摘要:
A method for determining an ESD/latch-up strength of an integrated circuit includes producing an integrated circuit and a test structure using the same fabrication process. Electrical parameters at the test structure are measured and characteristic values associated with the integrated circuit are derived from the measured parameter values, wherein the characteristic values characterize an ESD or latch-up characteristic curve associated with the integrated circuit. The method further includes testing whether the characteristic values in each case lie within a predetermined range assigned to them, wherein the ranges are chosen such that a desired ESD/latch-up strength is present if the characteristic values in each case lie within their range.
摘要:
The present invention creates an operating method for a semiconductor component having a substrate; having a conductive polysilicon strip which is applied to the substrate; having a first and a second electrical contact which are connected to the conductive polysilicon strip such that this forms an electrical resistance in between them; with the semiconductor component being operated reversibly in a current/voltage range in which it has a first differential resistance (Rdiff1) up to a current limit value (It) corresponding to an upper voltage limit value (Vt) and, at current values greater than this, has a second differential resistance (Rdiff2), which is less than the first differential resistance (Rdiff1).
摘要:
A method for determining an ESD/latch-up strength of an integrated circuit includes producing an integrated circuit and a test structure using the same fabrication process. Electrical parameters at the test structure are measured and characteristic values associated with the integrated circuit are derived from the measured parameter values, wherein the characteristic values characterize an ESD or latch-up characteristic curve associated with the integrated circuit. The method further includes testing whether the characteristic values in each case lie within a predetermined range assigned to them, wherein the ranges are chosen such that a desired ESD/latch-up strength is present if the characteristic values in each case lie within their range.
摘要:
To test the ESD resistance of a semiconductor component, for example of a NOS transistor, which can be used as a PSD protective element in a chip, a direct current characteristic of the semiconductor component is monitored and the ESD resistance of the respective semiconductor component is inferred depending on this. In particular, the direct current failure threshold of the semiconductor component at which an increased leakage current occurs in the non-conducting direction of the semiconductor component can be monitored in operation of the semiconductor component using an applied direct current and the ESD resistance of the semiconductor component inferred depending on a change in this direct current failure threshold.
摘要:
A circuit is described that protects an integrated circuit from electrostatic discharges or electrical over-stress. The circuit arrangement has first and second protective elements connected in series between a connection of the integrated circuit and a supply voltage. When electrostatic discharges or electrical over-stress occurs, current flows through the conductive path formed through the first and second protective elements. A current path that contains a circuit element limits current through the first protective element is connected in parallel with the first protective element. The first protective element has blocking behavior when no electrostatic discharges or electrical over-stress occurs, a limited current flows through the current path and the second protective element.
摘要:
A circuit is described that protects an integrated circuit from electrostatic discharges or electrical over-stress. The circuit arrangement has first and second protective elements connected in series between a connection of the integrated circuit and a supply voltage. When electrostatic discharges or electrical over-stress occurs, current flows through the conductive path formed through the first and second protective elements. A current path that contains a circuit element limits current through the first protective element is connected in parallel with the first protective element. The first protective element has blocking behavior when no electrostatic discharges or electrical over-stress occurs, a limited current flows through the current path and the second protective element.
摘要:
A transistor contains a source region and a drain region. Two or more fill areas are formed such that the fill areas and the source and/or drain region engage in one another. The fill areas have vertical dimensions which are at least of equal size to the vertical dimensions of the source and/or of the drain region. The fill areas and the source and/or drain region extend at least partially over a common vertical section. The fill areas are formed from an oxide and/or a nitride.
摘要:
An ESD protective circuit protects an input or output of a monolithically integrated circuit. The ESD protective circuit has at least one bipolar transistor structure and one ESD protective element between two supply networks. The emitter of the bipolar transistor structure is electrically connected to the input or output, while the base is electrically connected to one of the two supply networks. The collector produces a current signal, which is used for triggering of the ESD protective element, when an ESD load occurs at the input or output.
摘要:
An ESD protective circuit protects an input or output of a monolithically integrated circuit. The ESD protective circuit has at least one bipolar transistor structure and one ESD protective element between two supply networks. The emitter of the bipolar transistor structure is electrically connected to the input or output, while the base is electrically connected to one of the two supply networks. The collector produces a current signal, which is used for triggering of the ESD protective element, when an ESD load occurs at the input or output.
摘要:
A program-controlled arrangement for the identification of ESD and/or latch-up weak points in the design or in the concept of an integrated circuit comprises a pre-processor, which processes first data about the description of the integrated circuit, second data about already ESD-characterized circuit parts of the integrated circuit, and third data which contain information about ESD test standards. A simulator device is connected downstream of the pre-processor which has a simulator which, by using the fourth and fifth data generated by the pre-processor, performs an ESD simulation of the integrated circuit, which has a monitoring controller for controlling the ESD simulation sequence in the simulator. An analysis device is connected downstream of the simulator device, which performs an evaluation of the sixth data generated in the simulator device with regard to their physical validity and meaningfulness, and marks the simulation runs having physically relevant ESD failure events.