告)日：2006-02-16

    申请号：US10919168

    申请日：2004-08-16

    申请人： Shih-Chia Chang ,  Bruce Myers ,  Darrel Peugh ,  Carl Berlin ,  M. Fairchild

    发明人： Shih-Chia Chang ,  Bruce Myers ,  Darrel Peugh ,  Carl Berlin ,  M. Fairchild

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

    摘要： The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.

    摘要翻译： 本发明提供一种用于制造电子组件和具有用于散热的集成冷却系统的电子组件的方法。 电子组件包括基座; 以及至少一个附接到基座的电气部件。 基座限定了一个集成的冷却系统，其具有横跨在基座内的流体通道和与流体通道热连通的至少一个热交换器。 集成冷却系统还可以包括附接到基座的泵，用于引导流体在流体通道内的流动，以及与流体通道流体连通以便从外部源接收流体的端口。

    Active microaccelerometer
    9.
    发明授权
    Active microaccelerometer 失效
    有源微加速度计

    公开(公告)号：US5233874A

    公开(公告)日：1993-08-10

    申请号：US746548

    申请日：1991-08-19

    申请人： Michael W. Putty ,  David B. Hicks ,  Shih-Chia Chang ,  David S. Eddy

    发明人： Michael W. Putty ,  David B. Hicks ,  Shih-Chia Chang ,  David S. Eddy

    IPC分类号： G01P15/08 ,  G01P15/097 ,  G01P15/10 ,  G01P15/13

    CPC分类号： G01P15/133 ,  G01P15/0802 ,  G01P15/097

    摘要： A microaccelerometer is provided for use in on-board automotive safety control and navigational systems. The microaccelerometer includes a central support body which is supported upon a backing chip, a peripheral proof mass which circumscribes the central support body, and at least one pair of microbridges, each of which are attached to both the central support body and the peripheral proof mass. The pair of microbridges extend outwardly in opposite directions from the central support body such that a longitudinal axis through each of the microbridges forms a common axis through the central support body. The microbridges are attached to the peripheral proof mass at the end opposite the central support body so as to suspend the peripheral proof mass circumferentially about the central support body and above the backing chip. Piezoelectric drivers and sensors are provided, respectively, for exciting the microbridges at their resonant frequencies, and for detecting changes in the resonant frequencies of the microbridges which occur as a function of acceleration of the peripheral proof mass. The sensors are connected to a feedback circuit which amplifies and buffers their output and provides feedback to the drivers to properly maintain the microbridges at their resonant frequencies.

    摘要翻译： 提供微加速度计用于车载汽车安全控制和导航系统。 微加速度计包括支撑在背衬芯片上的中央支撑体，环绕中心支撑体的外围防护质量块，以及至少一对微桥，每一个微桥连接到中心支撑体和周边防护体两者 。 一对微桥从中心支撑体向相反方向向外延伸，使得通过每个微桥的纵向轴线通过中心支撑体形成公共轴线。 微桥在与中心支撑体相对的端部处附接到外围防护质量块，以便围绕中心支撑体周围和背衬芯片上方悬挂周边防护质量块。 分别提供了压电驱动器和传感器，用于激发其谐振频率处的微桥，并且用于检测作为外围检测质量的加速度的函数发生的微桥的谐振频率的变化。 传感器连接到反馈电路，该反馈电路放大并缓冲其输出，并向驱动器提供反馈以适当地将微桥保持在谐振频率。

    Hydrogen gas detector
    10.
    发明授权
    Hydrogen gas detector 失效
    氢气检测仪

    公开(公告)号：US4030340A

    公开(公告)日：1977-06-21

    申请号：US707678

    申请日：1976-07-22

    申请人： Shih-Chia Chang

    发明人： Shih-Chia Chang

    IPC分类号： G01N27/12 ,  G01N27/04

    CPC分类号： G01N27/12

    摘要： A semiconductor article suitable for use in the detection of hydrogen gas in the atmosphere. The article comprises a film of palladium deposited onto a semiconductor film of stannic oxide which is positioned on a suitable substrate together with a resistance heating element. In some cases, the stannic oxide film is provided with a dopant to improve the operation of the article.

    摘要翻译： 适用于大气中氢气检测的半导体产品。 该物品包括沉积在氧化锡半导体膜上的钯膜，其与电阻加热元件一起位于合适的衬底上。 在一些情况下，锡氧化物膜具有掺杂剂以改善制品的操作。