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    Method for chemical mechanical polishing of semiconductor substrates
    5.
    发明授权
    Method for chemical mechanical polishing of semiconductor substrates 失效
    半导体衬底的化学机械抛光方法

    公开(公告)号：US06821881B2

    公开(公告)日：2004-11-23

    申请号：US10199444

    申请日：2002-07-19

    申请人： Stan D. Tsai ,  Liang-Yuh Chen ,  Lizhong Sun ,  Shijian Li ,  Feng Q. Liu ,  Rashid Mavliev ,  Ratson Morad ,  Daniel A. Carl

    发明人： Stan D. Tsai ,  Liang-Yuh Chen ,  Lizhong Sun ,  Shijian Li ,  Feng Q. Liu ,  Rashid Mavliev ,  Ratson Morad ,  Daniel A. Carl

    IPC分类号： H01L214763

    CPC分类号： H01L21/7684 ,  B24B37/042 ,  B24B49/16 ,  H01L21/3212 ,  Y02P80/30

    摘要： Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

    摘要翻译： 提供了用于处理基板以改善抛光均匀性，改善平面化，去除残留材料并最小化缺陷形成的方法和装置。 在一个方面，提供了一种用于处理具有导电材料和设置在其上的低介电常数材料的衬底的方法，其包括在约2psi或更小的抛光压力和约200cps或更高的压板旋转速度下抛光衬底。 抛光工艺可以使用含有至多约1重量％的磨料的抛光组合物。 磨料的百分比。 抛光工艺可以集成到多步抛光工艺中。

    Conductive polishing article for electrochemical mechanical polishing
    7.
    发明授权
    Conductive polishing article for electrochemical mechanical polishing 失效
    电化学机械抛光用导电抛光制品

    公开(公告)号：US06979248B2

    公开(公告)日：2005-12-27

    申请号：US10140010

    申请日：2002-05-07

    申请人： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Ratson Morad ,  Sasson Somekh

    发明人： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Ratson Morad ,  Sasson Somekh

    IPC分类号： C25D7/12 ,  B23H5/08 ,  B24B37/04 ,  B24D13/14 ,  C25F3/00 ,  C25F3/30 ,  C25F7/00 ,  H01L21/304 ,  B24B1/00 ,  C25C7/04 ,  C25D17/00

    CPC分类号： B24B37/16 ,  B23H5/08 ,  B24B37/046 ,  B24B37/14 ,  Y10S977/902

    摘要： An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.

    摘要翻译： 提供了一种用于平坦化基板表面的制造方法和装置。 在一个方面，提供了一种制造用品，用于抛光包括抛光制品的基材，所述抛光制品具有主体，该主体包括涂覆有导电材料的纤维的至少一部分，导电填料或其组合，并适于抛光该基材。 在另一方面，抛光制品包括具有适于抛光基底的表面和嵌入在抛光表面中的至少一个导电元件的主体，该导电元件包括​​涂覆有导电材料的电介质或导电纤维，导电填料或其组合 。 导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。 可以在制品中形成多个穿孔和多个凹槽以促进材料通过和抛光制品周围的流动。

    Method for dishing reduction and feature passivation in polishing processes
    8.
    发明申请
    Method for dishing reduction and feature passivation in polishing processes 审中-公开
    抛光过程中凹陷减少和特征钝化的方法

    公开(公告)号：US20050202677A1

    公开(公告)日：2005-09-15

    申请号：US11114936

    申请日：2005-04-25

    申请人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel Carl

    发明人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel Carl

    IPC分类号： H01L21/288 ,  H01L21/321 ,  C25C3/00

    CPC分类号： H01L21/7684 ,  H01L21/3212

    摘要： Methods and apparatus for planarizing a substrate surface are provided. In one aspect, a method is provided for planarizing a substrate surface including polishing a first conductive material to a barrier layer material, depositing a second conductive material on the first conductive material by an electrochemical deposition technique, and polishing the second conductive material and the barrier layer material to a dielectric layer. In another aspect, a processing system is provided for forming a planarized layer on a substrate, the processing system including a computer based controller configured to cause the system to polish a first conductive material to a barrier layer material, deposit a second conductive material on the first conductive material by an electrochemical deposition technique, and polish the second conductive material and the barrier layer material to a dielectric layer.

