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公开(公告)号：US07972884B2
公开(公告)日：2011-07-05
申请号：US12399348
申请日：2009-03-06
申请人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
发明人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
IPC分类号： H01L21/00
CPC分类号： B81B3/0078 , B81B2201/016 , B81B2203/0109 , H01H1/50 , H01H3/60 , H01H59/0009 , Y10T29/49002
摘要： An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.
摘要翻译： 本发明的一个实例是一种微机械装置，其特征在于，包括：设置有信号线的基板，安装在基板上的微机械，由导电材料形成为梁状，通过功能弹性变形 电场的方式使得束状部分靠近信号线或离开信号线移动，并且随着变形而改变电特性，变形抑制部分由具有比导电性更高的粘度系数的材料构成 材料，其设置在所述微机械相对于所述信号线的相反侧，用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体， 具有位于其间的中空部分的微机械。
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2.发明申请HOLLOW SEALING STRUCTURE AND MANUFACTURING METHOD FOR HOLLOW SEALING STRUCTURE 审中-公开中空密封结构的中空密封结构和制造方法公开(公告)号：US20080297992A1
公开(公告)日：2008-12-04
申请号：US12128956
申请日：2008-05-29
申请人： Susumu OBATA , Michinobu Inoue , Takeshi Miyagi
发明人： Susumu OBATA , Michinobu Inoue , Takeshi Miyagi
CPC分类号： B81C1/00333 , B81C2203/0136 , B81C2203/0145 , H01L29/84
摘要： A hollow sealing structure includes, a substrate, a functional element portion disposed on a principal surface of the substrate, and a covering portion disposed over the principal surface of the substrate to form a hollow portion in which the covering portion covers the functional element portion, the covering portion including a first covering structure portion having a plurality of openings, second covering structure portions disposed individually on imaginary straight lines which connect the functional element portion and the openings, and a sealing structure portion which seals gaps defined between the first covering structure portion and the second covering structure portions.
摘要翻译： 中空密封结构包括：基板，设置在基板的主表面上的功能元件部分和设置在基板的主表面上的覆盖部分，以形成覆盖部分覆盖功能元件部分的中空部分， 所述覆盖部分包括具有多个开口的第一覆盖结构部分，分别设置在连接所述功能元件部分和所述开口的假想直线上的第二覆盖结构部分和密封结构部分，所述密封结构部分密封限定在所述第一覆盖结构部分 和第二覆盖结构部分。
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3.发明申请公开(公告)号：US20090236114A1
公开(公告)日：2009-09-24
申请号：US12399348
申请日：2009-03-06
申请人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
发明人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
CPC分类号： B81B3/0078 , B81B2201/016 , B81B2203/0109 , H01H1/50 , H01H3/60 , H01H59/0009 , Y10T29/49002
摘要： An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.
摘要翻译： 本发明的一个实例是一种微机械装置，其特征在于，包括：设置有信号线的基板，安装在基板上的微机械，由导电材料形成为梁状，通过功能弹性变形 电场的方式使得束状部分靠近信号线或离开信号线移动，并且随着变形而改变电特性，变形抑制部分由具有比导电性更高的粘度系数的材料构成 材料，其设置在所述微机械相对于所述信号线的相反侧，用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体， 具有位于其间的中空部分的微机械。
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公开(公告)号：US08004053B2
公开(公告)日：2011-08-23
申请号：US12255144
申请日：2008-10-21
IPC分类号： H01L29/84
CPC分类号： B81C1/00293 , B81B3/0078 , B81C2203/0136 , B81C2203/0145 , H03H9/1057 , Y10T29/49002
摘要： A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics concomitantly with the deformation, an inner inorganic sealing film which contains an inorganic material, is provided on a principal surface of the substrate, covers the micromachine through a hollow section containing a gaseous body therein, and is provided with opening shape sections allowing the hollow section to communicate with the outside, an organic sealing film which contains an organic material, is formed on the inner inorganic sealing film, and blocks up the opening shape sections, and an outer inorganic sealing film which contains an inorganic material with lower moisture permeability than the organic material, is formed on the organic sealing film, and covers the organic sealing film.
