Printed circuit board and method of manufacturing the same
    1.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号:US08822834B2

    公开(公告)日:2014-09-02

    申请号:US13187830

    申请日:2011-07-21

    IPC分类号: H05K1/00

    摘要: A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.

    摘要翻译: 印刷电路板包括由多孔膜形成的基底绝缘层。 在由多孔膜形成的基底绝缘层上形成导体迹线。 在绝缘绝缘层上形成覆盖导体迹线的覆盖绝缘层。 用作基底绝缘层的多孔膜对于在400nm至800nm的波长区域中的至少一部分波长的光具有不小于50%的反射率。

    Method of manufacturing printed circuit board
    3.
    发明授权
    Method of manufacturing printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号:US08438726B2

    公开(公告)日:2013-05-14

    申请号:US13083097

    申请日:2011-04-08

    IPC分类号: H05K3/02

    摘要: A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.

    摘要翻译: 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来,将抗蚀剂膜曝光和显影,从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后,在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影,使得在导体图案上形成粘合剂图案。 之后,将基底绝缘层接合到导体图案上,其中夹有粘合剂图案。 最后,将载体层与导体图案分离,从而制造FPC基板。

    Dye-sensitized solar cell
    6.
    发明申请
    Dye-sensitized solar cell 审中-公开
    染料敏化太阳能电池

    公开(公告)号:US20110048511A1

    公开(公告)日:2011-03-03

    申请号:US12805774

    申请日:2010-08-19

    IPC分类号: H01L31/04

    摘要: The dye-sensitized solar cell includes a working electrode, a counter electrode that is disposed to face the working electrode with a space therebetween, and an electrolyte that fills in between the working electrode and the counter electrode. The counter electrode includes a substrate having a reflectance of 30% or more at least one wavelength in the range of 400 to 750 nm.

    摘要翻译: 染料敏化太阳能电池包括工作电极,设置成与其间具有空间的工作电极相对设置的对电极和填充在工作电极和对电极之间的电解质。 对电极具有反射率在400〜750nm范围内的反射率为30%以上的至少一种以上的波长的基板。

    Dye-sensitized solar cell electrode and dye-sensitized solar cell
    7.
    发明申请
    Dye-sensitized solar cell electrode and dye-sensitized solar cell 审中-公开
    染料敏化太阳能电池电极和染料敏化太阳能电池

    公开(公告)号:US20110108106A1

    公开(公告)日:2011-05-12

    申请号:US12926248

    申请日:2010-11-04

    IPC分类号: H01L31/0224

    摘要: A dye-sensitized solar cell electrode includes a substrate; a conductive layer formed on one side surface of the substrate and is surrounded by a sealing layer for sealing in an electrolyte; a current collecting layer formed on the other side surface of the substrate; and a conductive portion that allows electrical conduction between the conductive layer and the current collecting layer in the thickness direction of the substrate.

    摘要翻译: 染料敏化太阳能电池电极包括基板; 形成在所述基板的一个侧表面上的导电层,并被用于密封电解质的密封层包围; 形成在所述基板的另一侧面上的集电层; 以及导电部分,其允许导电层和集电层在基板的厚度方向上导电。

    Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display
    9.
    发明授权
    Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display 有权
    用于光学膜,压敏粘合剂光学膜和图像显示器的压敏粘合剂组合物

    公开(公告)号:US08709597B2

    公开(公告)日:2014-04-29

    申请号:US12916959

    申请日:2010-11-01

    IPC分类号: B32B15/04

    摘要: There is provided a pressure-sensitive adhesive composition for optical films. The composition can form a pressure-sensitive adhesive layer that can prevent light leakage caused by stress associated with dimensional change of a component such as an optical film, which include the pressure-sensitive adhesive layer that has reworkability such that it can be easily peeled from a component, and that has satisfactory processability such that it can be processed without pressure-sensitive adhesive stain or dropout, after it is formed on an optical film. A pressure-sensitive adhesive optical film produced using the composition is also provided. The pressure-sensitive adhesive composition includes a (meth)acrylic polymer including (a) 34 to 94% by weight of an alkyl (meth)acrylate monomer unit, (b) 5 to 35% by weight of an aromatic ring-containing (meth)acrylate monomer unit, and (c) 0.01 to 0.5% by weight of an amino group-containing (meth)acrylate monomer unit and further including (d) 0.05 to 3% by weight of a carboxyl group-containing (meth)acrylate monomer unit and/or (e) 0.05 to 2% by weight of a hydroxyl group-containing (meth)acrylate monomer unit and having a weight average molecular weight of 1,600,000 to 3,000,000 as determined by gel permeation chromatography; crosslinking agents including 0.01 to 5 parts by weight of an isocyanate crosslinking agent and 0.01 to 2 parts by weight of a silane coupling agent based on 100 parts by weight of the (meth)acrylic polymer.

    摘要翻译: 提供了一种用于光学膜的压敏粘合剂组合物。 该组合物可以形成一种压敏粘合剂层,其可以防止由与诸如光学膜的组分的尺寸变化相关的应力引起的光泄漏,其包括具有可再加工性的压敏粘合剂层,使得其可以容易地从 并且具有令人满意的加工性,使得其可以在形成在光学膜上之后可以被加工而没有压敏粘合剂污渍或脱落。 还提供了使用该组合物制备的压敏粘合剂光学膜。 压敏粘合剂组合物包括(甲基)丙烯酸类聚合物,其包含(a)34-94重量%的(甲基)丙烯酸烷基酯单体单元,(b)5-35重量%的含芳环的(甲基) )丙烯酸酯单体单元,(c)0.01〜0.5重量%的含氨基(甲基)丙烯酸酯单体单元,进一步含有(d)0.05〜3重量%的含羧基的(甲基)丙烯酸酯单体 单元和/或(e)0.05〜2重量%的含羟基的(甲基)丙烯酸酯单体单元,通过凝胶渗透色谱法测定的重均分子量为1,600,000至3,000,000; 交联剂,其包含0.01至5重量份的异氰酸酯交联剂和基于100重量份的(甲基)丙烯酸类聚合物)的0.01至2重量份的硅烷偶联剂。