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    LIGHTING DEVICE AND LIGHTING FIXTURE
    3.
    发明申请
    LIGHTING DEVICE AND LIGHTING FIXTURE 失效
    照明设备和照明设备

    公开(公告)号：US20100219735A1

    公开(公告)日：2010-09-02

    申请号：US12713230

    申请日：2010-02-26

    申请人： Makoto Sakai ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Erika Takenaka

    发明人： Makoto Sakai ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Erika Takenaka

    IPC分类号： H01J61/52

    CPC分类号： F21V23/06 ,  F21K9/23 ,  F21K9/238 ,  F21V3/00 ,  F21V23/002 ,  F21V23/006 ,  F21V29/773 ,  F21V29/89 ,  F21Y2113/13 ,  F21Y2115/10 ,  F21Y2115/30

    摘要： A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device. Therefore, a lighting device and a lighting fixture of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux.

    摘要翻译： 本发明实施例的照明装置和照明器具包括：导热主体，其在一个端部具有基板支撑部分，并且具有形成在基板支撑部分中的通孔和槽部， 所述槽从所述主体的一端部延伸到另一端部，所述槽部从所述通孔连续地延伸，安装有半导体发光装置的基板，并且设置在所述基板支撑部上，电连接器 连接到所述半导体发光装置的电源装置，容纳在所述主体中并且被配置为使所述半导体发光装置点亮的电源装置，连接到所述电源装置的电线和所述电连接器，同时插入所述通孔 和槽部，以及设置在主体的另一端部并连接到电源装置的基部构件。 因此，本发明的该实施例的照明装置和照明器具尺寸减小，被配置为适合于批量生产并且能够产生一定的光通量。

    Lighting device having a through-hole and a groove portion formed in the thermally conductive main body
    4.
    发明授权
    Lighting device having a through-hole and a groove portion formed in the thermally conductive main body 失效
    具有形成在导热性主体中的通孔和槽部的照明装置

    公开(公告)号：US08760042B2

    公开(公告)日：2014-06-24

    申请号：US12713230

    申请日：2010-02-26

    申请人： Makoto Sakai ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Erika Takenaka

    发明人： Makoto Sakai ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Erika Takenaka

    IPC分类号： H01J61/52

    CPC分类号： F21V23/06 ,  F21K9/23 ,  F21K9/238 ,  F21V3/00 ,  F21V23/002 ,  F21V23/006 ,  F21V29/773 ,  F21V29/89 ,  F21Y2113/13 ,  F21Y2115/10 ,  F21Y2115/30

    摘要： A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device. Therefore, a lighting device and a lighting fixture of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux.

    摘要翻译： 本发明实施例的照明装置和照明器具包括：导热主体，其在一个端部具有基板支撑部分，并且具有形成在基板支撑部分中的通孔和槽部， 所述槽从所述主体的一端部延伸到另一端部，所述槽部从所述通孔连续地延伸，安装有半导体发光装置的基板，并且设置在所述基板支撑部上，电连接器 连接到所述半导体发光装置的电源装置，容纳在所述主体中并且被配置为使所述半导体发光装置点亮的电源装置，连接到所述电源装置的电线和所述电连接器，同时插入所述通孔 和槽部，以及设置在主体的另一端部并连接到电源装置的基部构件。 因此，本发明的该实施例的照明装置和照明器具尺寸减小，被配置为适合于批量生产并且能够产生一定的光通量。

    SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT
    5.
    发明申请
    SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT 审中-公开
    自封灯和照明设备

    公开(公告)号：US20100327751A1

    公开(公告)日：2010-12-30

    申请号：US12825956

    申请日：2010-06-29

    申请人： Erika Takenaka ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Mokoto Sakai

    发明人： Erika Takenaka ,  Shigeru Osawa ,  Yusuke Shibahara ,  Takeshi Hisayasu ,  Kazuto Morikawa ,  Tomohiro Sanpei ,  Mokoto Sakai

    IPC分类号： H01J13/32 ,  H05B37/02

    CPC分类号： F21V23/002 ,  F21K9/232 ,  F21K9/233 ,  F21V3/061 ,  F21V3/062 ,  F21V29/773 ,  F21Y2115/10

    摘要： The present invention provides a self-ballasted lamp which efficiently conducts heat of a plurality of LED chips of a light emitting module to its holder, and can prevent the temperature rise of the LED chips. The holder has a base portion, an edge portion provided at one end side of the base portion, which is thick at the base portion side thereof and thin at the distal end side thereof, and heat radiation fins provided at the other end side from the edge part and at the circumference of the base portion. The heat from the semiconductor light emitting elements is conducted from the base portion to the edge part and radiated therefrom. At this time, the edge part is thickened at the base portion side, wherein the thermal capacity is increased, and the heat conduction is improved.

