公开(公告)号：US20160050753A1

公开(公告)日：2016-02-18

申请号：US14739026

申请日：2015-06-15

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Ching Chan ,  Chien-Min Lin ,  Po-Yi Wu ,  Chun-Hung Lu

IPC: H05K1/11 ,  H05K3/42 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H05K1/112 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/423 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having opposite first and second sides and a plurality of conductive through holes communicating the first and second sides; forming an insulating layer on the first side of the substrate body, wherein the insulating layer has a plurality of openings correspondingly exposing the conductive through holes; and forming a plurality of conductive pads in the openings of the insulating layer, wherein the conductive pads are electrically connected to the corresponding conductive through holes, thereby dispensing with the conventional wet etching process and hence preventing an undercut structure from being formed under the conductive pads.

Abstract translation: 提供了一种用于制造插入件的方法，其包括以下步骤：提供具有相对的第一和第二侧面的基板本体和连通第一和第二侧面的多个导电通孔; 在所述基板主体的第一侧上形成绝缘层，其中所述绝缘层具有多个对应地暴露所述导电通孔的开口; 并且在绝缘层的开口中形成多个导电焊盘，其中导电焊盘电连接到相应的导电通孔，从而分配常规的湿蚀刻工艺，从而防止在导电焊盘下方形成底切结构 。