摘要:
A memory macro structure includes a first memory array, a second memory array, a cell activation circuit coupled to the first and second memory arrays and positioned between the first and second memory arrays, a control circuit coupled to the cell activation circuit and positioned adjacent to the cell activation circuit, and a through-silicon via (TSV) extending through one of the cell activation circuit or the control circuit.
摘要:
An integrated circuit (IC) die includes first through third adjacent rows of through-silicon vias (TSVs), and first and second adjacent rows of memory macros. TSVs of the first row of TSVs extend through and are electrically isolated from memory macros of the first row of memory macros. TSVs of the third row of TSVs extend through and are electrically isolated from memory macros of the second row of memory macros.
摘要:
An integrated circuit (IC) package includes a logic die, a substrate, a memory die positioned between the logic die and the substrate, and a power distribution structure configured to electrically couple the logic die to the substrate. The power distribution structure includes a plurality of conductive segments positioned between the logic die and the memory die, a plurality of bump structures positioned between the memory die and the substrate, and a plurality of through-silicon vias (TSVs) electrically coupled to the plurality of conductive segments and the plurality of bump structures, and a TSV of the plurality of TSVs extends through, and is electrically isolated from, a memory macro of the memory die.
摘要:
A method includes designing a layout of gate structures and diffusion regions of a plurality of devices, identifying an edge device of the plurality of devices, adding a dummy device next to the edge device and a dummy gate structure next to the dummy device resulting in a modified layout, and fabricating, based on the modified layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. The dummy device shares a diffusion region with the edge device. A gate structure of the dummy device is one of two dummy gate structures added next to the edge device.
摘要:
A three-dimensional integrated circuit includes a first transistor, a word line, a first via, a second transistor, and a second via. The first transistor is on a first level and the second transistor is on a second level. The second level is different from the first level. The word line and the first via are coupled to the first transistor. The second via is coupled between the first transistor and the second transistor.
摘要:
A memory includes a plurality of memory blocks, a plurality of sensing circuits, a plurality of global bit lines, a common pre-charging circuit and a selection circuit. Each global bit line of the plurality of global bit lines is coupled to at least one of the memory blocks by a corresponding sensing circuit of the plurality of sensing circuits. The common pre-charging circuit is configured to individually pre-charge each global bit line of the plurality of global bit lines to a pre-charge voltage. The selection circuit is configured to selectively couple the common pre-charging circuit to a selected global bit line of the plurality of global bit lines.
摘要:
An integrated circuit (IC) memory device that includes a first conductive layer, a second conductive layer electrically coupled to the first conductive layer, the second conductive layer formed over the first conductive layer, a third conductive layer separated from the second conductive layer, the third conductive layer formed over the second conductive layer, a fourth conductive layer electrically coupled to the third conductive layer, the fourth conductive layer formed over the third conductive layer, a 2P2E pin box formed in and electrically coupled to the first conductive layer or the second conductive layer and a 1P1E pin box formed in and electrically coupled to the third conductive layer or the fourth conductive layer.
摘要:
A sense amplifier includes a cross latch, a first pass gate, a second pass gate, a first data line, a second data line, a first circuit, and a second circuit. The cross latch has a first input/output (I/O) node and a second I/O node. The first pass gate is coupled between the first data line and the first I/O node. The second pass gate is coupled between the second data line and the second I/O node. The first circuit is coupled with the first I/O node and the second data line. The second circuit is coupled with the second I/O node and the first data line. The first circuit is configured to be turned off when the second data line has a first logical value and to be at least lightly turned on when the second data line has a voltage level between the first logical value and a second logical value different from the first logical value. The second circuit is configured to be turned off when the first data line has the first logical value and to be at least lightly turned on when the first data line has a voltage level between the first logical value and the second logical value.
摘要:
A method of designing a layout of devices includes designing a layout of gate structures and diffusion regions of a plurality of devices. The method further includes identifying an edge device of the plurality of devices. The method further includes adding a dummy device next to the edge device and a dummy gate structure next to the dummy device, wherein the dummy device shares a diffusion region with the edge device, and wherein a gate structure of the dummy device is considered to be one of two dummy gate structures added next to the edge device.
摘要:
A method includes designing a first layout of gate structures and diffusion regions of a plurality of active devices, identifying an edge device of the plurality of active devices, modifying the first layout resulting in a second layout, performing a design rule check on the second layout, and fabricating, based on the second layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. Modifying the first layout includes adding a dummy device next to the edge device, adding a dummy gate structure next to the dummy device and extending a shared diffusion region to at least the dummy device. The dummy device and the edge device have the shared diffusion region. Performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.