公开(公告)号：US5260868A

公开(公告)日：1993-11-09

申请号：US776713

申请日：1991-10-15

申请人： Subhash Gupta ,  Sanjiv S. Sidhu ,  Frank Vlach

发明人： Subhash Gupta ,  Sanjiv S. Sidhu ,  Frank Vlach

IPC分类号： G05B19/418 ,  G06Q10/06 ,  G07C3/00 ,  G06F15/20

CPC分类号： G06Q10/06 ,  G05B19/41865 ,  G07C3/00 ,  G05B2219/34418 ,  Y02P90/20

摘要： A mechanism and method for calendaring a plurality of events such as scheduling the operation of interrelated machines which perform a process flow. Future time is divided into segments, called buckets, of increasing length. The first two buckets are of the same size and each of the following buckets twice as large as its preceding bucket. The first bucket slides so as to always cover a specified length of time following the current time. Events scheduled in the calendar is added to the appropriate bucket, depending on how far in the future it is to take place. When the current time equals the scheduled time for an event, then that event is removed from the bucket where it resides. When a bucket has become empty because all events have been removed from it, the events in the following bucket are distributed over the two buckets preceding it.

摘要翻译： 一种用于对多个事件进行日历的机制和方法，例如调度执行处理流程的相互关联的机器的操作。 未来时间被分为长度增长的段，称为桶。 前两个桶的尺寸相同，以下桶中的每一个都是前一桶的两倍。 第一个铲斗滑动，以便在当前时间之后始终覆盖指定的时间长度。 日程安排的活动将添加到相应的存储桶中，具体取决于将来发生的时间。 当当前时间等于事件的预定时间时，该事件将从它驻留的存储桶中删除。 当桶已经变为空时，因为所有事件都已从其中删除，下一个桶中的事件将分布在其前面的两个桶中。

公开(公告)号：US4888692A

公开(公告)日：1989-12-19

申请号：US273643

申请日：1988-11-10

申请人： Subhash Gupta ,  Sanjiv S. Siduh ,  Frank Vlach

发明人： Subhash Gupta ,  Sanjiv S. Siduh ,  Frank Vlach

IPC分类号： G05B19/418 ,  G06Q10/06 ,  G07C3/00

CPC分类号： G06Q10/06 ,  G05B19/41865 ,  G07C3/00 ,  G05B2219/34418 ,  Y02P90/20

摘要： A system for scheduling the operation of interrelated machines which perform a process flow. A global definition of the system is made once, and each machine has an individual profile describing its local interaction with the system. Local scheduling decisions for each machine are made based on that machines individual profile and the state of the manufacturing facility at the time a decision is needed. Operation of the individual machines is controlled by the local scheduling decisions made therefor.

摘要翻译： 一种用于调度执行处理流程的相关机器的操作的系统。 系统的全局定义是一次，每个机器都有一个单独的配置文件，描述其与系统的本地交互。 每个机器的本地调度决策基于该机器的个人简档和在需要决定时的制造设施的状态来进行。 单个机器的操作由为此而制定的本地调度决定进行控制。

公开(公告)号：US07452808B2

公开(公告)日：2008-11-18

申请号：US10988768

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

摘要翻译： 提供了具有暴露的金属端接垫的半导体芯片，以及在其上具有对应的暴露的金属凸块的单独的基板。 在暴露的金属端接垫上形成导电聚合物塞。 在导电聚合物塞上形成一个符合标准的界面层。 半导体芯片的导电聚合物插塞与相应的金属凸块对准。 导电聚合物塞上的一致界面层与相应的金属凸块配合。 一致的界面层被热分解，粘附和永久地附着导电聚合物塞与相应的金属凸块。 还公开了形成和图案化羰基镍层的方法。

