公开(公告)号：US4373800A

公开(公告)日：1983-02-15

申请号：US207999

申请日：1980-11-18

申请人： Shin-ichi Kamiyama ,  Kiyoshi Ohshima ,  Manabu Mochizuki ,  Kazuyuki Kato ,  Takeshi Saito

发明人： Shin-ichi Kamiyama ,  Kiyoshi Ohshima ,  Manabu Mochizuki ,  Kazuyuki Kato ,  Takeshi Saito

IPC分类号： G03G15/11 ,  G03G21/00 ,  G03G15/10

CPC分类号： G03G15/11 ,  G03G21/0088

摘要： A wet type electrophotographic copying machine of the type capable of performing one copy making process during substantially two revolutions of a photoconductor, which is provided with means for forming a liquid developer deposition portion by charging, exposure and development, on the downstream side of an image formation area on the photoconductor, the liquid developer deposition portion capable of substantially narrowing the gap between the photoconductor and a squeegee roller, whereby the squeezing of excess developer from the surface of the photoconductor can be performed at the squeezing initiation point on the photoconductor, thus attaining a sharp squeezing effect, and the adhesion of the excess liquid developer to an image transfer material can be prevented.

摘要翻译： 该类型的湿式电照相复印机能够在大致两圈的感光体中进行一次复印制作工艺，该感光体在图像的下游侧设置有用于通过充电，曝光和显影形成液体显影剂沉积部分的装置 光电导体上的形成区域，液体显影剂沉积部分能够基本上使得光电导体和刮板辊之间的间隙变窄，从而可以在光电导体的挤压起始点处从光电导体的表面挤压多余的显影剂，从而 达到急剧的挤压效果，并且可以防止多余的液体显影剂对图像转印材料的粘附。

公开(公告)号：US08655116B2

公开(公告)日：2014-02-18

申请号：US13156376

申请日：2011-06-09

申请人： Eitaro Ishimura ,  Kazuhisa Takagi ,  Keisuke Matsumoto ,  Takeshi Saito

发明人： Eitaro Ishimura ,  Kazuhisa Takagi ,  Keisuke Matsumoto ,  Takeshi Saito

IPC分类号： G02F1/035 ,  G02B26/00 ,  G02F1/01

CPC分类号： G02F1/025 ,  G02F1/2255

摘要： An optical modulator includes: a semiconductor chip; a waveguide in the semiconductor chip; a traveling wave electrode including an input portion and an output portion, to which a signal is applied for modulating light passing through the waveguide; a power supply line connected to the input portion via a first wire; and a termination resistor connected to the output portion via a second wire. Capacitance between the output portion and a grounding point is larger than capacitance between the input portion and the grounding point.

摘要翻译： 一种光调制器，包括：半导体芯片; 半导体芯片中的波导; 包括输入部分和输出部分的行波电极，向其施加信号以调制通过波导的光; 经由第一线连接到所述输入部分的电源线; 以及通过第二线连接到输出部分的终端电阻器。 输出部分和接地点之间的电容大于输入部分和接地点之间的电容。

公开(公告)号：US08234322B2

公开(公告)日：2012-07-31

申请号：US11058725

申请日：2005-02-14

申请人： Takeshi Saito

发明人： Takeshi Saito

IPC分类号： G06F7/58

CPC分类号： G06F1/02 ,  G06F7/588

摘要： The present invention relates to a random-number generating apparatus and method for generating physical random numbers in accordance with noises randomly generated by a noise generating element, and allows for generating true random numbers at a high speed and uniformizing the generation frequency of each random number value, even in a simplified circuit configuration. The random-number generating apparatus is operable to amplify a waveform based on thermal noises generated in a thermal-noise generating element, and generate a random pulse at the time when the amplified output signal exceeds a given threshold from the state of being less than the threshold. The random-number generating apparatus is also provided with a reference-pulse generator for generating a reference pulse having a constant period, and a timer for measuring a time interval between the reference pulse and the random pulse. The measured value in the timer is output as a random number value.

