Membrane probing of circuits
    4.
    发明授权
    Membrane probing of circuits 失效
    电路膜探测

    公开(公告)号:US5623213A

    公开(公告)日:1997-04-22

    申请号:US643740

    申请日:1996-05-06

    IPC分类号: G01R1/073 H01L21/66 G01R31/02

    CPC分类号: G01R1/0735

    摘要: First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source,

    摘要翻译: 沿着沿着由柔性基板传导的导电的第一和第二位置电连接的第一和第二凸起分别被定向成与被测试的模具的焊盘和测试器结构的焊盘接触。 第二和第三导电区域分别电连接到电源和电气装置的电源和接地端子。 第二和第三区域与第一导电区域间隔开以从由电源提供的功率和接地电位滤除高频噪声分量,