公开(公告)号：US20210399423A1

公开(公告)日：2021-12-23

申请号：US17305647

申请日：2021-07-12

Applicant: Skyworks Solutions, Inc.

Inventor： Dinhphuoc Vu Hoang ,  Robert Francis Darveaux ,  Anthony James LoBianco ,  Lori Ann DeOrio ,  Hoang Mong Nguyen ,  Ki Wook Lee ,  Hardik Bhupendra Modi ,  Foad Arfaei Malekzadeh ,  Stephen Joseph Kovacic ,  René Rodriguez

IPC: H01Q9/04 ,  B29C41/42 ,  H01Q5/35 ,  H01Q9/06

Abstract: An antenna structure can include a printed circuit board module and a mold compound disposed on a side of the printed circuit board module. A planar antenna is defined by a conformal shield layer disposed on a first surface of the mold compound such that the mold compound is disposed between the printed circuit board module and the conformal shield layer. The thickness of the mold compound layer and the shape of the conformal shield layer can be varied to optimize a performance of the antenna.

公开(公告)号：US09419667B2

公开(公告)日：2016-08-16

申请号：US14252719

申请日：2014-04-14

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Anthony James Lobianco ,  Howard E. Chen ,  Robert Francis Darveaux ,  Hoang Mong Nguyen ,  Matthew Sean Read ,  Lori Ann Deorio

IPC: H04B1/3827 ,  B23K26/36 ,  H05K1/02 ,  H05K1/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/362 ,  B23K26/386 ,  H05K3/28

CPC classification number: H05K1/0218 ,  B23K26/361 ,  B23K26/362 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H03H9/64 ,  H04B1/3833 ,  H04B1/3838 ,  H04B1/40 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/181 ,  H05K1/183 ,  H05K3/288 ,  H05K3/30 ,  H05K3/303 ,  H05K9/0022 ,  H05K2201/1006 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2201/1056 ,  H05K2203/107 ,  H05K2203/1327 ,  Y10T29/49002 ,  Y10T29/49016 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.

Abstract translation: 公开了与射频（RF）模块的适形涂层相关的装置和方法。 在一些实施例中，模块可以包括形成在安装在包装衬底上的RF部件上的包覆模制件。 包覆模具还可以覆盖实现为芯片尺寸表面声波（SAW）器件（CSSD）的RF滤波器的表面贴装器件（SMD）。 模块还可以包括形成在包覆模制上的导电层，并且被配置为为模块提供RF屏蔽功能。 导电层可以通过SMD电连接到封装衬底的接地平面。 可以在SMD上的包覆模制中形成一个开口; 并且导电层可以符合开口以将导电层与SMD的上表面电连接，从而便于接地连接。

公开(公告)号：US11765814B2

公开(公告)日：2023-09-19

申请号：US16558056

申请日：2019-08-31

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis Darveaux ,  Ki Wook Lee ,  Takeshi Furusawa ,  Sundeep Nand Nangalia ,  Russ Alan Reisner ,  John C. Baldwin

IPC: H05K1/02 ,  H05K1/18 ,  H01Q1/22 ,  H05K1/11 ,  H04B1/10

CPC classification number: H05K1/0243 ,  H01Q1/2283 ,  H04B1/10 ,  H05K1/113 ,  H05K1/183 ,  H05K2201/10098

Abstract: Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

公开(公告)号：US20230269861A1

公开(公告)日：2023-08-24

申请号：US18111950

申请日：2023-02-21

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Bhuvaneshwaran Vijayakumar ,  Robert Francis Darveaux ,  Lori Ann DeOrio

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H05K1/0215

Abstract: A method for manufacturing an electronic package comprises providing at least one electronic component, the at least one electronic component including at least one non-groundable thermal output, providing a substrate in which a ground plane is enclosed in or supported by the substrate, defining at least one thermally conductive pathway extending between an interface exposed on the substrate and the ground plane such that the interface is electrically isolated from the ground plane, and mounting the electronic component to the substrate, the mounting including thermally coupling the output to the interface with at least one thermally conductive member.

公开(公告)号：US20230268247A1

公开(公告)日：2023-08-24

申请号：US18171734

申请日：2023-02-21

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Bhuvaneshwaran Vijayakumar ,  Robert Francis Darveaux ,  Lori Ann DeOrio

IPC: H01L23/373 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3735 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/73204 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/13147 ,  H01L24/14 ,  H01L2224/1403 ,  H01L2224/16227

Abstract: An electronic package is provided. The electronic package comprises an electronic component, a substrate, a ground plane, a thermally conductive pathway and at least one thermally conductive member. The ground plane is enclosed in or supported by the substrate. The electronic component includes a non-groundable thermal output and is mounted to the substrate. The thermally conductive pathway extends within the substrate between an interface exposed on a surface of the substrate and the ground plane. The thermally conductive pathway is configured to electrically isolate the interface from the ground plane. The thermally conductive member couples the output to the interface. An electronic device comprising such an electronic package is also provided.

