专利检索 ap:("Shriram Ramanathan" OR "Patrick Morrow" OR "Scott List" OR "Michael Chan" OR "Mauro Kobrinsky" OR "Sarah Kim" OR "Kevin O'Brien" OR "Michael Harmes" OR "Thomas Marieb") AND inv:"Shriram Ramanathan" 第 1 页

1.

发明申请
Three-dimensional stacked substrate arrangements 审中-公开
标题翻译：三维堆叠衬底布置

公开(公告)号：US20050003650A1

公开(公告)日：2005-01-06

申请号：US10610743

申请日：2003-07-02

申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Chan , Mauro Kobrinsky , Sarah Kim , Kevin O'Brien , Michael Harmes , Thomas Marieb

发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Chan , Mauro Kobrinsky , Sarah Kim , Kevin O'Brien , Michael Harmes , Thomas Marieb

IPC分类号： H01L21/60 , H01L21/98 , H01L25/065 , H01L21/44 , H01L21/48 , H01L23/02 , H01L23/48 , H01L23/52

CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041

摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。

2.

发明申请
Method of forming self-passivating interconnects and resulting devices 有权
标题翻译：形成自钝化互连和所产生的器件的方法

公开(公告)号：US20060220197A1

公开(公告)日：2006-10-05

申请号：US11081187

申请日：2005-03-16

申请人： Mauro Kobrinsky , Jun He , Kevin O'Brien , Patrick Morrow , Ying Zhou , Shriram Ramanathan

发明人： Mauro Kobrinsky , Jun He , Kevin O'Brien , Patrick Morrow , Ying Zhou , Shriram Ramanathan

IPC分类号： H01L23/02

CPC分类号： H01L21/76867 , B23K35/302 , H01L21/76852 , H01L21/76885 , H01L21/76886 , H01L21/76888 , H01L24/11 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05547 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/13147 , H01L2224/81801 , H01L2224/81894 , H01L2224/9202 , H01L2225/06513 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043 , H01L2224/48 , H01L2924/013

摘要： A method of forming self-passivating interconnects. At least one of two mating bond structures is formed, at least in part, from an alloy of a first metal and a second metal (or other element). The second metal is capable of migrating through the first metal to free surfaces of the mating bond structures. During bonding, the two mating bond structures are bonded together to form an interconnect, and the second metal segregates to free surfaces of this interconnect to form a passivation layer. Other embodiments are described and claimed.

摘要翻译： 一种形成自钝化互连的方法。至少部分地由第一金属和第二金属（或其它元素）的合金形成两个匹配结合结构中的至少一个。第二金属能够通过第一金属迁移到配合结合结构的自由表面。在接合期间，两个配对结合结构结合在一起以形成互连，并且第二金属分离到该互连的自由表面以形成钝化层。描述和要求保护其他实施例。

3.

发明授权
Three-dimensional stacked substrate arrangements 有权

公开(公告)号：US08421225B2

公开(公告)日：2013-04-16

申请号：US13470822

申请日：2012-05-14

申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

IPC分类号： H01L23/48 , H01L21/44

CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041

摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

4.

发明授权
Three-dimensional stacked substrate arrangements 有权
标题翻译：三维堆叠衬底布置

公开(公告)号：US08203208B2

公开(公告)日：2012-06-19

申请号：US13103267

申请日：2011-05-09

申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

IPC分类号： H01L23/48 , H01L21/44

CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041

摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。

5.

发明授权
Three-dimensional stacked substrate arrangements 有权
标题翻译：三维堆叠衬底布置

公开(公告)号：US07973407B2

公开(公告)日：2011-07-05

申请号：US12319035

申请日：2008-12-31

申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

IPC分类号： H01L23/48 , H01L21/44

CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041

摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。

6.

发明申请
THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS 有权
标题翻译：三维堆叠基板安装

公开(公告)号：US20110260319A1

公开(公告)日：2011-10-27

申请号：US13103267

申请日：2011-05-09

申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

IPC分类号： H01L23/498

CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041

摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。

7.

发明申请
THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS 有权
标题翻译：三维堆叠基板安装

公开(公告)号：US20120280387A1

公开(公告)日：2012-11-08

申请号：US13470822

申请日：2012-05-14

申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

IPC分类号： H01L23/498

CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041

摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。

8.

