摘要:
Charge generated in a photodiode is properly split for difference processing. An imaging element is constituted by a semiconductor such that a charge accumulation portion is connected to a light receiving portion using a buried photodiode and charge is split from the charge accumulation portion by a plurality of gates and is accumulated. An imaging device includes a control device performing control so as to accumulate charge that is generated by a photoelectric conversion at an exposure cycle synchronous with the light emission of a light source. The exposure cycle includes a first period for receiving reflection light from a subject illuminated by light from the light source and a second period for receiving light from the subject illuminated by an environmental light not including the light from the light source. The imaging device includes a charge accumulation region connected to each photoelectric conversion region, a first charge storage region for receiving charge generated in the photoelectric conversion regions during the first period via the charge accumulation portion, and a second charge storage region for receiving charge generated in the photoelectric conversion regions during the second period via the charge accumulation portion.
摘要:
A optical-information acquisition element encompasses a semiconductor layer (31) of a p-type, a surface-buried region (33) of a n-type buried in the semiconductor layer (31) so as to implement a photodiode with the semiconductor layer (31), a charge-accumulation region (36) of the n-type buried in the surface-buried region (33), configured to accumulate charges generated by the photodiode, a barrier-creating region of the p-type buried in the surface-buried region (33) so as to sandwich the surface-buried region (33) with the semiconductor layer (31), configured to create a potential barrier, and a charge-exhaust region (34) of the n-type buried in the semiconductor layer (31), configured to store and to extract excess charges which surmount the potential barrier and flow out from the charge-accumulation region (36). The changes of potential level of the charge-accumulation region (36) are extracted as signals, after receiving optical-communication signals. An optical-information-acquisition element array and a hybrid solid-state imaging device are also provided.
摘要:
A pre-amplifier (column region unit) of a solid-state imaging device including a pixel-signal controller. The pixel-signal controller, for each vertical signal line, detects the level of each pixel signal independently by a pixel-signal detector on the output side of a pixel-signal amplifier, and sets a gain independently to the pixel-signal amplifier according to the level of the signal. At a subsequent stage of the solid-state imaging device, an analog-to-digital (A/D) converter and a signal extending unit are provided. The A/D converter digitizes a pixel signal, and the digitized pixel signal is corrected by a gain set to the pixel-signal amplifier with reference to a classification signal from the pixel-signal detector, so that the dynamic range of signals of one screen is extended.
摘要翻译:包括像素信号控制器的固态成像装置的前置放大器(列区域单元)。 像素信号控制器对于每个垂直信号线,由像素信号放大器的输出侧的像素信号检测器独立地检测每个像素信号的电平,并且根据图像信号放大器独立地设置增益 信号的电平。 在固态成像装置的后续阶段,提供了模数(A / D)转换器和信号延伸单元。 A / D转换器对像素信号进行数字化,参照来自像素信号检测器的分类信号,通过设置到像素信号放大器的增益来校正数字化像素信号,使得一个屏幕的信号的动态范围 延长了
摘要:
A semiconductor element includes: a p-type semiconductor region; an n-type light-receiving surface buried region buried in the semiconductor region; an n-type charge accumulation region buried in the semiconductor region, continuously to the light-receiving surface buried region, establishing a deeper potential well depth than the light-receiving surface buried region; a charge read-out region configured to read out the charges accumulated in the charge accumulation region; an exhaust-drain region buried in the semiconductor region, configured to extract the charges from the light-receiving surface buried region; a first potential controller configured to extract the charges from the light-receiving surface buried region to the exhaust-drain region; and a second potential controller configured to transfer the charges from the charge accumulation region to the charge read-out region.
摘要:
A distance image sensor capable of enlarging the distance measurement range without reducing the distance resolution is provided. A radiation source 13 provides first to fifth pulse trains PT1 to PT5 which are irradiated to the object as radiation pulses in the first to fifth frames arranged in order on a time axis. In each of the frames, imaging times TPU1 to TPU5 are prescribed at points of predetermined time ΔTPD from the start point of each frame, also the pulses PT1 to PT5 are shifted respectively by shift amounts different from each other from the start point of the first to fifth frames. A pixel array 23 generates element image signals SE1 to SE5 each of which has distance information of an object in distance ranges different from each other using imaging windows A and B in each of five frames. A processing unit 17 generates an image signal SIMAGE by combining the element image signals. Since five times-of-flight measurement are used, the width of the radiation pulse does not have to be increased to obtain distance information of the object in a wide distance range, and the distance resolution is not reduced.
