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公开(公告)号：US20060102701A1
公开(公告)日：2006-05-18
申请号：US11317146
申请日：2005-12-27
CPC分类号： H01L23/544 , B23K20/007 , H01L24/11 , H01L24/12 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.
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2.发明授权公开(公告)号：US07516878B2
公开(公告)日：2009-04-14
申请号：US11317146
申请日：2005-12-27
CPC分类号： H01L23/544 , B23K20/007 , H01L24/11 , H01L24/12 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.
摘要翻译： 提供了一种用于半导体晶片的凸块形成方法和凸块形成装置，其中与常规技术相比，提高了在半导体晶片上形成凸块时的生产率。 提供了凸块形成头，识别装置和控制装置。 形成在半导体晶片上的IC被分成基本块。 对于包含在一个基本块中的IC，连续执行凸块形成。 只有当凸块形成操作从一个基本块移动到另一个基本块时，才执行其他基本块的位置识别。 因此，与在每个IC上形成凸块时进行位置识别操作的现有技术相比，大大降低了执行位置识别的次数，从而可以提高生产率。
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3.发明授权Method and apparatus for correcting inclination of IC on semiconductor wafer 失效用于校正半导体晶片上IC的倾斜度的方法和装置公开(公告)号：US07031509B2
公开(公告)日：2006-04-18
申请号：US09988704
申请日：2001-11-20
IPC分类号： G06K9/00
CPC分类号： G06T1/0007 , G06T7/0002 , G06T7/0004 , G06T7/73 , G06T2207/30148 , H01L21/681 , H01L23/544 , H01L24/11 , H01L2223/54473 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/45144 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： There are provided a recognition device, a wafer turning member, a turning device, and a control device. A first detection point for recognition and a second detection point for recognition are recognized, on the basis of the result of which a semiconductor wafer is turned to correct the inclination of ICs on the semiconductor wafer. As a result, the recognition operation for detecting the inclination of the ICs when a position of the ICs is to be recognized for bump formation is eliminated. The number of times the recognition is performed is reduced in comparison with the conventional art, so that the productivity can be improved.
摘要翻译： 提供了识别装置，晶片转动构件，转向装置和控制装置。 基于转换半导体晶片以校正半导体晶片上的IC的倾斜度的结果，识别用于识别的第一检测点和用于识别的第二检测点。 结果，消除了当识别用于凸块形成的IC的位置时用于检测IC的倾斜度的识别操作。 与传统技术相比，执行识别的次数减少，从而可以提高生产率。
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4.发明授权ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE 失效电荷生成半导体基板保存形成装置的方法，从电荷产生电子基板去除电荷的方法，用于从电荷产生半导体基板去除电荷和电荷产生半导体基板公开(公告)号：US06818975B1
公开(公告)日：2004-11-16
申请号：US10019700
申请日：2002-01-02
IPC分类号： H01L2302
CPC分类号： H01L21/67144 , H01L21/67138
摘要： The present invention provides a bump forming apparatus (101, 501) which can prevent charge appearance semiconductor substrates (201, 202) from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer (202) because of the cooling is removed through direct contact with a post-forming bumps heating device (170), or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.
摘要翻译： 本发明提供一种可防止电荷外观半导体衬底（201,202）发生热释电和物理故障的凸块形成装置（101,501），用于去除电荷外观半导体衬底的电荷的凸块形成装置执行的方法， 用于电荷外观半导体衬底的电荷去除单元和电荷外观半导体衬底。 至少当在晶片上连接凸起接合之后晶片被冷却时，由于冷却而积聚在晶片（202）上的电荷通过与后成形凸块加热装置（170）直接接触而被去除，或者电荷 通过降低温度控制来去除，从而可以在非接触状态下去除电荷。 因此，与传统技术相比，可以减少晶片的电荷量，从而防止晶片对晶片本身的热释电和损坏（例如断裂等）。
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公开(公告)号：US07052984B2
公开(公告)日：2006-05-30
申请号：US10415587
申请日：2001-11-16
IPC分类号： H01L21/44
CPC分类号： H01L23/544 , B23K20/007 , H01L24/11 , H01L24/12 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.
