Thin film transistors having anodized metal film between the gate wiring and drain wiring
    1.
    发明授权
    Thin film transistors having anodized metal film between the gate wiring and drain wiring 失效
    在栅极布线和漏极布线之间具有阳极氧化金属膜的薄膜晶体管

    公开(公告)号:US06979840B1

    公开(公告)日:2005-12-27

    申请号:US08223823

    申请日:1994-04-06

    CPC分类号: H01L29/66757 H01L27/1255

    摘要: A thin-film semiconductor device or integrated circuit comprising an insulating substrate, TFTs (thin-film transistors) formed on the substrate, and multilayer conductive interconnections. The circuit has a first metallization layer becoming gate electrodes and gate interconnections. The surface of the first metallization layer is oxidized by anodic oxidation to form an insulating coating on the surface of the first metallization layer. A second metallization layer becoming source and drain electrodes or conductive interconnections is then formed on the insulating coating directly or via an interlayer insulator. An improvement in the production yield and improved reliability are accomplished.

    摘要翻译: 包括绝缘基板,形成在基板上的TFT(薄膜晶体管)和多层导电互连的薄膜半导体器件或集成电路。 该电路具有成为栅电极和栅极互连的第一金属化层。 通过阳极氧化将第一金属化层的表面氧化,以在第一金属化层的表面上形成绝缘涂层。 然后在绝缘涂层上直接或经由层间绝缘体形成成为源极和漏电极或导电互连的第二金属化层。 实现了产量的提高和可靠性的提高。

    Method for fabricating a thin film semiconductor device
    5.
    发明授权
    Method for fabricating a thin film semiconductor device 失效
    薄膜半导体器件的制造方法

    公开(公告)号:US06004831A

    公开(公告)日:1999-12-21

    申请号:US862697

    申请日:1997-05-23

    CPC分类号: H01L29/66757 H01L27/1255

    摘要: A thin-film semiconductor device or integrated circuit comprising an insulating substrate, TFTs (thin-film transistors) formed on the substrate, and multilayer conductive interconnections. The circuit has a first metallization layer becoming gate electrodes and gate interconnections. The surface of the first metallization layer is oxidized by anodic oxidation to form an insulating coating on the surface of the first metallization layer. A second metallization layer becoming source and drain electrodes or conductive interconnections is then formed on the insulating coating directly or via an interlayer insulator. An improvement in the production yield and improved reliability are accomplished.

    摘要翻译: 包括绝缘基板,形成在基板上的TFT(薄膜晶体管)和多层导电布线的薄膜半导体器件或集成电路。 该电路具有成为栅电极和栅极互连的第一金属化层。 通过阳极氧化将第一金属化层的表面氧化,以在第一金属化层的表面上形成绝缘涂层。 然后在绝缘涂层上直接或经由层间绝缘体形成成为源极和漏电极或导电互连的第二金属化层。 实现了产量的提高和可靠性的提高。

    Semiconductor device
    7.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号:US5495121A

    公开(公告)日:1996-02-27

    申请号:US953943

    申请日:1992-09-30

    摘要: A semiconductor device or a semiconductor integrated circuit includes a field effect transistor having a source region, a drain region and a channel regions formed within a semiconductor substrate. A lower wiring is formed on the semiconductor substrate to form a gate electrode and its extension and oxidized to form an oxide film covering the lower wiring. An upper wiring is formed over the lower wiring on the semiconductor substrate to make contact with the drain or source region. The lower wiring is electrically insulated from the upper wiring by the oxide film.

    摘要翻译: 半导体器件或半导体集成电路包括具有源极区,漏极区和形成在半导体衬底内的沟道区的场效应晶体管。 在半导体基板上形成下布线以形成栅电极,并且其延伸部被氧化以形成覆盖下布线的氧化膜。 在半导体衬底上的下布线之上形成上布线以与漏区或源区接触。 下布线通过氧化膜与上布线电绝缘。

    Semiconductor device and method for forming the same
    9.
    发明授权
    Semiconductor device and method for forming the same 失效
    半导体装置及其形成方法

    公开(公告)号:US07642584B2

    公开(公告)日:2010-01-05

    申请号:US11206293

    申请日:2005-08-18

    IPC分类号: H01L27/108 H01L29/94

    CPC分类号: H01L29/66757 H01L27/1255

    摘要: A thin-film semiconductor device or integrated circuit comprising an insulating substrate, TFTs (thin-film transistors) formed on the substrate, and multilayer conductive interconnections. The circuit has a first metallization layer becoming gate electrodes and gate interconnections. The surface of the first metallization layer is oxidized by anodic oxidation to form an insulating coating on the surface of the first metallization layer. A second metallization layer becoming source and drain electrodes or conductive interconnections is then formed on the insulating coating directly or via an interlayer insulator. An improvement in the production yield and improved reliability are accomplished.

    摘要翻译: 包括绝缘基板,形成在基板上的TFT(薄膜晶体管)和多层导电互连的薄膜半导体器件或集成电路。 该电路具有成为栅电极和栅极互连的第一金属化层。 通过阳极氧化将第一金属化层的表面氧化,以在第一金属化层的表面上形成绝缘涂层。 然后在绝缘涂层上直接或经由层间绝缘体形成成为源极和漏电极或导电互连的第二金属化层。 实现了产量的提高和可靠性的提高。