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公开(公告)号：US09467940B2
公开(公告)日：2016-10-11
申请号：US13673612
申请日：2012-11-09
发明人： Guohao Zhang , Hardik Bhupendra Modi , Jaydutt Jagdish Joshi , Bhuvaneshwaran Vijayakumar , Dinhphuoc Vu Hoang
IPC分类号： H04M1/00 , H04W52/02 , H01L25/00 , H03F3/21 , H03F1/02 , H03F1/56 , H03F3/195 , H03F3/24 , H03F3/72 , H01L23/66 , H04B1/04
CPC分类号： H03F3/72 , H01L23/66 , H01L25/00 , H01L2223/6655 , H01L2223/6677 , H01L2224/16225 , H01L2924/1305 , H01L2924/19041 , H01L2924/19105 , H03F1/0227 , H03F1/0277 , H03F1/56 , H03F3/195 , H03F3/211 , H03F3/245 , H03F2200/222 , H03F2200/318 , H03F2200/387 , H03F2200/411 , H03F2200/429 , H03F2203/7209 , H03F2203/7221 , H03F2203/7236 , H04B1/0458 , H04W52/02 , H01L2924/00
摘要： Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.
摘要翻译： 公开了用于提高倒装芯片配置中实现的射频功率放大器的功率附加效率和线性度的装置和方法。 在一些实施例中，可以提供谐波终端电路以便与被配置为在基本频率处提供阻抗匹配的输出匹配网络分离。 谐波终端电路可以被配置为在与功率放大器输出的谐波频率相对应的相位处终止。 单独的基本匹配网络和谐波终端电路的这种配置允许各自独立调谐，从而改进性能参数，例如功率附加效率和线性度。
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公开(公告)号：US11974390B2
公开(公告)日：2024-04-30
申请号：US18107142
申请日：2023-02-08
发明人： Bhuvaneshwaran Vijayakumar , Lori Ann Deorio , Anthony James Lobianco , Hoang Mong Nguyen , Robert Francis Darveaux
CPC分类号： H05K1/0243 , H05K1/11 , H05K3/24 , H03F3/19
摘要： A packaging substrate can include a first surface and a second opposing surface, the first surface including a first mounting region of a first electronic module region and the second opposing surface including a first electrical contacts region of the first electronic module region. The packaging substrate can include a saw street region with at least a portion that surrounds the first electronic module region, and a saw street feature formed on the second opposing surface within at least a portion of the saw street region, the saw street feature being a solder mask layer over a metal layer.
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公开(公告)号：US11596056B2
公开(公告)日：2023-02-28
申请号：US16588884
申请日：2019-09-30
发明人： Bhuvaneshwaran Vijayakumar , Lori Ann DeOrio , Anthony James LoBianco , Hoang Mong Nguyen , Robert Francis Darveaux
摘要： A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.
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公开(公告)号：US20160380603A1
公开(公告)日：2016-12-29
申请号：US15262377
申请日：2016-09-12
发明人： Guohao Zhang , Hardik Bhupendra Modi , Jaydutt Jagdish Joshi , Bhuvaneshwaran Vijayakumar , Dinhphuoc Vu Hoang
CPC分类号： H03F3/72 , H01L23/66 , H01L25/00 , H01L2223/6655 , H01L2223/6677 , H01L2224/16225 , H01L2924/1305 , H01L2924/19041 , H01L2924/19105 , H03F1/0227 , H03F1/0277 , H03F1/56 , H03F3/195 , H03F3/211 , H03F3/245 , H03F2200/222 , H03F2200/318 , H03F2200/387 , H03F2200/411 , H03F2200/429 , H03F2203/7209 , H03F2203/7221 , H03F2203/7236 , H04B1/0458 , H04W52/02 , H01L2924/00
摘要： Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.