发明申请
Three-dimensional stacked substrate arrangements 有权
标题翻译：三维堆叠衬底布置

公开(公告)号：US20090174070A1

公开(公告)日：2009-07-09

申请号：US12319035

申请日：2008-12-31

申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobnnsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobnnsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb

IPC分类号： H01L23/498

CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041

摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

摘要翻译： 具有可靠接合和衬底保护的三维堆叠衬底布置。

9.

发明申请
Highly compliant plate for wafer bonding 有权
标题翻译：用于晶片接合的高度兼容板

公开(公告)号：US20060003547A1

公开(公告)日：2006-01-05

申请号：US10883614

申请日：2004-06-30

申请人： Mauro Kobrinsky , Shriram Ramanathan , Scott List

发明人： Mauro Kobrinsky , Shriram Ramanathan , Scott List

IPC分类号： H01L21/30

CPC分类号： H01L21/76885 , H01L2224/05181 , H01L2224/05186 , H01L2924/04953 , H01L2924/00014

摘要： The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally deflecting the two wafers; and bonding the raised contacts. The present invention also discloses a bonded-wafer structure that includes: a first wafer, the first wafer being locally deflected, the first wafer including a first raised contact; and a second wafer, the second wafer being locally deflected, the second wafer including a second raised contact, wherein the second raised contact is bonded to the first raised contact.

摘要翻译： 本发明公开了一种方法，包括：提供两个晶片; 在两个晶片上形成凸起的接触; 对准两个晶片; 汇集联络人; 局部偏转两片晶片; 并且接合凸起的触点。本发明还公开了一种接合晶片结构，其包括：第一晶片，所述第一晶片被局部偏转，所述第一晶片包括第一凸起接触; 和第二晶片，所述第二晶片局部偏转，所述第二晶片包括第二凸起接触件，其中所述第二凸起接触件接合到所述第一凸起接触件。

10.

发明申请
HIGHLY COMPLIANT PLATE FOR WAFER BONDING 审中-公开
标题翻译：用于波形粘结的高度合适的板

公开(公告)号：US20070284409A1

公开(公告)日：2007-12-13

申请号：US11844293

申请日：2007-08-23

申请人： Mauro Kobrinsky , Shriram Ramanathan , Scott List

发明人： Mauro Kobrinsky , Shriram Ramanathan , Scott List

IPC分类号： H01L21/67

CPC分类号： H01L21/67092 , H01L21/76885 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/17 , H01L24/75 , H01L24/81 , H01L24/94 , H01L2224/0401 , H01L2224/05186 , H01L2224/05546 , H01L2224/05547 , H01L2224/0603 , H01L2224/1147 , H01L2224/1148 , H01L2224/13022 , H01L2224/13147 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/75 , H01L2224/7511 , H01L2224/75252 , H01L2224/75314 , H01L2224/75315 , H01L2224/75317 , H01L2224/81011 , H01L2224/81012 , H01L2224/81013 , H01L2224/81121 , H01L2224/81209 , H01L2224/81801 , H01L2224/81895 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/05042 , H01L2924/10158 , H01L2924/14 , H01L2924/19042 , H01L2924/30105 , H01L2924/3511

摘要： The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally deflecting the two wafers; and bonding the raised contacts. The present invention also discloses a bonded-wafer structure that includes: a first wafer, the first wafer being locally deflected, the first wafer including a first raised contact; and a second wafer, the second wafer being locally deflected, the second wafer including a second raised contact, wherein the second raised contact is bonded to the first raised contact.

摘要翻译： 本发明公开了一种方法，包括：提供两个晶片; 在两个晶片上形成凸起的接触; 对准两个晶片; 汇集联络人; 局部偏转两片晶片; 并且接合凸起的触点。本发明还公开了一种接合晶片结构，其包括：第一晶片，所述第一晶片被局部偏转，所述第一晶片包括第一凸起接触; 和第二晶片，所述第二晶片局部偏转，所述第二晶片包括第二凸起接触件，其中所述第二凸起接触件接合到所述第一凸起接触件。

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