摘要翻译： 本发明涉及一种随机数生成装置和方法，用于根据由噪声产生元件随机产生的噪声产生物理随机数，并允许高速生成真随机数并使每个随机数的产生频率均匀化 即使在简化的电路配置中也是如此。 随机数产生装置可操作以基于在热噪声产生元件中产生的热噪声来放大波形，并且在放大的输出信号超过给定阈值时从随机脉冲的小于 阈。 随机数产生装置还设置有用于产生具有恒定周期的参考脉冲的参考脉冲发生器和用于测量参考脉冲和随机脉冲之间的时间间隔的定时器。 定时器中的测量值作为随机数值输出。

公开(公告)号：US20120066633A1

公开(公告)日：2012-03-15

申请号：US13060387

申请日：2010-09-10

申请人： Takeshi Saito ,  Tomoaki Kakeda ,  Eitaro Ito ,  Daisuke Nogami ,  Junko Suzuki

发明人： Takeshi Saito ,  Tomoaki Kakeda ,  Eitaro Ito ,  Daisuke Nogami ,  Junko Suzuki

IPC分类号： G06F3/048

CPC分类号： G06F13/10 ,  G06F3/0605 ,  G06F3/0631 ,  G06F3/0653 ,  G06F3/067 ,  G06F11/302 ,  G06F11/3055 ,  G06F11/324 ,  G06F11/34 ,  G06F13/00 ,  G06F2206/1008

摘要： The display computer displays a management screen having a first area and a second area. In the first area, information related to a computer system, and an input object for a work operation that is a user operation for registering a task of a processing to a computer system into a management computer or an object for displaying the input object are displayed. In the second area, a summary view related to at least one task registered into the management computer is displayed. The summary view has a status object for each status of task, the status object includes an object indicating a status and a value indicating a number of tasks of the status. When the management computer detects a modification of a status of each task that has been registered, the display computer updates a value of a number of tasks in the second area.

摘要翻译： 显示计算机显示具有第一区域和第二区域的管理屏幕。 在第一区域中，显示与计算机系统有关的信息，以及作为用于将计算机系统的处理任务注册到管理计算机或用于显示输入对象的对象的用户操作的工作操作的输入对象 。 在第二区域中，显示与登记在管理计算机中的至少一个任务相关的摘要视图。 摘要视图具有每个状态状态的状态对象，状态对象包括指示状态的对象和指示状态任务数量的值。 当管理计算机检测到已经注册的每个任务的状态的修改时，显示计算机更新第二区域中的多个任务的值。

公开(公告)号：US20120052655A1

公开(公告)日：2012-03-01

申请号：US13318411

申请日：2010-05-10

申请人： Satoru Kawata ,  Takeshi Saito

发明人： Satoru Kawata ,  Takeshi Saito

IPC分类号： H01L21/78 ,  B32B27/20 ,  C09J183/04 ,  C09J7/02 ,  C09J4/06 ,  C09J151/08

CPC分类号： C09J133/14 ,  C08F2220/1808 ,  C08G2170/40 ,  C08L33/04 ,  C08L33/06 ,  C08L33/14 ,  C08L75/04 ,  C08L83/00 ,  C08L83/04 ,  C08L2666/02 ,  C08L2666/04 ,  C09J133/06 ,  C09J175/16 ,  H01L2224/83191 ,  Y10T428/28 ,  Y10T428/2891 ,  Y10T428/31551 ,  C08F2220/1825 ,  C08F2220/281

摘要： In a conventional adhesive sheet laminated with a die attachment film, the die attachment film sometimes drops off from the die chip at the time of pick-up after die chip formation by dicing a wafer. The present invention provides an adhesive including a (meth)acrylate ester polymer, a urethane acrylate oligomer having 4 or more vinyl groups, and silicone microparticles. Another aspect of the invention, provides a process for producing electronic components, the process including: a wafer-pasting step of pasting a wafer on a surface of a die attachment film of an adhesive sheet; a dicing step of dicing the wafer into die chips; and a pick-up step of peeling the die attachment film from the adhesive layer after the dicing step, and picking up the die chip together with the die attachment film.

摘要翻译： 在与芯片安装膜层叠的常规粘合片中，通过切割晶片，在芯片形成之后，芯片附着膜有时在从芯片芯片脱落时脱落。 本发明提供包含（甲基）丙烯酸酯聚合物，具有4个或更多个乙烯基的氨基甲酸酯丙烯酸酯低聚物和硅氧烷微粒的粘合剂。 本发明的另一方面提供了一种电子部件的制造方法，其特征在于，包括：将粘合片的芯片安装膜的表面上的晶片粘​​贴的晶片粘贴工序; 将晶片切割成芯片的切割步骤; 以及在切割步骤之后从粘合剂层剥离模片安装膜并与模片附接膜一起拾取模片的拾取步骤。

