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    Transparent resin composition
    1.
    发明授权
    Transparent resin composition 失效
    透明树脂组合物

    公开(公告)号：US07619037B2

    公开(公告)日：2009-11-17

    申请号：US10560782

    申请日：2004-06-18

    申请人： Shoichi Higuchi ,  Satoshi Ogawa ,  Hironobu Tokunaga

    发明人： Shoichi Higuchi ,  Satoshi Ogawa ,  Hironobu Tokunaga

    IPC分类号： C08L53/00 ,  C09K3/16

    CPC分类号： C08J5/00 ,  C08L25/02 ,  C08L67/00 ,  C08L69/00 ,  C08L87/005 ,  C08L2205/00 ,  G02B1/04 ,  C08L2666/22

    摘要： The present invention has its object to provide a thermoplastic resin for producing moldings having enough transparency and excellent in permanent antistatic properties and mechanical properties. The present invention provides a transparent resin composition which comprises at least one block polymer (A) selected from the group consisting of specific block polymers (A1) and (A2) and a transparent resin (B), with the difference in refractive index between (A) and (B) being not more than 0.01.

    摘要翻译： 本发明的目的是提供一种用于制造具有足够透明性和优异的永久抗静电性能和机械性能的模制品的热塑性树脂。 本发明提供了一种透明树脂组合物，其包含至少一种选自特定嵌段聚合物（A1）和（A2）和透明树脂（B）的嵌段聚合物（A），折射率之差（ A）和（B）不大于0.01。

    Block polymer and antistatic agent comprising the same
    3.
    发明授权
    Block polymer and antistatic agent comprising the same 有权
    嵌段聚合物和包含其的抗静电剂

    公开(公告)号：US06552131B1

    公开(公告)日：2003-04-22

    申请号：US09913169

    申请日：2001-12-12

    申请人： Shoichi Higuchi ,  Eiichi Senda

    发明人： Shoichi Higuchi ,  Eiichi Senda

    IPC分类号： C08L2304

    CPC分类号： C09D153/00 ,  C08F255/00 ,  C08F255/02 ,  C08G81/025 ,  C08L23/02 ,  C08L51/06 ,  C08L53/00 ,  C08L53/005 ,  C08L59/00 ,  C08L67/00 ,  C08L71/02 ,  C08L77/00 ,  C09D151/06 ,  C09D153/005 ,  C08L2666/24 ,  C08L2666/22 ,  C08L2666/20 ,  C08L2666/18 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/14

    摘要： The present invention provides a block polymer comprising a polyolefin and a hydrophilic polymer, being finely dispersed in resins, in particular polyolefins, without requiring any compatibilizer, and giving thermoplastic resin compositions, said compositions giving moldings having permanent antistatic properties at low block polymer addition levels even when they are produced by a method involving no shearing and having excellent mechanical strength as well as having an excellent compatibility so as to avoid molding or roll pollution at their formation. The present invention provides a block polymer (A) which has a structure such that blocks of a polyolefin (a) and blocks of a hydrophilic polymer (b) having a volume resistivity of 105 to 1011 &OHgr;·cm are bonded together alternately and repeatedly; an antistatic agent comprising the block polymer (A); a resin composition comprising the block polymer (A) and a thermoplastic resin (B); and a molded product obtainable by coating or printing a molding comprised of a resin composition containing the block polymer (A).

    摘要翻译： 本发明提供了包含聚烯烃和亲水性聚合物的嵌段聚合物，其被精细地分散在树脂中，特别是聚烯烃中，而不需要任何增容剂，并且得到热塑性树脂组合物，所述组合物赋予在低嵌段聚合物添加量下具有永久抗静电性能的模制品 即使它们通过不涉及剪切和机械强度优异的方法制造，并且具有优异的相容性，以避免其形成时的模塑或辊污染。本发明提供一种嵌段聚合物（A），其具有如下结构： 聚烯烃（a）的嵌段和体积电阻率为105〜1011欧米茄的亲水性聚合物嵌段（b）交替重复地结合在一起;包含嵌段聚合物（A）的抗静电剂;包含 嵌段聚合物（A）和热塑性树脂（B）; 以及通过涂布或印刷由含有嵌段聚合物（A）的树脂组合物构成的成型体而得到的成型体。

    Method for plating electrodes of ceramic chip electronic components
    4.
    发明授权
    Method for plating electrodes of ceramic chip electronic components 有权
    陶瓷芯片电子部件电极电镀方法

    公开(公告)号：US06911138B2

    公开(公告)日：2005-06-28

    申请号：US10243183

    申请日：2002-09-13

    申请人： Akihiro Motoki ,  Shoichi Higuchi ,  Yoshihiko Takano ,  Kunihiko Hamada

    发明人： Akihiro Motoki ,  Shoichi Higuchi ,  Yoshihiko Takano ,  Kunihiko Hamada

    IPC分类号： C25D3/32 ,  C25D7/00 ,  C25D7/12 ,  C25D17/16 ,  C25D3/60 ,  C25D3/30

    CPC分类号： C25D7/12 ,  C25D3/32 ,  C25D17/16

    摘要： A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.