公开(公告)号：US10593565B2

公开(公告)日：2020-03-17

申请号：US15885782

申请日：2018-01-31

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis Darveaux

IPC: H01L21/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/552 ,  H01L23/00 ,  H01L23/544 ,  H01L21/268 ,  H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L23/29 ,  H01L23/498 ,  H01L25/16 ,  H01L21/027

Abstract: Described herein are methods of manufacturing dual-sided packaged electronic modules to control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include forming a trench in a packaging substrate that is configured to prevent or limit the flow of a capillary under-fill material. This can prevent or limit the capillary under-fill material from flowing onto or contacting other components or elements on the packaging substrate, such as solder balls of a ball-grid array. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using a trench in a packaging substrate.

公开(公告)号：US10524350B2

公开(公告)日：2019-12-31

申请号：US15233755

申请日：2016-08-10

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Anthony James Lobianco ,  Howard E. Chen ,  Robert Francis Darveaux ,  Hoang Mong Nguyen ,  Matthew Sean Read ,  Lori Ann Deorio

IPC: H03H9/64 ,  H04B1/40 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K9/00 ,  B23K26/40 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/66 ,  B23K103/16 ,  B23K26/361 ,  B23K26/362 ,  B23K26/382 ,  B23K26/386 ,  H01L21/768 ,  H01L23/498 ,  H04B1/3827 ,  H01L23/552

Abstract: A radio-frequency (RF) module is disclosed to include a packaging substrate configured to receive a plurality of components. The RF module also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

公开(公告)号：US10460957B2

公开(公告)日：2019-10-29

申请号：US15885787

申请日：2018-01-31

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis Darveaux

IPC: H01L21/00 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/552 ,  H01L23/00 ,  H01L21/268 ,  H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L23/29 ,  H01L23/544 ,  H01L25/16 ,  H01L21/027

Abstract: Disclosed herein are methods of fabricating a packaged radio-frequency (RF) device. The disclosed methods use an encapsulant on solder balls to control the distribution of an under-fill material between one or more components and a packaging substrate. The encapsulant can be used in the ball attach process. The fluxing agent leaves behind a material that encapsulates the base of each solder ball. The encapsulant forms an obtuse angle with the substrate surface and with the ball surface. This reduces the tendency of the under-fill material to wick around the solder balls by capillary action which can prevent or limit the capillary under-fill material from flowing onto or contacting other components. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using an encapsulant on the solder balls.

公开(公告)号：US12033954B2

公开(公告)日：2024-07-09

申请号：US17582915

申请日：2022-01-24

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Howard E. Chen ,  David Viveiros, Jr. ,  Russ Alan Reisner ,  Robert Francis Darveaux

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/498 ,  H01L23/50 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/17 ,  H01L23/66 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/3025

Abstract: Signal isolation for module with ball grid array. In some embodiments, a packaged module can include a packaging substrate having an underside, and an arrangement of conductive features implemented on the underside of the packaging substrate to allow the packaged module to be capable of being mounted on a circuit board. The arrangement of conductive features can include a signal feature implemented at a first region and configured for passing of a signal, and one or more shielding features placed at a selected location relative to the signal feature to provide an enhanced isolation between the signal feature and a second region of the underside of the packaging substrate.

公开(公告)号：US20230326841A1

公开(公告)日：2023-10-12

申请号：US18130511

申请日：2023-04-04

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis Darveaux ,  Howard E. Chen ,  Hoang Mong Nguyen ,  Anthony James LoBianco

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01Q1/22

CPC classification number: H01L23/49816 ,  H01L23/5383 ,  H01L23/3157 ,  H01L23/3128 ,  H01Q1/2283

Abstract: A dual-sided packaged radio-frequency (RF) module comprises a packaging substrate having a first surface with at least one RF circuit component mounted thereon and a second surface opposite to the first surface with at least one circuitry component mounted thereon, at least one contact feature attached to the second surface of the packaging substrate, a vertical extension of the at least one contact feature being larger than a distance between a bottom surface of the at least one circuitry component and the second surface of the packaging substrate, an underside molding encapsulating the at least one circuitry component and the at least one contact feature, a bottom surface of the underside molding being flush with the bottom surface of the at least one circuitry component, and a trench structure formed in the underside molding around the at least one contact feature.