摘要:
A conjugated diene copolymer comprising (A) 40 to 90 mole % of a conjugated diene component, (B) 0.5 to 10 mole % of an alpha,beta-ethylenically unsaturated carboxylic acid component, (C) 0.1 to 5 mole % of a polyfunctional alkenyl compound component and (D) 5 to 58 mole % of a monoolefinically unsaturated compound component wherein the intrinsic viscosity [.eta.] of the copolymer as measured at 30.degree. C. in dimethylformamide is 0.01 to 3.0 dl/g, the width (.DELTA.Tg) of the endothermic transition temperature section determined by a differential scanning calorimetry is 45.degree. to 120.degree. C., and the limit temperature (T.sub.1) on the lower temperature side of the endothermic transition temperature section is -40.degree. C. or less. This copolymer, when combined with a photopolymerizable unsaturated monomer and a photosensitizer, provides a photosensitive resin composition which is soluble in aqueous alkali solutions, has an excellent processability and a photocurability, has an excellent rubber elasticity and a transparency even after curing, and has excellent water resistance.
摘要:
A conjugated diene copolymer comprising (A) 40 to 90 mole % of a conjugated diene component, (B) 0.5 to 10 mole % of an alpha,beta-ethylenically unsaturated carboxylic acid component, (C) 0.1 to 5 mole % of a polyfunctional alkenyl compound component and (D) 5 to 58 mole % of a monoolefinically unsaturated compound component wherein the intrinsic viscosity [.eta.] of the copolymer as measured at 30.degree. C. in dimethylformamide is 0.01 to 3.0 dl/g, the width (.DELTA.Tg) of the endothermic transition temperature section determined by a differential scanning calorimetry is 45.degree. to 120.degree. C. and the limit temperature (T.sub.1) on the lower temperature side of the endothermic transition temperature section is -40.degree. C. or less. This copolymer, when combined with a photopolymerizable unsaturated monomer and a photosensitizer, provides a photosensitive resin composition which is soluble in aqueous alkali solutions, has an excellent processability and a photocurability, has an excellent rubber elasticity and a transparency even after curing, and has excellent water resistance.
摘要:
A resin composition comprising 100 parts by weight of a thermosetting resin and 1 to 100 parts by weight of a functional, rubbery copolymer containing among the monomer units which constitute the copolymer, at least one monomer containing a substituent selected from the group consisting of epoxy, hydroxyl, carboxyl and amino groups, said copolymer being prepared by one of three emulsion polymerization processes in which a nonionic surface active agent and/or ionic surface active agent is employed as the emulsifying agent.
摘要:
A rubber composition consisting essentially of 5-99 parts by weight of a thermosetting resin and 94-1 parts by weight of one of the following functional rubber-like copolymers (I) to (III) having a Mooney viscosity ML.sub.1+4.sup.100 of 20-120:(I) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 15-50% by weight of acrylonitrile and 40-80% by weight of butadiene and/or isoprene as monomer units constituting the polymer,(II) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 40-99% by weight of an alkyl (meth)acrylate and/or an alkoxyalkyl (meth)acrylate and 0-30% by weight of monomers copolymerizable therewith other than butadiene and isoprene, as the monomer units constituting the polymer, and(III) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 15-50% by weight of acrylonitrile, 20-60% by weight of butadiene and/or isoprene and 5-65% by weight of an alkyl (meth)acrylate and/or an alkoxy (meth)acrylate as the monomer units constituting the polymer.Said functional rubber copolymer may include 10% by weight or less of a polyfunctional monomer as a monomer unit constituting the polymer. In this case, the ratio of the thermosetting resin to the functional rubber-like copolymer is 50-99 parts by weight of the former to 1-50 parts by weight of the latter.
