Abstract:
Each of the portions corresponding to the crossings of a plurality of first strip conductive layers serving as bit lines and a plurality of second strip conductive layers serving as word lines crossing the conductive layers at right angles is used as one memory cell. An oxide film is provided between the first strip conductive layers and the second strip conductive layers. The thickness of this oxide film is set in each memory cell according to stored data. Also a multi-value memory can be realized, since the amount of stored data in each memory cell is an arbitrary amount of 1 bit or more by making the stored data of a plurality of types of memory cells having different thicknesses in the tunnel oxide film 15 correspond to a plurality of different data. The size of each memory cell can be reduced since the occupying area of each memory cell on the semiconductor substrate is dependent on the width of the first strip conductive layer and the second strip conductive layer. An insulation film in which tunnel phenomenon is generated can be formed using conventional manufacturing technology.
Abstract:
In accordance with one aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip which is directly covered with a resin material having a light shielding property as well as a film which is provided on the resin material for shielding the semiconductor device against light. The film may be formed by a seal having a surface which is covered with a metal and a rear surface which is colored black, a layer of a metal or ceramics which is deposited in a vapor phase, or a coating of an insulating material whose refractive index is different from that of the resin material. In another aspect of the present invention, provided is a semiconductor device which is directly covered with a resin material mixed with a light absorbing material. In still another aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip, having a surface covered with black polyimide, which is further covered with a resin material having a light shielding property. In a further aspect of the present invention, provided is a package for covering a semiconductor device which is mounted on a wiring board. According to such improvement, a light shielding property is improved particularly in relation to a thin semiconductor device whose thickness is only about 1 mm, and the semiconductor device is prevented from a malfunction caused by light.
Abstract:
Provided is a semiconductor device comprising a semiconductor chip which is directly covered with a resin material having a light shielding property as well as a film which is provided on the resin material for shielding the semiconductor device against light. The film may be formed by a seal having a surface which is covered with a metal and a rear surface which is colored black, a layer of a metal or ceramics which is deposited in a vapor phase, or a coating of an insulating material whose refractive index is different from that of the resin material. In another aspect of the present invention, provided is a semiconductor device which is directly covered with a resin material mixed with a light absorbing material. In still another aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip, having a surface covered with black polyimide, which is further covered with a resin material having a light shielding property. In a further aspect of the present invention, provided is a package for covering a semiconductor device which is mounted on a wiring board. According to such improvement, a light shielding property is improved particularly in relation to a thin semiconductor device whose thickness is only about 1 mm, and the semiconductor device is prevented from a malfunction caused by light.
Abstract:
Each of the portions corresponding to the crossings of a plurality of first strip conductive layers serving as bit lines and a plurality of second strip conductive layers serving as word lines crossing the conductive layers at right angles is used as one memory cell. An oxide film is provided between the first strip conductive layers and the second strip conductive layers. The thickness of this oxide film is set in each memory cell according to stored data. Also a multi-value memory can be realized, since the amount of stored data in each memory cell is an arbitrary amount of 1 bit or more by making the stored data of a plurality of types of memory cells having different thicknesses in the tunnel oxide film 15 correspond to a plurality of different data. The size of each memory cell can be reduced since the occupying area of each memory cell on the semiconductor substrate is dependent on the width of the first strip conductive layer and the second strip conductive layer. An insulation film in which tunnel phenomenon is generated can be formed using conventional manufacturing technology.
Abstract:
A semiconductor storage device formed on a single chip includes a ROM, a RAM and an input/output port. When a mode setting signal designates a normal mode, access is made to one of the ROM, RAM and input/output port in response to an address signal. The ROM is accessed when the mode setting signal designates a ROM write mode and the address signal designates an address assigned to the ROM. A dummy data is output from a data input/output terminal when the mode setting signal designates the ROM write mode, the address signal designates an address outside an address region assigned to the ROM, and a read signal is applied to the device.
Abstract:
A display-integrated image forming apparatus is provided that requires no large disposition location and an extremely simple disposition operation and that is capable of acquiring sufficient advertising effects for pedestrians on sidewalks.The display-integrated image forming apparatus comprises an image forming device including a document reading portion and a printing portion and a displaying device including a first display screen viewable from the backside or the side of the image forming device. When a user selects arbitrary information from provision information displayed on the first display screen, the first display screen displays information related to printing such as a password. By operating the image forming device to input the password the user visually recognizing the information is able to print out information preliminarily correlated with the selected provision information.
Abstract:
A multi-band flat antenna that shows excellent radio characteristics in each of multiple different frequency bands. In a patch antenna, a plurality of flat antenna patterns for different frequency bands are formed on a dielectric substrate. The dielectric substrate has different plate thicknesses in each of the regions where the flat antenna patterns are formed.
Abstract:
In order to achieve a digital video camera apparatus which decreases the number of components and facilitates connection with a digital VTR, a luminance signal Y and a color signal C input form external input terminals (110, 118) are converted into digital signals by A/D converters (136, 138) by sampling these signals respectively at the sampling frequency of a digital recording/reproduction device (113) and a frequency four times the subcarrier frequency, the digital signals are selected by selectors (135, 137) together with signals Y and C from a digital signal processing circuit (106), and the selected signals are supplied to the digital signal recording/reproduction device (113). Color-difference signals are supplied after their frequency is converted into the sampling frequency of the digital signal recording/reproduction device (113) by frequency converters (139a, 139b).
Abstract:
A holder is suspended on a carriage, and a magnetic circuit is disposed adjacent to the holder. The magnetic circuit has a first magnetic pole and a second magnetic pole. A focus coil having a magnetic flux receiving portion is provided around a vertical axis of the holder. A tacking coil having a magnetic flux receiving portion is provided around a horizontal axis of the holder. Both the magnetic flux receiving portions are disposed so as not to be overlapped with each other, and disposed in parallel with one of the surface of the first and second magnetic poles. Both of the magnetic flux receiving portions are flush with each other.
Abstract:
A semiconductor memory device having an error correcting circuit includes a circuit for generating a desired test signal with which memory cells used for error correction are to be tested, and another circuit for judging on an chip-basis whether memory cells of the semiconductor memory device are normal or not. The memory cells for error correction can be tested accurately by application of desired test signal. In addition, since there is no necessity of provision of a circuit for comparing externally applied data and data delivered from the semiconductor memory device, a test can be preformed readily.