公开(公告)号：US08643078B2

公开(公告)日：2014-02-04

申请号：US13443417

申请日：2012-04-10

申请人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh

发明人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh

IPC分类号： H01L29/788

CPC分类号： H01L23/3192 ,  H01L27/11565 ,  H01L27/11578 ,  H01L29/792 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a base, a stacked structure and a doped layer. The stacked structure is formed on the base, wherein the stacked structure comprises a plurality of conductive strips and a plurality of insulating strips, one of the conductive strips is located between adjacent two insulating strips, the stacked structure has a first side wall, and a long edge of the first side wall is extended along a channel direction. The doped layer is formed in the first side wall, wherein the doped layer is formed by an ion implantation applied to the first side wall, and an acute angle is contained between an implantation direction of the ion implantation and the first side wall.

摘要翻译： 提供了一种半导体结构及其制造方法。 半导体结构包括基极，层叠结构和掺杂层。 堆叠结构形成在基底上，其中堆叠结构包括多个导电条和多个绝缘条，其中一个导电条位于相邻的两个绝缘条之间，该堆叠结构具有第一侧壁和 第一侧壁的长边缘沿着通道方向延伸。 掺杂层形成在第一侧壁中，其中通过施加到第一侧壁上的离子注入形成掺杂层，并且在离子注入的注入方向和第一侧壁之间包含锐角。

公开(公告)号：US09240405B2

公开(公告)日：2016-01-19

申请号：US13089652

申请日：2011-04-19

申请人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang Yeu Hsieh

发明人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang Yeu Hsieh

IPC分类号： H01L27/118 ,  H01L27/06 ,  H01L27/02 ,  H01L27/105 ,  H01L27/115

CPC分类号： H01L27/0688 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11578

摘要： An integrated circuit memory device, including a memory circuit and a peripheral circuit, is described which is suitable for low cost manufacturing. The memory circuit and peripheral circuit for the device are implemented in different layers of a stacked structure. The memory circuit layer and the peripheral circuit layer include complementary interconnect surfaces, which upon mating together establish the electrical interconnection between the memory circuit and the peripheral circuit. The memory circuit layer and the peripheral circuit layer can be formed separately using different processes on different substrates in different fabrication lines. This enables the use of independent fabrication process technologies, one arranged for the memory array, and another arranged for the supporting peripheral circuit. The separate circuitry can then be stacked and bonded together.

摘要翻译： 描述了包括存储器电路和外围电路的集成电路存储器件，其适用于低成本制造。 用于器件的存储器电路和外围电路被实现在堆叠结构的不同层中。 存储器电路层和外围电路层包括互补的互连表面，其在配合时一起建立存储器电路和外围电路之间的电互连。 存储电路层和外围电路层可以在不同的制造线路中的不同基板上使用不同的工艺分别形成。 这使得能够使用独立的制造工艺技术，一种被布置用于存储器阵列，另一种被布置用于支持外围电路。 然后可以将单独的电路堆叠并结合在一起。

公开(公告)号：US20120267689A1

公开(公告)日：2012-10-25

申请号：US13089652

申请日：2011-04-19

申请人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang Yeu Hsieh

发明人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang Yeu Hsieh

IPC分类号： H01L27/10 ,  H01L21/82

CPC分类号： H01L27/0688 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11578

摘要： An integrated circuit memory device, including a memory circuit and a peripheral circuit, is described which is suitable for low cost manufacturing. The memory circuit and peripheral circuit for the device are implemented in different layers of a stacked structure. The memory circuit layer and the peripheral circuit layer include complementary interconnect surfaces, which upon mating together establish the electrical interconnection between the memory circuit and the peripheral circuit. The memory circuit layer and the peripheral circuit layer can be formed separately using different processes on different substrates in different fabrication lines. This enables the use of independent fabrication process technologies, one arranged for the memory array, and another arranged for the supporting peripheral circuit. The separate circuitry can then be stacked and bonded together.

摘要翻译： 描述了包括存储器电路和外围电路的集成电路存储器件，其适用于低成本制造。 用于器件的存储器电路和外围电路被实现在堆叠结构的不同层中。 存储器电路层和外围电路层包括互补的互连表面，其在配合时一起建立存储器电路和外围电路之间的电互连。 存储电路层和外围电路层可以在不同的制造线路中的不同基板上使用不同的工艺分别形成。 这使得能够使用独立的制造工艺技术，一种被布置用于存储器阵列，另一种被布置用于支持外围电路。 然后可以将单独的电路堆叠并结合在一起。

公开(公告)号：US08704205B2

公开(公告)日：2014-04-22

申请号：US13594353

申请日：2012-08-24

申请人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh ,  Erh-Kun Lai ,  Yen-Hao Shih

发明人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh ,  Erh-Kun Lai ,  Yen-Hao Shih

IPC分类号： H01L47/00

CPC分类号： H01L27/11582 ,  H01L27/11548 ,  H01L27/11556 ,  H01L27/11575

摘要： A semiconductor structure with improved capacitance of bit lines includes a substrate, a stacked memory structure, a plurality of bit lines, a first stair contact structure, a first group of transistor structures and a first conductive line. The first stair contact structure is formed on the substrate and includes conductive planes and insulating planes stacked alternately. The conductive planes are separated from each other by the insulating planes for connecting the bit lines to the stacked memory structure by stairs. The first group of transistor structures is formed in a first bulk area where the bit lines pass through and then connect to the conductive planes. The first group of transistor structures has a first gate around the first bulk area. The first conductive line is connected to the first gate to control the voltage applied to the first gate.