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6.发明授权Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate 失效用于充电外观半导体衬底的凸块形成装置，充电外观半导体衬底的电荷去除方法，电荷外观半导体衬底的电荷去除单元和电荷外观半导体衬底公开(公告)号：US07014092B2
公开(公告)日：2006-03-21
申请号：US10651103
申请日：2003-08-29
IPC分类号： H01L29/681 , B23Q15/00
CPC分类号： H01L21/67144 , H01L21/67138
摘要： The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer because of the cooling is removed through direct contact with a post-forming bumps heating device, or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.
摘要翻译： 本发明提供一种可以防止电荷外观半导体衬底发生热释电和物理故障的凸块形成装置，用于去除电荷外观半导体衬底的电荷的凸块形成装置，用于充电外观半导体衬底的电荷去除单元， 和电荷外观半导体衬底。 至少当在晶片上连接凸起焊接之后晶片被冷却时，由于冷却而积聚在晶片上的电荷通过与后成形凸块加热装置的直接接触而被去除，或者通过减少电荷来除去电荷 温度控制使得电荷可以在非接触状态下去除。 因此，与传统技术相比，可以减少晶片的电荷量，从而防止晶片对晶片本身的热释电和损坏（例如断裂等）。
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7.发明授权BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, AND CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE 失效用于充电外观半导体基板的封装形成装置，用于充电外观半导体基板的充电去除方法，充电外观半导体基板的充电单元和充电外观半导体基板公开(公告)号：US07005368B1
公开(公告)日：2006-02-28
申请号：US10651199
申请日：2003-08-29
IPC分类号： H01L21/44
CPC分类号： H01L21/67144 , H01L21/67138 , Y10S438/974
摘要： The present invention provides a bump forming apparatus (101, 501) which can prevent charge appearance semiconductor substrates (201, 202) from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer (202) because of the cooling is removed through direct contact with a post-forming bumps heating device (170), or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.
摘要翻译： 本发明提供一种可防止电荷外观半导体衬底（201,202）发生热释电和物理故障的凸块形成装置（101,501），用于去除电荷外观半导体衬底的电荷的凸块形成装置执行的方法， 用于电荷外观半导体衬底的电荷去除单元和电荷外观半导体衬底。 至少当在晶片上连接凸起接合之后晶片被冷却时，由于冷却而积聚在晶片（202）上的电荷通过与后成形凸块加热装置（170）直接接触而被去除，或者电荷 通过降低温度控制来去除，从而可以在非接触状态下去除电荷。 因此，与传统技术相比，可以减少晶片的电荷量，从而防止晶片对晶片本身的热释电和损坏（例如断裂等）。
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公开(公告)号：US07021357B2
公开(公告)日：2006-04-04
申请号：US10234118
申请日：2002-09-05
申请人： Ryoichiro Katano , Shinjiro Tsuji , Shinji Kanayama , Masahiko Ikeya , Yasutaka Tsuboi , Akimitsu Mukai , Yasuhiro Noma
发明人： Ryoichiro Katano , Shinjiro Tsuji , Shinji Kanayama , Masahiko Ikeya , Yasutaka Tsuboi , Akimitsu Mukai , Yasuhiro Noma
IPC分类号： B29C65/00
CPC分类号： B23Q7/1473 , B23Q3/088 , Y10T29/5124 , Y10T29/5137 , Y10T29/53178 , Y10T156/1744
摘要： A component-mounting apparatus is provided with a pallet-carrying unit that carries a pallet, holding boards, within the apparatus. The pallet-carrying unit carries the pallet to a loading unit for feeding boards to the pallet, an ACF applying unit for applying an ACF tape onto the boards, a pre-press bonding unit for positioning components relative to the boards and bonding the components with a first pressing force, a final bonding unit for bonding the components to the boards with a second pressing force larger than the first pressing force so as to fix the components onto the boards, and an unloading unit for removing the boards, with the components mounted thereon, from the pallet. Then, the pallet-carrying unit returns the pallet from the unloading unit to the loading unit.
