公开(公告)号：US20170040304A1

公开(公告)日：2017-02-09

申请号：US14981479

申请日：2015-12-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Liang Shih ,  Chun-Chong Chien ,  Hsin-Lung Chun ,  Te-Fang Chu

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L21/52 ,  H01L21/56 ,  H01L23/60 ,  H01L23/538

CPC classification number: H01L25/16 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/552 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81

Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.

Abstract translation: 提供电子封装，包括：具有相对的第一和第二表面的基板; 至少第一电子元件设置在所述基板的第一表面上; 封装所述第一电子元件的第一密封剂; 至少第二电子元件和设置在所述基板的第二表面上的框架; 以及封装所述第二电子元件的第二密封剂。 通过将第一和第二电子元件分别设置在基板的第一和第二表面上，本发明允许将所需数量的电子元件安装在基板上，而不需要增加基板的表面积。 由于电子封装的体积不增加，电子封装满足小型化要求。 本发明还提供一种制造电子封装的方法。

公开(公告)号：US10566320B2

公开(公告)日：2020-02-18

申请号：US16211714

申请日：2018-12-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Liang Shih ,  Chun-Chong Chien ,  Hsin-Lung Chung ,  Te-Fang Chu

IPC: H01L21/56 ,  H01L25/16 ,  H01L25/00 ,  H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.

公开(公告)号：US10181458B2

公开(公告)日：2019-01-15

申请号：US14981479

申请日：2015-12-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Liang Shih ,  Chun-Chong Chien ,  Hsin-Lung Chun ,  Te-Fang Chu

IPC: H01L23/552 ,  H01L25/16 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.

公开(公告)号：US20240047374A1

公开(公告)日：2024-02-08

申请号：US17968349

申请日：2022-10-18

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Chih-Chiang He ,  Chun-Chong Chien ,  Wen-Jung Tsai

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/3157 ,  H01L21/56 ,  H01L24/05 ,  H01L24/13 ,  H01L2924/3025 ,  H01L2224/0401 ,  H01L2224/13023 ,  H01L2924/1811

Abstract: An electronic package is provided with a plurality of electronic elements disposed on a carrier structure and a shielding structure located between two adjacent electronic elements, where the shielding structure is formed with at least one cavity and shielding members located on opposite sides of the cavity, such that the shielding members are arranged between the two electronic elements. Therefore, the electromagnetic signal will be reflected via the shielding members to prevent the two electronic elements from electromagnetically interfering with each other.

公开(公告)号：US20190115330A1

公开(公告)日：2019-04-18

申请号：US16211714

申请日：2018-12-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Liang Shih ,  Chun-Chong Chien ,  Hsin-Lung Chung ,  Te-Fang Chu

IPC: H01L25/16 ,  H01L23/552 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L25/16 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/552 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81

Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.