Semiconductor device having insulating stripe patterns
    4.
    发明授权
    Semiconductor device having insulating stripe patterns 有权
    半导体器件具有绝缘条纹图案

    公开(公告)号:US07709895B2

    公开(公告)日:2010-05-04

    申请号:US10357381

    申请日:2003-02-04

    IPC分类号: H01L27/12

    摘要: An uneven portion is formed on a substrate extending in a linear shape stripe pattern, convex portions of an insulating film that intersects with a crystalline semiconductor film divided into island shapes are removed, and an amorphous semiconductor film is formed on the insulating film. The semiconductor film is melted and flows into concave portions of the insulating film, where it crystallizes, and the semiconductor film that remains on the convex portions of the insulating film is removed. A semiconductor film divided into island shapes is then formed from the semiconductor film formed in the concave portions, the convex portions of the insulating film are removed in portions where channel forming regions are to be formed, thus exposing side surface portions of the semiconductor film. A gate insulating film and a gate electrode contacting the side surface portions and upper surface portions of the semiconductor film are then formed.

    摘要翻译: 在以线状条状图案延伸的基板上形成凹凸部,除去与分离成岛状的结晶半导体膜相交的绝缘膜的凸部,在绝缘膜上形成非晶半导体膜。 半导体膜熔化并流入绝缘膜的凹部,在其中结晶,并且残留在绝缘膜的凸部上的半导体膜被去除。 然后,从形成在凹部中的半导体膜形成分成岛状的半导体膜,在要形成沟道形成区域的部分去除绝缘膜的凸部,从而露出半导体膜的侧表面部分。 然后形成与半导体膜的侧表面部分和上表面部分接触的栅极绝缘膜和栅电极。

    Semiconductor device and manufacturing method therefor

    公开(公告)号:US20050205869A1

    公开(公告)日:2005-09-22

    申请号:US11107822

    申请日:2005-04-18

    摘要: To provide devices relating to a manufacturing method for a semiconductor device using a laser crystallization method, which is capable of reducing a cost involved in a design change, preventing a grain boundary from developing in a channel formation region of a TFT, and preventing a remarkable reduction in mobility of the TFT, a decrease in an ON current, and an increase in an OFF current due to the grain boundary and to a semiconductor device formed by using the manufacturing method. In a semiconductor device according to the present invention, among a plurality of TFTs formed on a base film, some TFTs are electrically connected to form logic elements. The plurality of logic elements are used to form a circuit. The base film has a plurality of projective portions having a rectangular or stripe shape. Island-like semiconductor films included in each of the plurality of TFTs are formed between the plurality of projective portions and also, are crystallized by a laser light scanned in a longitudinal direction of the projective portions.

    Semiconductor device and manufacturing method therefor
    8.
    发明授权
    Semiconductor device and manufacturing method therefor 有权
    半导体装置及其制造方法

    公开(公告)号:US06884668B2

    公开(公告)日:2005-04-26

    申请号:US10370055

    申请日:2003-02-21

    摘要: To provide devices relating to a manufacturing method for a semiconductor device using a laser crystallization method, which is capable of reducing a cost involved in a design change, preventing a grain boundary from developing in a channel formation region of a TFT, and preventing a remarkable reduction in mobility of the TFT, a decrease in an ON current, and an increase in an OFF current due to the grain boundary and to a semiconductor device formed by using the manufacturing method. In a semiconductor device according to the present invention, among a plurality of TFTs formed on a base film, some TFTs are electrically connected to form logic elements. The plurality of logic elements are used to form a circuit. The base film has a plurality of projective portions having a rectangular or stripe shape. Island-like semiconductor films included in each of the plurality of TFTs are formed between the plurality of projective portions and also, are crystallized by a laser light scanned in a longitudinal direction of the projective portions.

    摘要翻译: 为了提供与使用激光结晶法的半导体器件的制造方法相关的装置,其能够降低设计变化中涉及的成本,防止晶界在TFT的沟道形成区域中发展,并且防止显着 TFT的迁移率的降低,导通电流的降低以及由于晶界引起的关断电流的增加以及通过使用该制造方法形成的半导体器件。 在根据本发明的半导体器件中,在形成在基膜上的多个TFT中,一些TFT电连接形成逻辑元件。 多个逻辑元件用于形成电路。 基膜具有多个具有矩形或条状的突出部分。 包含在多个TFT中的多个TFT中的岛状半导体膜形成在多个投影部之间,并且通过沿着投影部的纵向扫描的激光而结晶化。

    Semiconductor device and method of manufacturing the same
    9.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07795734B2

    公开(公告)日:2010-09-14

    申请号:US11636598

    申请日:2006-12-11

    IPC分类号: H01L23/48 H01L23/52 H01L29/40

    摘要: To provide a semiconductor device composed of a semiconductor element or a group of semiconductor elements, in which a crystalline semiconductor film having as few grain boundaries as possible in a channel formation region is formed on an insulating surface, which can operate at high speed, which have high current drive performance, and which are less fluctuated between elements. The method of the present invention includes: forming an insulating film with an opening on a substrate having an insulating surface; forming on the insulating film and over the opening an amorphous semiconductor film or a polycrystalline semiconductor film that has randomly-formed grain boundaries; forming a crystalline semiconductor film by melting the semiconductor film, pouring the melted semiconductor into the opening of the insulating film, and crystallizing or re-crystallizing the semiconductor film; and removing the crystalline semiconductor film except a portion of the crystalline semiconductor film that is in the opening to form a gate insulating film, which is in contact with the top face of the crystalline semiconductor film, and a gate electrode.

    摘要翻译: 为了提供一种由半导体元件或一组半导体元件组成的半导体器件,其中在绝缘表面上形成可在沟道形成区域中具有尽可能少的晶界的结晶半导体膜,其可以高速操作,其中 具有高电流驱动性能,并且元件之间波动较小。 本发明的方法包括:在具有绝缘表面的基板上形成具有开口的绝缘膜; 在绝缘膜上和开口上形成非晶半导体膜或随机形成晶界的多晶半导体膜; 通过熔化半导体膜形成晶体半导体膜,将熔融的半导体注入到绝缘膜的开口中,并使半导体膜结晶或再结晶; 以及去除除了开口中的结晶半导体膜的部分之外的晶体半导体膜以形成与晶体半导体膜的顶面接触的栅极绝缘膜和栅电极。