    摘要翻译： 本发明提供了一种自发镇流灯，其有效地将发光模块的多个LED芯片的热量传导到其保持器，并且可以防止LED芯片的温度升高。 保持器具有基部，设置在基部的一端侧的边缘部，其基部侧较厚，其前端侧较薄，并且设置在另一端侧的散热片 边缘部分和基部的圆周处。 来自半导体发光元件的热量从基部传导到边缘部分并从其辐射。 此时，边缘部分在基部侧增厚，其中热容量增加，并且热传导得到改善。

    SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT
    6.
    发明申请
    SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT 失效
    自封灯和照明设备

    公开(公告)号：US20110074269A1

    公开(公告)日：2011-03-31

    申请号：US12886025

    申请日：2010-09-20

    申请人： TAKESHI HISAYASU ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Makoto Sakai ,  Tomohiro Sanpei

    发明人： TAKESHI HISAYASU ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Makoto Sakai ,  Tomohiro Sanpei

    IPC分类号： H01J61/52

    CPC分类号： F21V3/00 ,  F21K9/23 ,  F21V23/002 ,  F21V29/773 ,  F21Y2115/10

    摘要： A base body having a base body portion and a plurality of heat radiating fins disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module having semiconductor light-emitting elements, and a globe that covers the light-emitting module are provided. A cap is provided on the other end side of the base boy. A lighting circuit is housed between the base body and the cap. The lamp total length from the globe to the cap is 70 to 120 mm, and the area of a surface of the base body which is exposed to the outside per 1 W of power charged to the light-emitting module is 20.5 to 24.4 cm2/W.

    摘要翻译： 提供具有基体部的基体和设置在基体部的圆周上的多个散热片。 在基体的一端侧设置有具有半导体发光元件的发光模块和覆盖发光模块的球面。 在基础男孩的另一端设置帽。 照明电路容纳在基体和盖之间。 从球体到盖的灯总长度为70至120mm，并且每1W向发光组件充电的功率暴露于外部的基体的表面面积为20.5至24.4cm2 / W.

    Self-ballasted lamp and lighting equipment
    7.
    发明授权
    Self-ballasted lamp and lighting equipment 失效
    自镇流灯和照明设备

    公开(公告)号：US08324789B2

    公开(公告)日：2012-12-04

    申请号：US12886025

    申请日：2010-09-20

    申请人： Takeshi Hisayasu ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Makoto Sakai ,  Tomohiro Sanpei

    发明人： Takeshi Hisayasu ,  Kazuto Morikawa ,  Yusuke Shibahara ,  Makoto Sakai ,  Tomohiro Sanpei

    IPC分类号： H01J1/02

    CPC分类号： F21V3/00 ,  F21K9/23 ,  F21V23/002 ,  F21V29/773 ,  F21Y2115/10

    摘要： A base body having a base body portion and a plurality of heat radiating fins disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module having semiconductor light-emitting elements, and a globe that covers the light-emitting module are provided. A cap is provided on the other end side of the base boy. A lighting circuit is housed between the base body and the cap. The lamp total length from the globe to the cap is 70 to 120 mm, and the area of a surface of the base body which is exposed to the outside per 1 W of power charged to the light-emitting module is 20.5 to 24.4 cm2/W.

    摘要翻译： 提供具有基体部的基体和设置在基体部的圆周上的多个散热片。 在基体的一端侧设置有具有半导体发光元件的发光模块和覆盖发光模块的球面。 在基础男孩的另一端设置帽。 照明电路容纳在基体和盖之间。 从球体到盖的灯总长度为70至120mm，并且每1W向发光组件充电的功率暴露于外部的基体的表面面积为20.5至24.4cm2 / W.