摘要翻译： 具有改善的位线电容的半导体结构包括衬底，堆叠存储器结构，多个位线，第一阶梯接触结构，第一组晶体管结构和第一导电线。 第一阶梯接触结构形成在基板上，并且包括交替堆叠的导电平面和绝缘面。 导电平面通过用于通过楼梯将位线连接到堆叠的存储器结构的绝缘平面彼此分离。 第一组晶体管结构形成在第一体积区域中，其中位线通过，然后连接到导电平面。 第一组晶体管结构在第一体积区域周围具有第一栅极。 第一导线连接到第一栅极以控制施加到第一栅极的电压。

公开(公告)号：US20130264683A1

公开(公告)日：2013-10-10

申请号：US13443417

申请日：2012-04-10

申请人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh

发明人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh

IPC分类号： H01L29/00 ,  H01L21/56

CPC分类号： H01L23/3192 ,  H01L27/11565 ,  H01L27/11578 ,  H01L29/792 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a base, a stacked structure and a doped layer. The stacked structure is formed on the base, wherein the stacked structure comprises a plurality of conductive strips and a plurality of insulating strips, one of the conductive strips is located between adjacent two insulating strips, the stacked structure has a first side wall, and a long edge of the first side wall is extended along a channel direction. The doped layer is formed in the first side wall, wherein the doped layer is formed by an ion implantation applied to the first side wall, and an acute angle is contained between an implantation direction of the ion implantation and the first side wall.

摘要翻译： 提供了一种半导体结构及其制造方法。 半导体结构包括基极，层叠结构和掺杂层。 堆叠结构形成在基底上，其中堆叠结构包括多个导电条和多个绝缘条，其中一个导电条位于相邻的两个绝缘条之间，该堆叠结构具有第一侧壁和 第一侧壁的长边缘沿着通道方向延伸。 掺杂层形成在第一侧壁中，其中通过施加到第一侧壁上的离子注入形成掺杂层，并且在离子注入的注入方向和第一侧壁之间包含锐角。

公开(公告)号：US20140054535A1

公开(公告)日：2014-02-27

申请号：US13594353

申请日：2012-08-24

申请人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh ,  Erh-Kun Lai ,  Yen-Hao Shih

发明人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh ,  Erh-Kun Lai ,  Yen-Hao Shih

IPC分类号： H01L47/00

CPC分类号： H01L27/11582 ,  H01L27/11548 ,  H01L27/11556 ,  H01L27/11575

摘要： A semiconductor structure with improved capacitance of bit lines includes a substrate, a stacked memory structure, a plurality of bit lines, a first stair contact structure, a first group of transistor structures and a first conductive line. The first stair contact structure is formed on the substrate and includes conductive planes and insulating planes stacked alternately. The conductive planes are separated from each other by the insulating planes for connecting the bit lines to the stacked memory structure by stairs. The first group of transistor structures is formed in a first bulk area where the bit lines pass through and then connect to the conductive planes. The first group of transistor structures has a first gate around the first bulk area. The first conductive line is connected to the first gate to control the voltage applied to the first gate.

摘要翻译： 具有改善的位线电容的半导体结构包括衬底，堆叠存储器结构，多个位线，第一阶梯接触结构，第一组晶体管结构和第一导电线。 第一阶梯接触结构形成在基板上，并且包括交替堆叠的导电平面和绝缘面。 导电平面通过用于通过楼梯将位线连接到堆叠的存储器结构的绝缘平面彼此分离。 第一组晶体管结构形成在第一体积区域中，其中位线通过，然后连接到导电平面。 第一组晶体管结构在第一体积区域周围具有第一栅极。 第一导线连接到第一栅极以控制施加到第一栅极的电压。

公开(公告)号：US08987098B2

公开(公告)日：2015-03-24

申请号：US13527259

申请日：2012-06-19

申请人： Shih-Hung Chen ,  Yen-Hao Shih ,  Hang-Ting Lue

发明人： Shih-Hung Chen ,  Yen-Hao Shih ,  Hang-Ting Lue

IPC分类号： H01L21/336 ,  H01L27/115

CPC分类号： H01L27/11578 ,  H01L27/11565

摘要： The technology relates to a damascene word line for a three dimensional array of nonvolatile memory cells. Partly oxidized lines of material such as silicon are made over a plurality of stacked nonvolatile memory structures. Word line trenches are made in the partly oxidized lines, by removing the unoxidized lines from the intermediate parts of the partly oxidized lines, leaving the plurality of oxidized lines at the outer parts of the plurality of partly oxidized lines. Word lines are made in the word line trenches over the plurality of stacked nonvolatile memory structures.

