Process for producing L-lysine by fermentation
    3.
    发明授权
    Process for producing L-lysine by fermentation 失效
    通过发酵生产L-赖氨酸的方法

    公开(公告)号:US5650304A

    公开(公告)日:1997-07-22

    申请号:US383651

    申请日:1995-02-03

    摘要: The present invention relates to (a) process for producing L-lysine by fermentation which comprises culturing a microorganism having resistance to 4-N-(D-alanyl)-2,4-diamino-2,4-dideoxy-L-arabinose 2,4-dideoxy-L-arabinose or a derivative thereof and belonging to the genus Brevibacterium or the genus Corynebacterium, (b) said bacterium therefore and (c) a method of producing said bacterium.

    摘要翻译: 本发明涉及(a)通过发酵生产L-赖氨酸的方法,其包括培养具有对4-N-(D-丙氨酰)-2,4-二氨基-2,4-二脱氧-L-阿拉伯糖2 ,属于短杆菌属或棒杆菌属的4-二脱氧-L-阿拉伯糖或其衍生物,(b)所述细菌,(c)生产所述细菌的方法。

    Integrated circuit socket
    5.
    发明授权
    Integrated circuit socket 失效
    集成电路插座

    公开(公告)号:US4616895A

    公开(公告)日:1986-10-14

    申请号:US774182

    申请日:1985-09-09

    IPC分类号: H01L23/32 H05K7/10 H01R13/627

    CPC分类号: H05K7/1069

    摘要: An integrated circuit (IC) socket comprising: a box-shaped housing of dielectric material open at the upper side thereof and having a recess for receiving a leadless chip carrier type of IC device; a plurality of contacts for contacting the electrodes of the IC device within the recess, each of the contacts comprising a springy conductive member and being disposed in the bottom of the housing so as to contact the electrodes formed in the bottom surface of the IC device; and two pairs of pressing members arranged at opposite corners for holding the IC device within the recess, each member comprising a springy member and a projection formed at the top end of the springy member for pressing the IC device. The projections on the pressing members are semicircular-shaped to permit easy insertion and removal, and to maintain downward pressure.

    摘要翻译: 一种集成电路(IC)插座,包括:介质材料的盒形壳体,其上侧开口并具有用于接收无引线芯片载体型IC器件的凹部; 多个触点,用于接触凹槽内的IC器件的电极,每个触点包括弹性导电构件,并且设置在壳体的底部,以便与形成在IC器件的底表面中的电极接触; 以及两对按压构件,其布置在相对的拐角处,用于将IC器件保持在凹槽内,每个构件包括弹性构件和形成在弹性构件顶端的突起,用于按压IC器件。 按压构件上的突起是半圆形的,以允许容易的插入和移除,并保持向下的压力。