公开(公告)号：US10381330B2

公开(公告)日：2019-08-13

申请号：US15921563

申请日：2018-03-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Justin Hiroki Sato ,  Bomy Chen ,  Walter Lundy

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A method of bonding a first substrate to a second substrate, wherein the first substrate includes first electrical contacts on a top surface of the first substrate, and wherein the second substrate includes second electrical contacts on a bottom surface of the second substrate. The method includes forming a block of polyimide on the top surface of the first substrate, wherein the block of polyimide has a rounded upper corner, and vertically moving the top surface of the first substrate and the bottom surface of the second substrate toward each other until the first electrical contacts abut the second electrical contacts, wherein during the moving, the second substrate makes contact with the rounded upper corner of the polyimide causing the first and second substrates to move laterally relative to each other.

公开(公告)号：US20180286836A1

公开(公告)日：2018-10-04

申请号：US15921563

申请日：2018-03-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Justin Hiroki Sato ,  Bomy Chen ,  Walter Lundy

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0217 ,  H01L2224/0219 ,  H01L2224/04042 ,  H01L2224/05091 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/16502 ,  H01L2224/48091 ,  H01L2224/81143 ,  H01L2224/81805 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/07025 ,  H01L2224/45099

Abstract: A method of bonding a first substrate to a second substrate, wherein the first substrate includes first electrical contacts on a top surface of the first substrate, and wherein the second substrate includes second electrical contacts on a bottom surface of the second substrate. The method includes forming a block of polyimide on the top surface of the first substrate, wherein the block of polyimide has a rounded upper corner, and vertically moving the top surface of the first substrate and the bottom surface of the second substrate toward each other until the first electrical contacts abut the second electrical contacts, wherein during the moving, the second substrate makes contact with the rounded upper corner of the polyimide causing the first and second substrates to move laterally relative to each other.