摘要翻译： 该技术涉及用于非易失性存储器单元的三维阵列的大马士革字线。 在多个堆叠的非易失性存储器结构上制造部分氧化的材料线如硅。 通过从部分氧化的线的中间部分去除未氧化的线，在多个部分氧化的线的外部部分留下多条氧化线，在部分氧化的线中形成字线沟槽。 在多个堆叠的非易失性存储器结构中的字线沟槽中形成字线。

公开(公告)号：US08759899B1

公开(公告)日：2014-06-24

申请号：US13739914

申请日：2013-01-11

申请人： Hang-Ting Lue ,  Yi-Hsuan Hsiao ,  Shih-Hung Chen ,  Yen-Hao Shih

发明人： Hang-Ting Lue ,  Yi-Hsuan Hsiao ,  Shih-Hung Chen ,  Yen-Hao Shih

IPC分类号： H01L29/788

CPC分类号： H01L22/12 ,  H01L22/20 ,  H01L27/11531 ,  H01L27/11556 ,  H01L27/11573 ,  H01L27/11582 ,  H01L29/0649

摘要： An integrated circuit device includes a substrate including a first region and a second region. A pit is formed in the first region. A stack of active layers alternating with insulating layers is deposited in the pit. The stack includes a particular insulating layer. The particular insulating layer has a first thickness, where a sum of the first thickness, thickness of active layers, and thicknesses of other insulating layers is essentially equal to a depth of the pit. The first thickness is different than the thicknesses of the other insulating layers by an amount within a range of process variations for the depth of the pit, for the thicknesses of the active layers, and for the thicknesses of other insulating layers. The device includes a planarized surface over the first and second regions, where an uppermost one of the active layers has a top surface below the planarized surface.

摘要翻译： 集成电路器件包括包括第一区域和第二区域的衬底。 在第一区域形成凹坑。 与绝缘层交替的一叠有源层沉积在凹坑中。 堆叠包括特定的绝缘层。 特定绝缘层具有第一厚度，其中第一厚度，有源层的厚度和其它绝缘层的厚度之和基本上等于凹坑的深度。 第一厚度不同于其它绝缘层的厚度，在凹坑的深度，有源层的厚度和其它绝缘层的厚度的工艺变化范围内的量。 该装置包括在第一和第二区域之上的平坦化表面，其中最上面的一个活性层在平坦化表面下方具有顶表面。

公开(公告)号：US20130175598A1

公开(公告)日：2013-07-11

申请号：US13347331

申请日：2012-01-10

申请人： Shih-Hung Chen ,  Hang-Ting Lue ,  Yen-Hao Shih

发明人： Shih-Hung Chen ,  Hang-Ting Lue ,  Yen-Hao Shih

IPC分类号： H01L29/792 ,  H01L21/8239

CPC分类号： H01L27/11582 ,  H01L29/7926

摘要： The technology relates to a damascene word line for a three dimensional array of nonvolatile memory cells. Conductive lines such as silicon are formed over stacked nonvolatile memory structures. Word line trenches separate neighboring ones of the silicon lines. The silicon lines separated by the word line trenches are oxidized, making insulating surfaces in the word line trenches. Word lines are made in the word line trenches.

摘要翻译： 该技术涉及用于非易失性存储器单元的三维阵列的大马士革字线。 诸如硅的导电线形成在堆叠的非易失性存储器结构之上。 字线沟槽分离出相邻的硅线。 由字线沟槽分隔的硅线被氧化，在字线沟槽中形成绝缘表面。 字线是在字线沟中制作的。

公开(公告)号：US08363476B2

公开(公告)日：2013-01-29

申请号：US13009464

申请日：2011-01-19

申请人： Hang-Ting Lue ,  Shih-Hung Chen

发明人： Hang-Ting Lue ,  Shih-Hung Chen

IPC分类号： G11C16/00

CPC分类号： H01L29/7926 ,  G11C16/0466 ,  G11C16/3418 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/66833

摘要： A memory device, a manufacturing method and an operating method of the same are provided. The memory device includes a substrate, stacked structures, a channel element, a dielectric element, a source element, and a bit line. The stacked structures are disposed on the substrate. Each of the stacked structures includes a string selection line, a word line, a ground selection line and an insulating line. The string selection line, the word line and the ground selection line are separated from each other by the insulating line. The channel element is disposed between the stacked structures. The dielectric element is disposed between the channel element and the stacked structure. The source element is disposed between the upper surface of the substrate and the lower surface of the channel element. The bit line is disposed on the upper surface of the channel element.

摘要翻译： 提供了一种存储器件，其制造方法和操作方法。 存储器件包括衬底，堆叠结构，沟道元件，电介质元件，源元件和位线。 堆叠结构设置在基板上。 每个堆叠结构包括串选择线，字线，接地选择线和绝缘线。 串选择线，字线和接地选择线通过绝缘线彼此分离。 通道元件设置在堆叠结构之间。 电介质元件设置在通道元件和堆叠结构之间。 源元件设置在基板的上表面和通道元件的下表面之间。 位线设置在通道元件的上表面上。