公开(公告)号：US10236227B2

公开(公告)日：2019-03-19

申请号：US14998324

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lung-Shan Chuang ,  Ching-Wen Chiang ,  Tzung-Yen Wu ,  Chun-Hung Lu

IPC: H01L21/00 ,  H01L23/053 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/14

Abstract: An electronic package is provided, including a circuit portion, an electronic element disposed on the circuit portion and a lid member disposed on the circuit portion to cover the electronic element. A separation portion is formed between the lid member and the electronic element. The lid member facilitates to prevent warping of the overall package structure. The invention further provides a method for fabricating the electronic package.

公开(公告)号：US20160260644A1

公开(公告)日：2016-09-08

申请号：US14998324

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lung-Shan Chuang ,  Ching-Wen Chiang ,  Tzung-Yen Wu ,  Chun-Hung Lu

IPC: H01L23/053 ,  H01L23/31 ,  H01L21/78 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/06 ,  H01L23/498

CPC classification number: H01L23/053 ,  H01L21/4803 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/167 ,  H01L2224/83 ,  H01L2224/81

Abstract: An electronic package is provided, including a circuit portion, an electronic element disposed on the circuit portion and a lid member disposed on the circuit portion to cover the electronic element. A separation portion is formed between the lid member and the electronic element. The lid member facilitates to prevent warping of the overall package structure. The invention further provides a method for fabricating the electronic package.

Abstract translation: 提供一种电子封装，包括电路部分，设置在电路部分上的电子元件和设置在电路部分上以覆盖电子元件的盖子部件。 在盖构件和电子元件之间形成分离部。 盖构件有助于防止整个包装结构的翘曲。 本发明还提供一种制造电子封装的方法。