Abstract:
Complementary metal oxide semiconductor transistors are formed on a silicon substrate. The substrate has a {100} crystallographic orientation. The transistors are formed on the substrate so that current flows in the channels of the transistors are parallel to the direction. Additionally, longitudinal tensile stress is applied to the channels.
Abstract:
A semiconductor device and method for its fabrication are described. An active region spacer may be formed on a top surface of an isolation region and adjacent to a sidewall of an active region. In one embodiment, the active region spacer may suppress the formation of metal pipes in the active region.
Abstract:
Various methods for forming a layer of strained silicon in a channel region of a device and devices constructed according to the disclosed methods. In one embodiment, a strain-inducing layer is formed, a relaxed layer is formed on the strain-inducing layer, a portion of the strain-inducing layer is removed, which allows the strain-inducing layer to relax and strain the relaxed layer.
Abstract:
The present invention is a semiconductor device having and a method for forming wells by growing an epitaxial silicon layer wherein the epitaxial silicon layer has at least three silicon sublayers. The first sublayer is highly doped, the second sublayer is less doped, and the third sublayer is also highly doped. The use of the epitaxially grown wells allows for the placement of high dopant concentrations in regions of the well where electrical isolation is an issue and the placement of lower doped concentrations in regions of the well where electrical isolation is not as great an issue in order to help reduce the problem of parasitic capacitance.
Abstract:
A monitoring device to monitor process induced charge employing a single layer of polysilicon forming a floating gate. The device comprises two capacitors, one for charging and the other for discharging a floating gate of an n-channel transistor. Embodiments which permit the monitoring of positive charge, negative charge and both positive and negative charge are described. The device is reusable and lends itself to in-line monitoring as opposed to some prior art devices used for end-of-line monitoring.
Abstract:
Surface modification control stations and methods in a globally distributed array for dynamically adjusting the atmospheric, terrestrial and oceanic properties. The control stations modify the humidity, currents, wind flows and heat removal rate of the surface and facilitate cooling and control of large area of global surface temperatures. This global system is made of arrays of multiple sub-systems that monitor climate and act locally on weather with dynamically generated local forcing & perturbations for guiding in a controlled manner aim at long-term modifications. The machineries are part of a large-scale system consisting of an array of many such machines put across the globe at locations called the control stations. These are then used in a coordinated manner to modify large area weather and the global climate as desired. The energy system installed at a control stations, with multiple machines to change the local parameters of the ocean, these stations are powered using renewable energy (RE) sources including Solar, Ocean Currents, Wind, Waves and Batteries to store energy and provide sufficient power and energy as required and available at all hours. This energy is then used to do directed work using special machines, that can be pumps for seawater to move ocean water either amplifying or changing the currents in various locations and at different depths, in addition it will have machineries for changing the vertical depth profile of the ocean of temperature, salinity and currents. Control stations will also directly use devices such as heat pumps to change the temperatures of local water either at surface or at controlled depths, or modify the humidity and salinity to change the atmospheric and oceanic properties as desired. The system will work in a globally coordinated manner applying artificial intelligence and machine learning algorithms to learn from observations to improve the control characteristics and aim to slow down the rise of global surface temperatures. These systems are used to reduce the temperatures of coral reefs, arctic glaciers and south pacific to control the El Nino oscillations.
Abstract:
A method including forming a transistor structure structure comprising a gate electrode over an active region of a substrate, the active region defined by a trench isolation structure and changing a performance of a narrow width transistor with respect to a wide width transistor by introducing a dopant into the active region adjacent an interface defined by the trench isolation structure and the gate electrode. A structure including a gate electrode formed on a substrate, an active region adjacent an interface defined by a trench isolation structure and a gate electrode and an implant within the active region to change a performance of a transistor.
Abstract:
Embodiments of the invention provide a transistor with stepped source and drain regions. The stepped regions may provide significant strain in a channel region while minimizing current leakage. The stepped regions may be formed by forming two recesses in a substrate to result in a stepped recess, and forming the source/drain regions in the recesses.
Abstract:
Metal Oxide Semiconductor Field Effect Transistors (MOSFET) are disclosed. One MOSFET includes, a substrate having a well of a first conductivity type. The MOSFET also includes source and drain regions, of a second conductivity type, formed in the well arranged apart from each other. Moreover, the MOSFET includes a first region, of a second conductivity type, formed in the well near the drain region. The first region has a low doping. Furthermore, the MOSFET includes a second region of a second conductivity type, formed near the source region. The second region has a doping substantially higher than the doping of the first region. A second MOSFET includes a substrate having a well of a first conductivity type and source and drain regions, of a second conductivity type, formed in the well apart from each other. Moreover, the MOSFET includes a drain extension region of the second conductivity type, formed in the well near the drain region. Furthermore, the MOSFET includes a source extension region, of the second conductivity type, formed in the well near the source region. The source extension region is doped more heavily than the drain extension region. The source extension region extends deeper in the well than the drain extension region.
Abstract:
An improved MOS transistor and method for making it are described. The MOS transistor's source and drain have a first conductivity type and are separated from each other by a first region having a second conductivity type opposite to the first conductivity type. A second region, also having the second conductivity type, is formed adjacent to the drain and is separated from the first region by the drain.