公开(公告)号：US10334738B2

公开(公告)日：2019-06-25

申请号：US15365664

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H01L21/683 ,  H01L23/498 ,  C03C17/34 ,  C08L79/08 ,  C08G73/10 ,  C09D179/08

Abstract: A method of fabricating a flexible substrate assembly includes forming a first polyimide layer on a rigid support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution, an adhesion promoting agent and a release agent for achieving different adhesion strength at two opposite sides of the first polyimide layer, and forming a flexible second polyimide layer on the first polyimide layer, the second polyimide layer being adhered in contact with the first polyimide layer, and a peeling strength between the first and second polyimide layers being less than a peeling strength between the first polyimide layer and the support base so that the second polyimide layer is peelable from the first polyimide layer while the first polyimide layer remains adhered in contact with the support base.

公开(公告)号：US20180042125A1

公开(公告)日：2018-02-08

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/46 ,  C08L79/08 ,  H05K1/03

CPC classification number: H05K3/007 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

公开(公告)号：US10212821B2

公开(公告)日：2019-02-19

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  C03C17/34 ,  H01L21/683 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  H01L23/498 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.

公开(公告)号：US20180042116A1

公开(公告)日：2018-02-08

申请号：US15365664

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/00 ,  C03C17/34 ,  H01L23/498 ,  H05K1/03 ,  H01L21/683

CPC classification number: H05K3/007 ,  C03C17/30 ,  C03C17/32 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C03C2218/355 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible substrate assembly includes forming a first polyimide layer on a rigid support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution, an adhesion promoting agent and a release agent for achieving different adhesion strength at two opposite sides of the first polyimide layer, and forming a flexible second polyimide layer on the first polyimide layer, the second polyimide layer being adhered in contact with the first polyimide layer, and a peeling strength between the first and second polyimide layers being less than a peeling strength between the first polyimide layer and the support base so that the second polyimide layer is peelable from the first polyimide layer while the first polyimide layer remains adhered in contact with the support base.