摘要翻译： 根据本发明的一个方面的微机械装置包括：基板，安装在基板上的微型机械，具有通过电场的功能变形的机构，并且随着变形而改变电特性， 含有无机材料的内无机密封膜设置在基板的主表面上，通过包含气体的中空部分覆盖微机械，并且设置有允许中空部分与外部连通的开口形状部分， 在内无机密封膜上形成含有有机材料的有机密封膜，并且封闭开口形状部分，并且形成包含具有比有机材料低的透湿性的无机材料的外部无机密封膜， 有机密封膜，并覆盖有机密封膜。
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公开(公告)号：US20090071807A1
公开(公告)日：2009-03-19
申请号：US12187734
申请日：2008-08-07
申请人： Shinichi KOMINATO , Masao Segawa , Mariko Sugimoto , Takeshi Miyagi , Michinobu Inoue , Susumu Obata
发明人： Shinichi KOMINATO , Masao Segawa , Mariko Sugimoto , Takeshi Miyagi , Michinobu Inoue , Susumu Obata
CPC分类号： H01H59/0009 , B81B7/0058 , B81B2207/095 , B81C2203/0145 , B81C2203/0154 , H01H9/04
摘要： A MEMS switch includes a field generator which generates an electric field in a predetermined space, a beam located in the space and made of an electrically conductive material, the beam being flexed downward when subjected to an electrostatic force due to the electric field, the beam being deformed so as to return upward by an elastic restoring force upon extinction of the electrostatic force, a signal line electrically connected to the beam when the beam is flexed downward, and a protective cap covering the field generator, the beam, and the signal line, thereby sealing the field generator, the beam, and the signal line.
摘要翻译： MEMS开关包括在预定空间中产生电场的场发生器，位于该空间中并由导电材料制成的光束，当由于电场而受到静电力时，该光束向下弯曲，该光束 当静电力消失时，通过弹性恢复力向上返回，当光束向下弯曲时电连接到光束的信号线以及覆盖场发生器，光束和信号线的保护帽 ，从而密封场发生器，光束和信号线。
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公开(公告)号：US08476741B2
公开(公告)日：2013-07-02
申请号：US13009212
申请日：2011-01-19
申请人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L23/58 , H01L21/31 , H01L21/4763
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译： 根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。
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公开(公告)号：US20080211076A1
公开(公告)日：2008-09-04
申请号：US12040209
申请日：2008-02-29
CPC分类号： B81B7/0077 , B81C2203/0136 , B81C2203/0145
摘要： A semiconductor device capable of elevating a yield rate of products to improve the productivity and also ensuring high reliability in production and a manufacturing method of the semiconductor device are provided. The semiconductor device includes a semiconductor substrate 2, a MEMS part 3 formed on a surface of the semiconductor substrate 2 and a cap part arranged at a distance from the MEMS part 3 and also arranged on the surface of the semiconductor substrate 2 so as to cover the MEMS part 3. In the semiconductor device, the cap part is formed by a sidewall area E surrounding the MEMS part 3 and a top board area F having a hollow layer and also forming a closed space together with the semiconductor substrate 2 and the sidewall area E.
摘要翻译： 提供能够提高产品的成品率以提高生产率并且还确保高生产可靠性的半导体器件和半导体器件的制造方法。 半导体器件包括半导体衬底2，形成在半导体衬底2的表面上的MEMS部分3和与MEMS部分3相距一定距离地布置并且还被布置在半导体衬底2的表面上以覆盖 MEMS部件3.在半导体器件中，盖部分由围绕MEMS部件3的侧壁区域E和具有中空层的顶板区域F形成，并且还与半导体衬底2和侧壁一起形成封闭空间 区域E.
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公开(公告)号：US20110215427A1
公开(公告)日：2011-09-08
申请号：US13009212
申请日：2011-01-19
申请人： Susumu OBATA , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu OBATA , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L29/84
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译： 根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。
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公开(公告)号：US20110316387A1
公开(公告)日：2011-12-29
申请号：US13167276
申请日：2011-06-23
CPC分类号： B06B1/0622 , G10K9/125 , H01L41/22 , Y10T29/42 , Y10T29/49005
摘要： An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.
摘要翻译： 一个实施例的方面，提供了一种包括多个振荡器的超声波换能器，每个振荡器具有凸部，设置成与凸部相对的印刷线路板，至少包括一部分 连接振荡器和印刷线路板的粘合材料以及设置在振荡器和印刷线路板之间的树脂，覆盖凸部的树脂和粘合材料。
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10.发明申请公开(公告)号：US20110237952A1
公开(公告)日：2011-09-29
申请号：US13051451
申请日：2011-03-18
IPC分类号： A61B8/00
CPC分类号： A61B8/00 , A61B8/4405 , A61B2562/222 , B06B1/0629 , G01S15/8925 , G10K11/004
摘要： According to one embodiment, an ultrasonic probe comprises piezoelectric elements arranged in the form of a two-dimensional array, a processing IC configured to process signal information obtained from the piezoelectric elements, and a flexible wiring substrate disposed between the piezoelectric elements and the processing IC, with the piezoelectric elements mounted on a front surface, and the processing IC mounted on a rear surface.
摘要翻译： 根据一个实施例，超声波探头包括以二维阵列形式布置的压电元件，被配置为处理从压电元件获得的信号信息的处理IC以及设置在压电元件和处理IC之间的柔性布线基板 ，其中压电元件安装在前表面上，并且处理IC安装在后表面上。
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