摘要:
A conjugated diene copolymer comprising (A) 10 to 60 mole % of a conjugated diene compound unit, (B) 5 to 50 mole % of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid unit, (C) 0.1 to 20 mole % of a polyfunctional alkenyl compound unit, (D) 0 to 10 mole % of a diene compound unit having cyclic carbon-carbon double bonds and (E) 0 to 80 mole % of a monoolefinically unsaturated compound unit, the sum of the amounts of units (A), (B), (C), (D) and (E) being 100 mole %, said copolymer having an intrinsic viscosity [.eta.] of 0.01 to 3.0 dl/g as measured at 30.degree. C. in dimethylformamide. The copolymer is soluble in aqueous alkali solutions, excels in processability and photosetting property, and has excellent rubber elasticity and transparency even after photosetting. Accordingly, a photosensitive composition comprising the copolymer, a photopolymerizable unsaturated monomer and a photosensitizer can greatly improve the complicated process for the production of conventional rubber relief plates of flexographic printing, and shorten the production time.
摘要:
A reflection-preventing film-forming composition including a copolymer having structural units represented by the following general formulas (1) and (2) and a solvent: wherein R1 represents a hydrogen atom, a halogen atom, a hydrocarbon group, etc.; R2 represents a hydrogen atom or a methyl group; and m represents an integer of 1 to 9; wherein R3 represents a hydrogen atom or a methyl group, and R4 represents a hydrogen atom or an organic group. Reflection-preventing films formed of this composition have a high reflection-preventing effect, may cause no intermixing with the resist, have a high etching rate and also can form a resist pattern having superior resolution and precision.
摘要:
Positive as well as negative radiation sensitive resin compositions that, in addition to being capable of providing excellent resolution and pattern profile, are particularly excellent in avoiding the problems of "nano-edge roughness" or "coating surface roughness". The positive type radiation sensitive resin composition comprises (A) (a) an acid-decomposable group-containing resin, or (b) an alkali-soluble resin and an alkali dissolution controller, and (B) a photoacid generator comprising "a compound that upon exposure to radiation generates a carboxylic acid having a boiling point of 150.degree. C. or higher", and "a compound that upon exposure to radiation generates an acid other than a carboxylic acid". The negative type radiation sensitive resin composition comprises (C) an alkali-soluble resin, (D) a cross-linking agent, and the component (B) as described above.
摘要:
A radiation-sensitive resin composition including an alkali soluble resin and a quinonediazide compound is provided. The quinonediazide compound has the formula (1), for example: ##STR1## wherein, R.sup.1 to R.sup.6 are an alkyl, cycloalkyl or aryl group; a and b are an integer of 1 to 3; D.sup.1 and D.sup.2 are independently a hydrogen atom or a 1,2-quinonediazidosulfonyl group, provided that at least one of D.sup.1 is a 1,2-quinonediazidosulfonyl group; A is a bonding such as single bond; and x and y are an integer of 0 to 2. The composition is suitable as a positive resist, which effectively restrains the occurrence of scum, and excellent in developability, pattern shape, sensitivity, resolution and focus latitude.
摘要:
Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol % of a structural unit of the formula (1) and (A2) 90 to 1 mol % of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one compound selected from the group consisting of (C1) an aromatic compound containing a methylol group and/or an alkoxy methyl group (except for aromatic compounds containing an amino group), (C2) an aromatic aldehyde compound, (C3) an aliphatic aldehyde compound, (C4) an alkyl-etherified amino group-containing compound and (C5) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion assistant. Disclosed also is a cured product obtainable from the composition. wherein Ra and Rb are each an alkyl group having 1 to 4 carbon atoms, alkoxy group or aryl group, Rb and Rc are each hydrogen or a methyl group, n is an integer of 0 to 3 and m is an integer of 1 to 3. The cured product has excellent resolution, electrical insulating properties, thermal shock resistance, adhesion and other properties.
摘要:
It is an object of the present invention to provide a process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a negative radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a negative radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2), (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator, and by forming a negative radiation-sensitive resin film using the composition.