Abstract:
A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
Abstract:
A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
Abstract:
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
Abstract:
A heat-resistant member is constructed by having a ceramic coating layer deposited on the surface of a metallic substrate through the medium of a metallic bonding layer. The metallic bonding layer is composed of at least two layers, i.e. a layer of an aggregate of minute particles disposed on the metallic substrate side and a layer of an aggregate of coarse particles disposed on the ceramic coating layer side. Otherwise, the metallic bonding layer is composed of at least three layers, i.e. two layers of an aggregate of coarse particles disposed one each on the metallic substrate side and the ceramic coating layer side and one layer of an aggregate of minute particles interposed between these two layers of an aggregate of coarse particles. These layers are obtained by the low pressure ambient plasma thermal spraying using a fine powder or a coarse powder of an alloy resistant to corrosion and oxidation. The metallic bonding layer constructed as described above is excellent in the ability to resist high temperature oxidation and high temperature corrosion and stable to tolerate thermal fatigue and thermal impacts. Thus, it is capable of preventing the thermal barrier coating layer from sustaining cracks or inducing film separation.
Abstract:
A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
Abstract:
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
Abstract:
Disclosed is a paper cord which is used for binding old newspaper or old magazines for recycling and which can be charged into a material dissolving apparatus together with the old newspaper or the old magazines.The paper cord is prepared by twisting a base paper which is a recycled paper characterized by a content of recycled pulp from old newspaper of 33% or more and a total content of recycled pulp including recycled pulp from other sources of 50% or more as well as by whiteness and strength equivalent to or better than those of newsprint paper and degree of sizing equivalent to that of newsprint paper for offset printing.
Abstract:
A workpiece consisting essentially of sintered tungsten carbide alloy having added thereto titanium carbide and/or tantalum carbide is electrolytically machined using an aqueous electrolyte solution consisting essentially of 5% to saturated value by weight of an alkali metal chloride selected from the group consisting of sodium chloride and potassium chloride, and an alkali metal compound selected from the group consisting of 3.6%-5.3% by weight of sodium hydroxide, up to 7.5% by weight of potassium hydroxide, up to 7.1% by weight of sodium carbonate, up to 9.2% by weight of potassium carbonate, up to 11.2% by weight of sodium bicarbonate, and up to 13.3% by weight of potassium bicarbonate. The workpiece is positioned opposite a machining electrode with a small machining gap therebetween and an alternating electric current is passed serially through the electrolyte solution in the machining gap, through the workpiece and through the machining electrode to render the workpiece anodic during part of the alternating current cycle so as to form oxides including water-insoluble tungsten oxide and titanium oxide and/or tantalum oxide on the workpiece surface and to render the workpiece cathodic during the reverse part of the alternating current cycle so as to cause the water-insoluble oxides to react with alkali metal ions in the electrolyte solution to form reaction products which are soluble in water to thereby dissolve the oxides and prevent oxide accumulation on the workpiece surface.
Abstract:
A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
Abstract:
A chip-type solid electrolytic capacitor having two capacitor elements using a valve metal and laminated in a direction perpendicular to a mounting surface to be mounted on a substrate. A pair of anode lead wires are extracted on one side from anode members of the capacitor elements in parallel to the mounting surface. The anode lead wires are connected to two branches of an anode terminal portion, respectively. A cathode terminal is connected to cathode layers on dielectric oxide films of the anode members. The solid electrolytic capacitor is encapsulated in an encapsulating resin with the anode terminal and the cathode terminal partially exposed. The branches of the anode terminal portion are configured so that they overlap each other by rotation of 180° around a center line.