摘要翻译： 组件安装设备设置有托盘承载单元，该托盘承载单元在设备内承载托盘，保持板。 托盘承载单元将托盘运送到用于将托板馈送到托盘的加载单元，用于将ACF带施加到板上的ACF施加单元，用于相对于板定位部件并将部件与 第一按压力，用于以大于第一按压力的第二按压力将部件粘合到板上以将部件固定到板上的最终接合单元，以及用于移除板的卸载单元，其中部件安装 在其上。 然后，托盘承载单元将托盘从卸载单元返回到装载单元。
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9.发明申请COMPONENT MOUNTING APPARATUS, ILLUMINATING APPARATUS USED IN IMAGING AND ILLUMINATING METHOD 审中-公开组件安装设备，成像和照明方法中使用的照明设备公开(公告)号：US20120262567A1
公开(公告)日：2012-10-18
申请号：US13517152
申请日：2011-08-04
CPC分类号： H05K13/0812
摘要： A component mounting apparatus, an illuminating apparatus used in imaging in the component mounting apparatus and an illuminating method are provided which can support various recognition objects and can meet the requirement of downsizing by reducing the occupied space. In the component mounting apparatus which performs an operation for mounting a component on a board (3), when illumination light is irradiated to the board (3) at the time of imaging with a board recognition camera (12), and when the illumination light is irradiated from a light emitting panel (15) which is formed by laminating a light source portion (13) and a color liquid crystal panel (14) and in which a plurality of light emitting portions whose light emission states can be individually changed are orderly arranged, the color tone of the illumination light which is irradiated from the respective light emitting portions and the color tone distribution of the illumination light in the light emitting panel (15) are made to be changed on the basis of the imaging object. Therefore, while the imaging can be made on conditions suitably corresponding to various recognition objects, the requirement of downsizing can be met by reducing the occupied space of an illuminating portion (20).
摘要翻译： 提供了一种部件安装装置，用于部件安装装置成像的照明装置和照明方法，其可以支持各种识别对象，并且可以通过减少占用空间来满足小型化的要求。 在将部件安装在基板（3）上的部件安装装置中，在利用基板识别照相机（12）成像时照明光照射到基板（3）时，当照明光 从通过层叠光源部（13）和彩色液晶面板（14）而形成的发光面板（15）照射，并且其中可以单独改变发光状态的多个发光部分是有序的 根据成像对象，使从各个发光部照射的照明光的色调和发光面板（15）中的照明光的色调分布变化。 因此，通过适当地对应于各种识别对象的条件进行成像，可以通过减少照明部（20）的占用空间来满足小型化的要求。
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公开(公告)号：US5825914A
公开(公告)日：1998-10-20
申请号：US678658
申请日：1996-07-11
CPC分类号： G06T7/606 , G06T2207/30108
摘要： It is intended to accurately detect the centerline or center of electronic component by relieving effects of brightness or darkness or the like caused by the shape or color of the component, irregularity on the surface or how illuminance is projected on the component through statistical processing. To this end, the present invention comprises a first step for determining edge points of opposing sides of said component, a second step for determining two-dimensional coordinate axes which are established to make a deflection angle of said component zero, a third step for projecting the center position of two edge points in total each of which is arbitrarily selected from each side to a coordinate axis of said two-dimensional coordinate axes orthogonal to said opposing sides, and creating a histogram on said coordinate axis by projecting and adding the positions of center repeatedly obtained onto said coordinate axis, and a fourth step for detecting the peak position of the histogram obtained from the result of processing of said third step, and determining a line passing through the peak position and parallel to said opposing sides as the centerline of component.
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