公开(公告)号：US20110273895A1

公开(公告)日：2011-11-10

申请号：US13144681

申请日：2010-09-28

申请人： Takaari Uemoto ,  Yasuyuki Ueda ,  Mitsuko Shuto ,  Masahiro Miki ,  Makoto Inoue ,  Hideo Nagai ,  Kenji Takahashi ,  Takeshi Saito

发明人： Takaari Uemoto ,  Yasuyuki Ueda ,  Mitsuko Shuto ,  Masahiro Miki ,  Makoto Inoue ,  Hideo Nagai ,  Kenji Takahashi ,  Takeshi Saito

IPC分类号： F21S8/00

CPC分类号： F21V23/009 ,  F21K9/232 ,  F21V19/0055 ,  F21Y2115/10

摘要： A mount member (5) has a contact surface (27a) touching the bottom surface of an LED module (3) and protrusions (5a) protruding from the periphery of the contact surface (27a) in the thickness direction of the LED module (3) and regulating sliding motions thereof. A fixing member (6) made of a resilient, plate-like member comprises an opposing pair of flat portions (43) near the contact surface (27a) of the mount member (5) and flat tabs (44) projecting from the flat portions (43) toward the contact surface (27a) touching the upper surface of a substrate (17). The flat portions (43) of the fixing member (6) are fastened to be lower than the top surface of the substrate (17) of the LED module (3). Thus, elastically deformed areas extending from the fastened parts of the flat portions (43) through the flat tabs (44) press the substrate (17) into the mount member (5).

摘要翻译： 安装构件（5）具有接触LED模块（3）的底面的接触表面（27a）和在LED模块（3）的厚度方向上从接触表面（27a）的周边突出的突起（5a） ）并调节其滑动运动。 由弹性的板状构件制成的固定构件（6）包括在安装构件（5）的接触表面（27a）附近的相对的一对平坦部分（43）和从平坦部分突出的平坦突片（44） （43）朝向接触基板（17）的上表面的接触表面（27a）。 固定部件（6）的平坦部（43）被固定成比LED模块（3）的基板（17）的上表面低。 因此，从扁平部分43的紧固部分延伸穿过平板突起44的弹性变形区域将基板17压入安装部件5。

公开(公告)号：US20110223743A1

公开(公告)日：2011-09-15

申请号：US13130076

申请日：2009-11-11

申请人： Takeshi Saito ,  Tomomichi Takatsu

发明人： Takeshi Saito ,  Tomomichi Takatsu

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B32B7/12 ,  B32B25/12 ,  B32B25/14 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/21 ,  B32B2457/14 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/00

摘要： The objective is to limit pickup defects when chips with a semi-cured adhesive layer are picked up following dicing by lowering the adhesive strength of an ultraviolet curable adhesive beforehand while improving the cohesive force. Provided is a dicing method for semiconductor wafers with a semi-cured adhesive layer that comprises a process to coat the back surface of semiconductor wafers with a paste-like adhesive and semi-cure the paste-like adhesive in a sheet form using heating or ultraviolet irradiation to form a semi-cured adhesive layer, a gluing process to glue an adhesive sheet, wherein an ultraviolet curable adhesive is laminated on a base film, onto the semi-cured adhesive layer, an ultraviolet irradiation process to apply ultraviolet irradiation to the ultraviolet curable adhesive, and a dicing process to dice the semi-cured adhesive layer glued to the adhesive sheet and the semiconductor wafers.

摘要翻译： 目的是通过在改善内聚力的同时降低紫外线固化性粘合剂的粘合强度，在切割后拾取具有半固化粘合剂层的芯片，以限制拾取缺陷。 本发明提供一种具有半固化粘合剂层的半导体晶片的切割方法，其包括用糊状粘合剂涂覆半导体晶片的背面并使用加热或紫外线将片状粘合剂半固化的方法 照射以形成半固化粘合剂层，将粘合片胶合的胶合工艺，其中将紫外线固化性粘合剂层压在基膜上，到半固化粘合剂层上，对紫外线照射紫外线照射过程 以及切割工艺来切割粘合到粘合片和半导体晶片的半固化粘合剂层。

公开(公告)号：US07719713B2

公开(公告)日：2010-05-18

申请号：US11762908

申请日：2007-06-14

申请人： Takeshi Saito ,  Kazuo Asano ,  Toru Misaizu ,  Shigeru Arai

发明人： Takeshi Saito ,  Kazuo Asano ,  Toru Misaizu ,  Shigeru Arai

IPC分类号： G06F15/00

CPC分类号： H04N1/52

摘要： An image processing apparatus, has: a conversion unit that converts input image information including a first color component and a second color component into output image information in which, with regard to each of the color components, the number of gray levels per pixel is smaller than the number of gray levels per pixel in the input image information and a gray level of the input image information is expressed by a gray level value of each pixel and a dot density and in which the size of a dot is different between the first color component and the second color component; and an output unit that outputs the output image information obtained by the conversion unit.