公开(公告)号：US20060280698A1

公开(公告)日：2006-12-14

申请号：US11152499

申请日：2005-06-14

申请人： Subhash Gupta ,  Dennis Flanagan

发明人： Subhash Gupta ,  Dennis Flanagan

IPC分类号： A61K8/96 ,  A61K36/18

CPC分类号： A61Q11/00 ,  A61K8/97 ,  A61K36/18

摘要： A system for treating conditions of the periodontium, such as gingivitis and periodontitis, includes an Ayurvedic medicinal solution and an applicator for delivering the solution to the periodontium. The Ayurvedic medicinal solution utilizes herbal extracts to break-down bacteria which can inflame gum tissue. In one embodiment, the solution comprises approximately 1 gram of triphala extract for every 10 ml of glycerine. In another embodiment, the solution comprises approximately 1 gram of amla extract for every 10 ml of glycerine. The applicator for delivering the solution to the periodontium may either be in the form of a cotton swab-type wand, a pipette or a spray dispenser.

摘要翻译： 用于治疗牙周病例如牙龈炎和牙周炎的系统包括阿育吠陀药用溶液和用于将溶液递送到牙周膜的施用器。 阿育吠陀药用溶液利用草药提取物分解可以使牙龈组织发炎的细菌。 在一个实施方案中，该溶液包含每10ml甘油约1克的三菌属提取物。 在另一个实施方案中，该溶液包含每10ml甘油约1克的amla提取物。 用于将溶液递送到牙周组织的施用器可以是棉签式棒，移液管或喷雾分配器的形式。

公开(公告)号：US06967162B2

公开(公告)日：2005-11-22

申请号：US10988769

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

公开(公告)号：US20050181081A1

公开(公告)日：2005-08-18

申请号：US10761804

申请日：2004-01-21

申请人： Suman Khanuja ,  Pushplata Chaturvedi ,  Anil Singh ,  Ajit Shasany ,  Vinay Agarwal ,  Vivek Gupta ,  Subhash Gupta ,  Arun Tripathy ,  Anirban Pal ,  Dharmendra Saikia ,  Mahendra Darokar ,  Krishna Aggarwal ,  Ravi Bansal

发明人： Suman Khanuja ,  Pushplata Chaturvedi ,  Anil Singh ,  Ajit Shasany ,  Vinay Agarwal ,  Vivek Gupta ,  Subhash Gupta ,  Arun Tripathy ,  Anirban Pal ,  Dharmendra Saikia ,  Mahendra Darokar ,  Krishna Aggarwal ,  Ravi Bansal

IPC分类号： A61K36/00 ,  A61K36/534 ,  A61K36/54 ,  A61K36/8962 ,  A61K35/78

CPC分类号： A61K36/54 ,  A61K36/534 ,  A61K36/8962 ,  A61K2300/00

摘要： The present invention provides an improved preparation based on the synergistic action of garlic extract and essential oil of M. spicata var. Ganga or cinnamon oil against dermatophytic fungus. More particularly, the present invention relates to the synergistic enhancement of activity of a combination by menthyl acetate or Geraniol. The invention also provides a method of preparation of the synergistic combination and the shelf life observed to be more than one year. The cream based preparation is a potent anti-dermatophytic as described and illustrated by in vitro and in vivo evaluations.

摘要翻译： 本发明提供了一种改进的制剂，其基于大蒜提取物和M.spicata var。的精油的协同作用。 甘草或肉桂油抗皮肤真菌。 更具体地，本发明涉及通过乙酸薄荷酯或香叶醇组合的协同增强活性。 本发明还提供了一种制备协同组合的方法和观察到的一年以上的保质期。 基于乳膏的制剂是有效的抗皮肤真菌病，如通过体外和体内评价所描述和说明的。

公开(公告)号：US20050100610A1

公开(公告)日：2005-05-12

申请号：US10822790

申请日：2004-04-13

申请人： Suman Khanuja ,  Sushil Kumar ,  Ajit Shasany ,  Jai Arya ,  Mahendra Darokar ,  Monika Singh ,  Prachi Sinha ,  Soumya Awasthi ,  Subhash Gupta ,  Vivek Gupta ,  Madan Gupta ,  Ram Verma ,  Sweta Agarwal ,  Sunil Mansinghka ,  Suresh Dawle

