公开(公告)号：US20160302311A1

公开(公告)日：2016-10-13

申请号：US15094945

申请日：2016-04-08

Applicant: POMIRAN METALIZATION RESEARCH CO., LTD. ,  TAIMIDE TECHNOLOGY INCORPORATION ,  ARAKAWA CHEMICAL INDUSTRIES, LTD.

Inventor： Chung-Yi Chen ,  Akihisa Hamazawa ,  Wen-Chin Chen ,  Chien-Feng Chiu ,  Shih-Cheng Fan

IPC: H05K3/10 ,  B05D3/00 ,  H05K1/09 ,  H05K3/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K3/022 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/32 ,  C25D5/10 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2203/0709 ,  H05K2203/1545

Abstract: The present disclosure relates, according to some embodiments, to a method of fabricating a flexible metal-clad laminate comprising forming a metal layer on a surface of a polyimide film, wherein the metal layer and the polyimide film are contacting each other and forming a laminate, and heating the laminate at a temperature of about 80° C. to about 140° C. until a weight loss of the laminate reaches about 1% or higher.

Abstract translation: 根据一些实施方案，本公开涉及制造柔性覆金属层压板的方法，包括在聚酰亚胺膜的表面上形成金属层，其中金属层和聚酰亚胺膜彼此接触并形成层压体 ，并在约80℃至约140℃的温度下加热层压板，直到层压板的重量损失达到约1％或更高。

公开(公告)号：US09267057B2

公开(公告)日：2016-02-23

申请号：US14060131

申请日：2013-10-22

Applicant: Taimide Technology Incorporation

Inventor： Chung-Yi Chen ,  Chih-Wei Lin ,  Chi-Huan Lo ,  Shihan Tai

IPC: B32B5/16 ,  C09D179/08 ,  C08G73/10 ,  C08L79/08 ,  C08K13/02 ,  C08J5/18

CPC classification number: C09D179/08 ,  C08G73/10 ,  C08J5/18 ,  C08J2379/08 ,  C08J2479/08 ,  C08K13/02 ,  C08L79/08 ,  Y10T428/31721

Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.

Abstract translation: 聚酰亚胺膜包括聚酰亚胺基层聚酰亚胺层和分散在聚酰亚胺基聚合物中的聚酰亚胺粉末，该聚酰亚胺粉末是通过二胺与二酸酐的摩尔比为约1:0.950至约1:0.995 。 此外，聚酰亚胺膜可以具有至少包含层叠在聚酰亚胺层的表面上的第二聚酰亚胺层的多层结构。 第二聚酰亚胺还可以包含聚酰亚胺粉末，其重量比小于第二聚酰亚胺层的总重量的约20重量％。 本文所述的实施方案还包括制备聚酰亚胺膜的方法。

公开(公告)号：US20130279126A1

公开(公告)日：2013-10-24

申请号：US13670015

申请日：2012-11-06

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Yi Chen ,  Wu-Yung Yang ,  Chih-Wei Lin

IPC: C08G73/10 ,  H05K7/06 ,  H01L31/0216 ,  B32B15/08 ,  B05D5/12

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/18 ,  B32B2457/206 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1085 ,  C08G73/22 ,  C09D179/08 ,  H01L31/03928 ,  Y02E10/541 ,  Y10T428/31681

Abstract: An aromatic polyimide film can be formed from a plurality of monomers comprising an aromatic dianhydride, and a first aromatic diamine selected from a group consisting of formulae (I) and (II): and wherein X and Y are respectively selected from the group consisting of oxygen, nitrogen and sulfur, and R and R′ are respectively selected from the group consisting of NH2, wherein the aromatic polyimide film has an average linear coefficient of thermal expansion equal to or below about 5 ppm/° C. in a temperature range between about 50° C. and about 500° C.

Abstract translation: 芳族聚酰亚胺膜可以由多种包含芳族二酐的单体和选自式（I）和（II）的第一芳族二胺形成：其中X和Y分别选自 氧，氮和硫，R和R'分别选自NH 2，其中芳族聚酰亚胺膜的平均线性热膨胀系数等于或低于约5ppm /℃，在 约50℃和约500℃