    摘要翻译： 陶瓷芯片电子部件的电极电镀方法包括在电镀液中进行电镀。 电镀液含有锡（II）氨基磺酸盐，作为锡（II）盐; 包括选自柠檬酸，葡萄糖酸，焦磷酸，庚酸，丙二酸，苹果酸，这些酸的盐和葡萄糖酸内酯中的至少一种的络合剂; 以及包含HLB值为约10以上的至少一种表面活性剂的增白剂。 所得到的陶瓷芯片电子部件的镀锡附着力可以限制在一定水平。

    Electronic component, method for producing electronic component, and circuit board
    5.
    发明授权
    Electronic component, method for producing electronic component, and circuit board 有权

    公开(公告)号：US06537685B2

    公开(公告)日：2003-03-25

    申请号：US09863045

    申请日：2001-05-22

    申请人： Shoichi Higuchi

    发明人： Shoichi Higuchi

    IPC分类号： B32B1501

    CPC分类号： H01G4/232 ,  Y10S428/901 ,  Y10T428/12535 ,  Y10T428/12708 ,  Y10T428/12722 ,  Y10T428/12861 ,  Y10T428/12944 ,  Y10T428/24917 ,  Y10T428/24975 ,  Y10T428/265

    摘要： An electronic component includes external electrodes formed on a base member, each external electrode including a plurality of layers of which the outermost layer is a tin plating layer. The tin plating layer has a polycrystalline structure, and atoms of a metal other than tin are diffused into the tin crystal grain boundaries. Alternatively, each external electrode includes a plurality of layers including a thick-film electrode formed on the base member, a nickel layer or a nickel alloy layer formed on the thick-film electrode and a tin plating layer formed on the nickel layer or the nickel alloy layer. The tin plating layer has a polycrystalline structure and nickel atoms are diffused into the tin crystal grain boundaries. Methods for fabricating electronic components and a circuit board provided with a plurality of electronic components are also disclosed.

    Process for manufacturing electronic part
    6.
    发明授权
    Process for manufacturing electronic part 有权
    电子零件制造工艺

    公开(公告)号：US06769160B2

    公开(公告)日：2004-08-03

    申请号：US10087767

    申请日：2002-03-05

    申请人： Shoichi Higuchi ,  Tatsuo Kunishi ,  Yukio Hamaji

    发明人： Shoichi Higuchi ,  Tatsuo Kunishi ,  Yukio Hamaji

    IPC分类号： H01G700

    CPC分类号： H01G4/232 ,  H01C1/148 ,  H01C17/283 ,  Y10T29/417 ,  Y10T29/435 ,  Y10T29/49098 ,  Y10T29/49144 ,  Y10T428/12708

    摘要： A process for manufacturing an electronic part having a ceramic body and an outer electrode form on the surface of the body, the outer electrode including a plurality of layers and having a Sn plating layer as the outermost layer. The Sn plating layer having an average crystal grain size of about 1 &mgr;m or less is formed on a Ni or Ni alloy by electroplating in a plating bath having a pH of about 3 to 10.

    摘要翻译： 一种制造在本体表面上具有陶瓷体和外部电极的电子部件的制造方法，其特征在于，所述外部电极具有多层，并具有Sn镀层作为最外层。 通过在pH为约3〜10的电镀浴中电镀，在Ni或Ni合金上形成平均结晶粒径为1μm以下的Sn镀层。

    Electronic component, method for producing electronic component, and circuit board
    8.
    发明授权
    Electronic component, method for producing electronic component, and circuit board 有权
    电子部件，电子部件的制造方法以及电路基板

    公开(公告)号：US06773827B2

    公开(公告)日：2004-08-10

    申请号：US09863045

    申请日：2001-05-22

    申请人： Shoichi Higuchi

    发明人： Shoichi Higuchi

    IPC分类号： B32B1501

    CPC分类号： H01G4/232 ,  Y10S428/901 ,  Y10T428/12535 ,  Y10T428/12708 ,  Y10T428/12722 ,  Y10T428/12861 ,  Y10T428/12944 ,  Y10T428/24917 ,  Y10T428/24975 ,  Y10T428/265

    摘要： An electronic component includes external electrodes formed on a base member, each external electrode including a plurality of layers of which the outermost layer is a tin plating layer. The tin plating layer has a polycrystalline structure, and atoms of a metal other than tin are diffused into the tin crystal grain boundaries. Alternatively, each external electrode includes a plurality of layers including a thick-film electrode formed on the base member, a nickel layer or a nickel alloy layer formed on the thick-film electrode and a tin plating layer formed on the nickel layer or the nickel alloy layer. The tin plating layer has a polycrystalline structure and nickel atoms are diffused into the tin crystal grain boundaries. Methods for fabricating electronic components and a circuit board provided with a plurality of electronic components are also disclosed.

    摘要翻译： 电子部件包括形成在基体部件上的外部电极，每个外部电极包括多个层，其中最外层是镀锡层。 镀锡层具有多晶结构，锡以外的金属原子扩散到锡晶界。 或者，每个外部电极包括多个层，包括形成在基底构件上的厚膜电极，形成在厚膜电极上的镍层或镍合金层和形成在镍层或镍上的锡镀层 合金层。 锡镀层具有多晶结构，镍原子扩散到锡晶界。 还公开了制造电子部件的方法和设置有多个电子部件的电路板。