摘要翻译： 一种图像处理装置，具有：将包括第一颜色分量和第二颜色分量的输入图像信息转换为输出图像信息的转换单元，其中，对于每个颜色分量，每个像素的灰度级数较小 比输入图像信息中的每个像素的灰度数量和输入图像信息的灰度级由每个像素的灰度值和点密度表示，并且其中点的尺寸在第一颜色 组件和第二颜色分量; 以及输出单元，其输出由转换单元获得的输出图像信息。

公开(公告)号：US07684172B2

公开(公告)日：2010-03-23

申请号：US11986911

申请日：2007-11-27

申请人： Takeo Kasuga ,  Yuji Yoshida ,  Masanori Takahashi ,  Ryuta Kobayakawa ,  Takeshi Saito ,  Koji Sakata ,  Sadamu Toita ,  Katsuhiro Yoshida

发明人： Takeo Kasuga ,  Yuji Yoshida ,  Masanori Takahashi ,  Ryuta Kobayakawa ,  Takeshi Saito ,  Koji Sakata ,  Sadamu Toita ,  Katsuhiro Yoshida

IPC分类号： H01G9/04 ,  H01G9/145

CPC分类号： H01G9/025 ,  H01G9/0036 ,  H01G11/48 ,  H01G11/56 ,  Y02E60/13 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes a valve metal formed with an anodized film; an inner conductive polymer film formed on the anodized film; and an outer conductive polymer film formed on the inner conductive polymer film. The outer conductive polymer film is obtained by: preparing a first polymer solution (PEDOT/PSSA); dissolving a predetermined dissolved substance in a non-aqueous solvent, the predetermined dissolved substance being selected from the group consisting of boric acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 1,3,6-naphthalenetrisulfonic acid, and polystyrenesulfonic acid, and a salt thereof; mixing the dissolved solvent with pure water to obtain an additive solution; adding the additive solution into the first polymer solution to obtain a second polymer solution; and applying the second polymer solution to the inner conductive polymer film.

摘要翻译： 固体电解电容器包括形成有阳极氧化膜的阀金属; 在阳极氧化膜上形成的内部导电聚合物膜; 以及形成在内部导电聚合物膜上的外部导电聚合物膜。 外导电聚合物膜通过以下步骤获得：制备第一聚合物溶液（PEDOT / PSSA）; 将预定的溶解物质溶解在非水溶剂中，所述预定的溶解物质选自硼酸，1-萘磺酸，2-萘磺酸，1,3,6-萘三磺酸和聚苯乙烯磺酸，以及 其盐; 将溶解的溶剂与纯水混合，得到添加剂溶液; 将添加剂溶液加入到第一聚合物溶液中以获得第二聚合物溶液; 以及将所述第二聚合物溶液施加到所述内部导电聚合物膜。

公开(公告)号：US07627748B2

公开(公告)日：2009-12-01

申请号：US10960701

申请日：2004-10-08

申请人： Takeshi Saito ,  Yoshiaki Takabatake ,  Mikio Hashimoto

发明人： Takeshi Saito ,  Yoshiaki Takabatake ,  Mikio Hashimoto

IPC分类号： H04L9/00

CPC分类号： H04L12/40091 ,  H04L12/40104 ,  H04L12/4011 ,  H04L12/6418

摘要： A scheme for realizing a contents protection procedure between devices that are not connected to the same network, in a system where the IEEE 1394 buses are connected together through a 1394 bridge or a system where the IEEE 1394 buses are connected together through another radio network, is disclosed. A network connection device notifies information regarding a transmission node on the first IEEE 1394 bus to a reception node on the second IEEE 1394 bus, so that the reception node can carry out the authentication and key exchange procedure directly with the transmission node on a different network.

摘要翻译： 在IEEE 1394总线通过1394桥接器或IEEE 1394总线通过另一个无线电网络连接在一起的系统的系统中实现不连接到同一网络的设备之间的内容保护过程的方案， 被披露。 网络连接装置将关于第一IEEE 1394总线上的传输节点的信息通知给第二IEEE 1394总线上的接收节点，使得接收节点可以直接与不同网络上的传输节点进行认证和密钥交换过程 。