发明人： Suman Khanuja ,  Sushil Kumar ,  Ajit Shasany ,  Jai Arya ,  Mahendra Darokar ,  Monika Singh ,  Prachi Sinha ,  Soumya Awasthi ,  Subhash Gupta ,  Vivek Gupta ,  Madan Gupta ,  Ram Verma ,  Sweta Agarwal ,  Sunil Mansinghka ,  Suresh Dawle

IPC分类号： A61K35/22 ,  A61K45/06 ,  A61P31/00 ,  A61P35/00 ,  A61K33/40 ,  A61K31/4965 ,  A61K31/4709 ,  A61K31/496 ,  A61K31/65

CPC分类号： A61K45/06 ,  A61K35/22 ,  A61K2300/00

摘要： The invention relates to a novel pharmaceutical composition comprising an effective amount of bio-active fraction from cow urine distillate as a bioavailability facilitator and pharmaceutically acceptable additives selected from anticancer compounds, antibiotics, drugs, therapeutic and nutraceutic agents, ions and similar molecules which are targeted to the living systems.

摘要翻译： 本发明涉及一种新型药物组合物，其包含有效量的来自牛尿馏分的生物活性级分作为生物利用度促进剂和选自抗癌化合物，抗生素，药物，治疗和营养药物，离子和类似分子的药学上可接受的添加剂 到生活系统。

公开(公告)号：US20050090102A1

公开(公告)日：2005-04-28

申请号：US10988769

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

摘要翻译： 提供了具有暴露的金属端接垫的半导体芯片，以及在其上具有对应的暴露的金属凸块的单独的基板。 在暴露的金属端接垫上形成导电聚合物塞。 在导电聚合物塞上形成一个符合标准的界面层。 半导体芯片的导电聚合物插塞与相应的金属凸块对准。 导电聚合物塞上的一致界面层与相应的金属凸块配合。 一致的界面层被热分解，粘附和永久地附着导电聚合物塞与相应的金属凸块。 还公开了形成和图案化羰基镍层的方法。

公开(公告)号：US06531390B2

公开(公告)日：2003-03-11

申请号：US09925819

申请日：2001-08-10

申请人： Simon Chooi ,  Subhash Gupta ,  Mei-Sheng Zhou ,  Sangki Hong

发明人： Simon Chooi ,  Subhash Gupta ,  Mei-Sheng Zhou ,  Sangki Hong

IPC分类号： H01L218222

CPC分类号： H01L21/76832 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/76826 ,  H01L21/76831

摘要： A method for forming dual-damascene type conducting interconnects with non-metallic barriers that protect said interconnects from fluorine out-diffusion from surrounding low-k, fluorinated dielectric materials. One embodiment of the method is particularly suited for forming such interconnects in microelectronics fabrications of the sub 0.15 micron generation.

公开(公告)号：US06489233B2

公开(公告)日：2002-12-03

申请号：US09925821

申请日：2001-08-10

申请人： Simon Chooi ,  Subhash Gupta ,  Mei-Sheng Zhou ,  Sangki Hong

发明人： Simon Chooi ,  Subhash Gupta ,  Mei-Sheng Zhou ,  Sangki Hong

IPC分类号： H01L214763

CPC分类号： H01L21/76832 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/76826 ,  H01L21/76831

摘要： A method for forming dual-damascene type conducting interconnects with non-metallic barriers that protect said interconnects from fluorine out-diffusion from surrounding low-k, fluorinated dielectric materials. One embodiment of the method is particularly suited for forming such interconnects in microelectronics fabrications of the sub 0.15 micron generation.

摘要翻译： 用于形成具有非金属屏障的双镶嵌型导电互连的方法，其保护所述互连免受氟周围的低k，氟化介电材料的氟扩散。 该方法的一个实施例特别适用于在0.15微米级的微电子制造中形成这种互连。