摘要翻译： 公开了用于提高倒装芯片配置中实现的射频功率放大器的功率附加效率和线性度的装置和方法。 在一些实施例中，可以提供谐波终端电路以便与被配置为在基本频率处提供阻抗匹配的输出匹配网络分离。 谐波终端电路可以被配置为在与功率放大器输出的谐波频率相对应的相位处终止。 单独的基本匹配网络和谐波终端电路的这种配置允许各自独立调谐，从而改进性能参数，例如功率附加效率和线性度。
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公开(公告)号：US10141901B2
公开(公告)日：2018-11-27
申请号：US15262377
申请日：2016-09-12
发明人： Guohao Zhang , Hardik Bhupendra Modi , Jaydutt Jagdish Joshi , Bhuvaneshwaran Vijayakumar , Dinhphuoc Vu Hoang
IPC分类号： H03F3/72 , H01L23/66 , H01L25/00 , H03F1/02 , H03F1/56 , H03F3/195 , H03F3/21 , H03F3/24 , H04B1/04 , H04W52/02
摘要： Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.
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公开(公告)号：US20130130752A1
公开(公告)日：2013-05-23
申请号：US13673612
申请日：2012-11-09
发明人： Guohao Zhang , Hardik Bhupendra Modi , Jaydutt Jagdish Joshi , Bhuvaneshwaran Vijayakumar , Dinhphuoc Vu Hoang
CPC分类号： H03F3/72 , H01L23/66 , H01L25/00 , H01L2223/6655 , H01L2223/6677 , H01L2224/16225 , H01L2924/1305 , H01L2924/19041 , H01L2924/19105 , H03F1/0227 , H03F1/0277 , H03F1/56 , H03F3/195 , H03F3/211 , H03F3/245 , H03F2200/222 , H03F2200/318 , H03F2200/387 , H03F2200/411 , H03F2200/429 , H03F2203/7209 , H03F2203/7221 , H03F2203/7236 , H04B1/0458 , H04W52/02 , H01L2924/00
摘要： Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.
摘要翻译： 公开了用于提高倒装芯片配置中实现的射频功率放大器的功率附加效率和线性度的装置和方法。 在一些实施例中，可以提供谐波终端电路以便与被配置为在基本频率处提供阻抗匹配的输出匹配网络分离。 谐波终端电路可以被配置为在与功率放大器输出的谐波频率相对应的相位处终止。 单独的基本匹配网络和谐波终端电路的这种配置允许各自独立调谐，从而改进性能参数，例如功率附加效率和线性度。
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公开(公告)号：US20230269861A1
公开(公告)日：2023-08-24
申请号：US18111950
申请日：2023-02-21
IPC分类号： H05K1/02
CPC分类号： H05K1/0204 , H05K1/0215
摘要： A method for manufacturing an electronic package comprises providing at least one electronic component, the at least one electronic component including at least one non-groundable thermal output, providing a substrate in which a ground plane is enclosed in or supported by the substrate, defining at least one thermally conductive pathway extending between an interface exposed on the substrate and the ground plane such that the interface is electrically isolated from the ground plane, and mounting the electronic component to the substrate, the mounting including thermally coupling the output to the interface with at least one thermally conductive member.
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公开(公告)号：US20230268247A1
公开(公告)日：2023-08-24
申请号：US18171734
申请日：2023-02-21
IPC分类号： H01L23/373 , H01L23/498 , H01L23/00
CPC分类号： H01L23/3735 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/73 , H01L2224/73204 , H01L24/29 , H01L2224/2919 , H01L2924/0665 , H01L2224/13147 , H01L24/14 , H01L2224/1403 , H01L2224/16227
摘要： An electronic package is provided. The electronic package comprises an electronic component, a substrate, a ground plane, a thermally conductive pathway and at least one thermally conductive member. The ground plane is enclosed in or supported by the substrate. The electronic component includes a non-groundable thermal output and is mounted to the substrate. The thermally conductive pathway extends within the substrate between an interface exposed on a surface of the substrate and the ground plane. The thermally conductive pathway is configured to electrically isolate the interface from the ground plane. The thermally conductive member couples the output to the interface. An electronic device comprising such an electronic package is also provided.
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