摘要:
A semiconductor range-finding element and a solid-state imaging device, which can provide a smaller dark current and a removal of reset noise. With n-type buried charge-generation region, buried charge-transfer regions, buried charge read-out regions buried in a surface of p-type semiconductor layer, an insulating film covering these regions, transfer gate electrodes arranged on the insulating film for transferring the signal charges to the buried charge-transfer regions, read-out gate electrodes arranged on the insulating film for transferring the signal charges to the buried charge read-out regions, after receiving a light pulse by the buried charge-generation region, in the semiconductor layer just under the buried charge-generation region, an optical signal is converted into signal charges, and a distance from a target sample is determined by a distribution ratio of the signal charges accumulated in the buried charge-transfer regions.
摘要:
A pre-amplifier (column region unit) of a solid-state imaging device includes a pixel-signal controller. The pixel-signal controller, for each vertical signal line, detects the level of each pixel signal independently by a pixel-signal detector on the output side of a pixel-signal amplifier, and sets a gain independently to the pixel-signal amplifier according to the level of the signal. At a subsequent stage of the solid-state imaging device, an analog-to-digital (A/D) converter and a signal extending unit are provided. The A/D converter digitizes a pixel signal, and the digitized pixel signal is corrected by a gain set to the pixel-signal amplifier with reference to a classification signal from the pixel-signal detector, so that the dynamic range of signals of one screen is extended.
摘要翻译:固态成像装置的前置放大器(列区域单元)包括像素信号控制器。 像素信号控制器对于每个垂直信号线,由像素信号放大器的输出侧的像素信号检测器独立地检测每个像素信号的电平,并且根据图像信号放大器独立地设置增益 信号的电平。 在固态成像装置的后续阶段,提供了模数(A / D)转换器和信号延伸单元。 A / D转换器对像素信号进行数字化,参照来自像素信号检测器的分类信号,通过设置到像素信号放大器的增益来校正数字化像素信号,使得一个屏幕的信号的动态范围 延长了
摘要:
A conversion operation B is performed with respect to a sample value R in an A/D conversion stage 101 to generate a conversion result D3, and a sampling operation A is performed with respect to this conversion result D3 in an A/D conversion stage 103. The conversion operation B is performed with respect to a sample value in an A/D conversion stage 105 to generate a conversion result D4, and the sampling operation A is performed with respect to the conversion result D4 in an A/D conversion stage 107. The conversion operation B is performed with respect to a sample value in an A/D conversion stage 107 to generate a conversion result D5, and the sampling operation A is performed with respect to this conversion result D5 in an A/D conversion stage 101. The conversion operation B is performed with respect to a sample value in the A/D conversion stage 103 to generate a conversion result D6, and the sampling operation A is performed with respect to the conversion result D6 in the A/D conversion stage 105.
摘要:
An image sensor controls the gain of a pixel signal on a pixel-by-pixel basis and extends a dynamic range while maintaining a S/N ratio at a favorable level. A column unit in an image sensor is independently detects a level of each pixel signal and independently sets a gain for level of the signal. A photoelectric converting region unit has pixels arranged two-dimensionally with a vertical signal line for each pixel column to output each pixel signal. The column unit is on an output side of the vertical signal line. The column unit for each pixel column has a pixel signal level detecting circuit, a programmable gain control, a sample and hold (S/H) circuit. Gain correction is performed according to a result of a detected level of the pixel signal.
摘要:
To transfer signal charges generated by a semiconductor photoelectric conversion element in opposite directions, the center line of a first transfer gate electrode and that of a second transfer gate electrodes are arranged on the same straight line, and a U-shaped first exhausting gate electrode and a second exhausting gate electrode are arranged to oppose to each other. The first exhausting gate electrode exhausts background charges generated by a background light in the charge generation region, and the second exhausting gate electrode exhausts background charges generated by the background light in the charge generation region. The background charges exhausted by the first exhausting gate electrode are received by a first exhausting drain region and the background charges exhausted by the second exhausting gate electrode are received by a first exhausting drain region.