摘要:
There is provided an inkjet head and a manufacturing method thereof. The inkjet head includes an upper substrate formed of a silicon material and having an ink chamber storing ink provided therein; an intermediate substrate bonded to the upper substrate, formed of a low temperature co-fired ceramic material, and having a connection path and a restrictor provided therein while the connection path and the restrictor are connected to the ink chamber; and a lower substrate bonded to the intermediate substrate, formed of a silicon material, and having a nozzle connected to the connection path provided therein. According to the inkjet head and the manufacturing method thereof, the densification and facilitation of bonding between substrates are achieved by using anodic bonding between a silicon substrate and a ceramic substrate, thereby improving manufacturing yield.
摘要:
There is provided a method of manufacturing an inkjet head. A method of manufacturing an inkjet head according to an aspect of the invention may include: forming a piezoelectric actuator on a dummy substrate; cutting the piezoelectric actuator into head cell units of an inkjet head; preparing an inkjet head substrate including an ink chamber formed at a position corresponding to the piezoelectric actuator; bonding the dummy substrate and the inkjet head substrate to each other so that the piezoelectric actuator and the ink chamber correspond to each other; and removing the dummy substrate.
摘要:
There is provided an inkjet head assembly that includes: an inkjet head plate including an ink path; a piezoelectric actuator facing a pressure chamber in the inkjet head plate and providing driving force for ejecting ink to a nozzle from the pressure chamber; a package part stacked on the inkjet head plate and including a path moving ink introduced from the outside to an inlet of the inkjet head plate; and an electrical connector filling a via penetrating the package part and electrically connected with the piezoelectric actuator.
摘要:
There is provided a multi inkjet head package. The multi inkjet head package may include: a plurality of inkjet head assemblies each having a head plate in which an inkjet head discharging ink is housed; a rack in which the head plate is housed so as to expose the inkjet head; and a preliminary fixation portion that is installed on the rack and allows the head plate to be preliminarily fixed to the rack.
摘要:
There is provided a method of manufacturing an inkjet print head. The method includes providing a head portion having a dummy portion disposed on a surface of a pressure area pressurizing an ink chamber, a nozzle connected to the ink chamber for ink ejection and the ink chamber for ink supply to the nozzle, and removing the dummy portion. The method allows for the improvement of ink ejection and nozzle density. Also, the method allows for the forming of a thin-type head portion using the dummy portion.
摘要:
An inkjet print head includes a plurality of pressure chambers receiving and storing ink which is to be discharged to a nozzle, a piezoelectric body interposing a membrane with the pressure chamber, the piezoelectric body providing a driving force for discharging ink to each of the pressure chambers, and a measuring unit measuring capacitance of the piezoelectric body so that a temperature of ink being discharged to the nozzle is measured.
摘要:
There are provided an inkjet head assembly and a method for manufacturing the same. The inkjet head assembly includes: an inkjet head plate having an ink flow passage formed therein and having an actuator formed thereon, the actuator providing driving force for discharging ink; a flexible printed circuit board (FPCB) applying voltage to the actuator; and an intermediate substrate provided so as to electrically connect the actuator to the flexible printed circuit board and having a second bonding portion bonded to the flexible printed circuit board formed inwardly of a first bonding portion, bonded to the actuator in a width direction of the inkjet head plate.
摘要:
Disclosed are an electronic component module and a method of manufacturing the same. The electronic component module includes a first insulating layer having a first surface in which first circuit patterns are embedded, electronic components of different kinds, the electronic components being mounted on the first circuit patterns and having electrode parts placed in different locations, and a molding layer encompassing the electronic components. Accordingly, a thin-film type electronic component module having a thin insulating layer with a circuit pattern can be provided.
摘要:
Provided is an inkjet head assembly capable of reducing the generation of air bubbles during ink injection by using a guide formed inside an ink tank. The inkjet head assembly includes an ink tank including an ink inlet through which ink is injected from the outside, and storing ink injected through the ink inlet, an inkjet head connected with the ink tank through an ink supply channel, receiving ink from the ink tank and discharging the received ink, and a guide disposed inside the ink tank and guiding ink, injected through the ink inlet, to an inner surface of the ink tank.
摘要:
There is provided an inkjet print head including: a pressure chamber storing ink in order to eject the ink to a nozzle; a piezoelectric actuator receiving part being recessed in order to correspond to the pressure chamber in a direction of the pressure chamber; and a piezoelectric actuator received in the piezoelectric actuator receiving part, in which viscous liquid having piezoelectric properties is filled and hardened, and supplying the pressure chamber with a driving force for ejection of the ink.