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公开(公告)号:US20090174070A1
公开(公告)日:2009-07-09
申请号:US12319035
申请日:2008-12-31
申请人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobnnsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobnnsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
IPC分类号: H01L23/498
CPC分类号: H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译: 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号:US20110260319A1
公开(公告)日:2011-10-27
申请号:US13103267
申请日:2011-05-09
申请人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
IPC分类号: H01L23/498
CPC分类号: H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译: 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号:US08421225B2
公开(公告)日:2013-04-16
申请号:US13470822
申请日:2012-05-14
申请人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
CPC分类号: H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
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公开(公告)号:US08203208B2
公开(公告)日:2012-06-19
申请号:US13103267
申请日:2011-05-09
申请人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
CPC分类号: H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译: 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号:US07973407B2
公开(公告)日:2011-07-05
申请号:US12319035
申请日:2008-12-31
申请人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
CPC分类号: H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译: 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号:US20120280387A1
公开(公告)日:2012-11-08
申请号:US13470822
申请日:2012-05-14
申请人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
IPC分类号: H01L23/498
CPC分类号: H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译: 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号:US20050003650A1
公开(公告)日:2005-01-06
申请号:US10610743
申请日:2003-07-02
申请人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Chan , Mauro Kobrinsky , Sarah Kim , Kevin O'Brien , Michael Harmes , Thomas Marieb
发明人: Shriram Ramanathan , Patrick Morrow , Scott List , Michael Chan , Mauro Kobrinsky , Sarah Kim , Kevin O'Brien , Michael Harmes , Thomas Marieb
IPC分类号: H01L21/60 , H01L21/98 , H01L25/065 , H01L21/44 , H01L21/48 , H01L23/02 , H01L23/48 , H01L23/52
CPC分类号: H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译: 具有可靠接合和衬底保护的三维堆叠衬底布置。
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公开(公告)号:US20050079685A1
公开(公告)日:2005-04-14
申请号:US10683202
申请日:2003-10-09
IPC分类号: H01L21/46 , H01L23/485 , H01L25/065
CPC分类号: H01L24/12 , H01L24/11 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/11822 , H01L2224/13099 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2224/81894 , H01L2225/06513 , H01L2225/06527 , H01L2225/06582 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14
摘要: The invention provides a stacked wafer structure with decreased failures. In one embodiment, there is a barrier layer deposited on exposed surfaces of conductors that extend across a distance between first and second device structures. The barrier layer may prevent diffusion and electromigration of the conductor material, which may decrease incidences of shorts and voids in the stacked wafer structure.
摘要翻译: 本发明提供了具有降低的故障的堆叠晶片结构。 在一个实施例中,存在沉积在导体的暴露表面上的阻挡层,其延伸跨越第一和第二器件结构之间的距离。 阻挡层可以防止导体材料的扩散和电迁移,这可能降低层叠晶片结构中的短路和空隙的发生。
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公开(公告)号:US07214605B2
公开(公告)日:2007-05-08
申请号:US10683202
申请日:2003-10-09
IPC分类号: H01L21/44
CPC分类号: H01L24/12 , H01L24/11 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/11822 , H01L2224/13099 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2224/81894 , H01L2225/06513 , H01L2225/06527 , H01L2225/06582 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14
摘要: The invention provides a stacked wafer structure with decreased failures. In one embodiment, there is a barrier layer deposited on exposed surfaces of conductors that extend across a distance between first and second device structures. The barrier layer may prevent diffusion and electromigration of the conductor material, which may decrease incidences of shorts and voids in the stacked wafer structure.
摘要翻译: 本发明提供了具有降低的故障的堆叠晶片结构。 在一个实施例中,存在沉积在导体的暴露表面上的阻挡层,其延伸跨越第一和第二器件结构之间的距离。 阻挡层可以防止导体材料的扩散和电迁移,这可能降低层叠晶片结构中的短路和空隙的发生。
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公开(公告)号:US07129172B2
公开(公告)日:2006-10-31
申请号:US10811758
申请日:2004-03-29
申请人: Patrick Morrow , R. Scott List , Michael Y. Chan
发明人: Patrick Morrow , R. Scott List , Michael Y. Chan
IPC分类号: H01L21/302
CPC分类号: H01L21/304 , H01L21/187 , Y10S438/977
摘要: According to one embodiment a method is disclosed. The method includes applying a photoresist layer to a first wafer, etching the first wafer, bonding the first wafer to a second wafer and thinning the first wafer; wherein an unsupported bevel portion of the first wafer is removed.
摘要翻译: 根据一个实施例,公开了一种方法。 该方法包括将光致抗蚀剂层施加到第一晶片,蚀刻第一晶片,将第一晶片接合到第二晶片并使第一晶片变薄; 其中去除第一晶片的未支撑的斜面部分。
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