    摘要翻译： 提供了用于平坦化基板表面的方法和装置。 在一个方面，提供了一种用于平坦化衬底表面的方法，包括将第一导电材料抛光到阻挡层材料，通过电化学沉积技术在第一导电材料上沉积第二导电材料，以及抛光第二导电材料和屏障 层材料到介电层。 在另一方面，提供一种用于在衬底上形成平坦化层的处理系统，所述处理系统包括基于计算机的控制器，所述计算机控制器被配置为使所述系统将第一导电材料抛光至阻挡层材料，将第二导电材料沉积在所述第二导电材料上 通过电化学沉积技术的第一导电材料，并将第二导电材料和阻挡层材料抛光到介电层。

    Planarization of substrates using electrochemical mechanical polishing
    9.
    发明申请
    Planarization of substrates using electrochemical mechanical polishing 审中-公开
    使用电化学机械抛光对基板进行平面化

    公开(公告)号：US20050056537A1

    公开(公告)日：2005-03-17

    申请号：US10972884

    申请日：2004-10-25

    申请人： Liang-Yuh Chen ,  Wei-Yung Hsu ,  Alain Duboust ,  Ratson Morad ,  Daniel Carl

    发明人： Liang-Yuh Chen ,  Wei-Yung Hsu ,  Alain Duboust ,  Ratson Morad ,  Daniel Carl

    IPC分类号： B24B37/00 ,  B23H5/08 ,  B24B37/04 ,  H01L21/304 ,  H01L21/316 ,  B23H5/00

    CPC分类号： B23H5/08

    摘要： A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substrate surface, and removing material from at least a portion of the substrate surface. In another aspect, an apparatus is provided which includes a partial enclosure, polishing article, a cathode, a power source, a substrate carrier movably disposed above the polishing article, and a computer based controller to position a substrate in an electrolyte solution to form a passivation layer on a substrate surface, to polish the substrate in the electrolyte solution with the polishing article, and to apply an anodic bias to the substrate surface or polishing article to remove material from at least a portion of the substrate surface.

    摘要翻译： 提供了一种用于平坦化衬底上的材料层的方法和装置。 在一个方面，提供一种用于处理衬底的方法，包括在衬底表面上形成钝化层，在电解质溶液中抛光衬底，向衬底表面施加阳极偏压，以及从衬底的至少一部分去除材料 表面。 在另一方面，提供了一种装置，其包括部分外壳，抛光制品，阴极，电源，可移动地设置在抛光制品上方的基板载体，以及基于计算机的控制器，以将基板定位在电解质溶液中以形成 在衬底表面上的钝化层，用抛光制品抛光电解质溶液中的衬底，并将阳极偏压施加到衬底表面或抛光制品上以从衬底表面的至少一部分去除材料。

    Method for dishing reduction and feature passivation in polishing processes
    10.
    发明授权
    Method for dishing reduction and feature passivation in polishing processes 失效

    公开(公告)号：US06884724B2

    公开(公告)日：2005-04-26

    申请号：US09939323

    申请日：2001-08-24

    申请人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel A. Carl

    发明人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel A. Carl

    IPC分类号： H01L21/288 ,  H01L21/321 ,  H01L21/20

    CPC分类号： H01L21/7684 ,  H01L21/3212

    摘要： Methods and apparatus for planarizing a substrate surface are provided. In one aspect, a method is provided for planarizing a substrate surface including polishing a first conductive material to a barrier layer material, depositing a second conductive material on the first conductive material by an electrochemical deposition technique, and polishing the second conductive material and the barrier layer material to a dielectric layer. In another aspect, a processing system is provided for forming a planarized layer on a substrate, the processing system including a computer based controller configured to cause the system to polish a first conductive material to a barrier layer material, deposit a second conductive material on the first conductive material by an electrochemical deposition technique, and polish the second conductive material and the barrier layer material to a dielectric layer.