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公开(公告)号：US20050079685A1
公开(公告)日：2005-04-14
申请号：US10683202
申请日：2003-10-09
IPC分类号： H01L21/46 , H01L23/485 , H01L25/065
CPC分类号： H01L24/12 , H01L24/11 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/11822 , H01L2224/13099 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2224/81894 , H01L2225/06513 , H01L2225/06527 , H01L2225/06582 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14
摘要： The invention provides a stacked wafer structure with decreased failures. In one embodiment, there is a barrier layer deposited on exposed surfaces of conductors that extend across a distance between first and second device structures. The barrier layer may prevent diffusion and electromigration of the conductor material, which may decrease incidences of shorts and voids in the stacked wafer structure.
摘要翻译： 本发明提供了具有降低的故障的堆叠晶片结构。 在一个实施例中，存在沉积在导体的暴露表面上的阻挡层，其延伸跨越第一和第二器件结构之间的距离。 阻挡层可以防止导体材料的扩散和电迁移，这可能降低层叠晶片结构中的短路和空隙的发生。
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公开(公告)号：US07214605B2
公开(公告)日：2007-05-08
申请号：US10683202
申请日：2003-10-09
IPC分类号： H01L21/44
CPC分类号： H01L24/12 , H01L24/11 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/11822 , H01L2224/13099 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2224/81894 , H01L2225/06513 , H01L2225/06527 , H01L2225/06582 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14
摘要： The invention provides a stacked wafer structure with decreased failures. In one embodiment, there is a barrier layer deposited on exposed surfaces of conductors that extend across a distance between first and second device structures. The barrier layer may prevent diffusion and electromigration of the conductor material, which may decrease incidences of shorts and voids in the stacked wafer structure.
摘要翻译： 本发明提供了具有降低的故障的堆叠晶片结构。 在一个实施例中，存在沉积在导体的暴露表面上的阻挡层，其延伸跨越第一和第二器件结构之间的距离。 阻挡层可以防止导体材料的扩散和电迁移，这可能降低层叠晶片结构中的短路和空隙的发生。
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公开(公告)号：US20120280387A1
公开(公告)日：2012-11-08
申请号：US13470822
申请日：2012-05-14
申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
IPC分类号： H01L23/498
CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号：US20090174070A1
公开(公告)日：2009-07-09
申请号：US12319035
申请日：2008-12-31
申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobnnsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobnnsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
IPC分类号： H01L23/498
CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号：US20110260319A1
公开(公告)日：2011-10-27
申请号：US13103267
申请日：2011-05-09
申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
IPC分类号： H01L23/498
CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号：US20050003650A1
公开(公告)日：2005-01-06
申请号：US10610743
申请日：2003-07-02
申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Chan , Mauro Kobrinsky , Sarah Kim , Kevin O'Brien , Michael Harmes , Thomas Marieb
发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Chan , Mauro Kobrinsky , Sarah Kim , Kevin O'Brien , Michael Harmes , Thomas Marieb
IPC分类号： H01L21/60 , H01L21/98 , H01L25/065 , H01L21/44 , H01L21/48 , H01L23/02 , H01L23/48 , H01L23/52
CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号：US08421225B2
公开(公告)日：2013-04-16
申请号：US13470822
申请日：2012-05-14
申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
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公开(公告)号：US08203208B2
公开(公告)日：2012-06-19
申请号：US13103267
申请日：2011-05-09
申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号：US07973407B2
公开(公告)日：2011-07-05
申请号：US12319035
申请日：2008-12-31
申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号：US07800371B2
公开(公告)日：2010-09-21
申请号：US11851291
申请日：2007-09-06
IPC分类号： G01V3/00
CPC分类号： G01N24/08 , B82Y30/00 , G01R33/302
摘要： An embodiment of the invention relates to a portable or handheld device for performing NMR analysis. The device comprises a console and a strip which can be placed into the console through a slot or other means. The strip comprises a sample holding place and a microcoil for generating an excitation magnetic field across a sample in the sample holding space. A permanent magnet is provided either by the console or the strip and generates a static magnetic field which, together with the excitation magnetic field, creates NMR within the sample. Other embodiments of the invention also encompass method of performing NMR analysis using the portable device and method of making such devices.
摘要翻译： 本发明的实施例涉及用于执行NMR分析的便携式或手持式装置。 该装置包括控制台和条，其可以通过槽或其他方式放置到控制台中。 条带包括用于在样品保持空间中的样品上产生激发磁场的样品保持位置和微线圈。 永久磁铁由控制台或条带提供，并产生一个静磁场，与磁场一起在样品内产生NMR。 本发明的其他实施方案还包括使用便携式装置进行NMR分析的方法和制造这种装置的方法。
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