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    SEMICONDUCTOR MODULE
    1.
    发明申请
    SEMICONDUCTOR MODULE 审中-公开

    公开(公告)号：US20200006238A1

    公开(公告)日：2020-01-02

    申请号：US16456398

    申请日：2019-06-28

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Hideki YOKOTA ,  Yuichi SASAJIMA

    IPC: H01L23/538 ,  H01L23/31

    Abstract: A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface, the first surface including a first mounting area and a second mounting area, the second surface including a first area and a second area, the first area facing the first mounting area, the second area facing the second mounting area; a plurality of circuit parts that includes a first circuit part and a second circuit part, the first circuit part being mounted on the first mounting area, the second circuit part being mounted on the second mounting area; a sealing layer that is provided on the first surface and covers the plurality of circuit parts; and an electrode layer that includes a first electrode group and a second electric group, the first electrode group including a plurality of first electrode terminals that covers substantially the entire area of the first area and is to be electrically connected to the first circuit part, the second electrode group including a plurality of second electrode terminals that covers substantially an entire area of the second area and is to be electrically connected to the second circuit part.

    CAMERA MODULE
    2.
    发明申请
    CAMERA MODULE 有权
    相机模块

    公开(公告)号：US20140253794A1

    公开(公告)日：2014-09-11

    申请号：US14155311

    申请日：2014-01-14

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Masashi MIYAZAKI ,  Yuichi SUGIYAMA ,  Tatsuro SAWATARI ,  Hideki YOKOTA ,  Yutaka HATA

    IPC: H04N5/225

    CPC classification number: H04N5/2257 ,  H01L24/47 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.

    Abstract translation: 在嵌入式部件基板的表面（上表面）上设置相机模块，其中具有比成像装置的厚度更大的深度的凹部。 成像装置结合到凹部的底部，使得在成像装置的表面（顶表面）和嵌入部件基板的表面（顶表面）之间存在开口。 成像装置上的连接焊盘通过接合穿过开口的导线连接到设置在嵌入式组件衬底的表面（顶表面）上的导体焊盘。

    METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY
    3.
    发明申请
    METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY 有权
    制造具有孔的基材的方法

    公开(公告)号：US20150010694A1

    公开(公告)日：2015-01-08

    申请号：US14316382

    申请日：2014-06-26

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Masashi MIYAZAKI ,  Yuichi SUGIYAMA ,  Tatsuro SAWATARI ,  Hideki YOKOTA ,  Yutaka HATA

    IPC: H05K3/06 ,  H05K3/44

    CPC classification number: H05K3/4697 ,  B05D3/12 ,  B05D5/12 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/04 ,  H05K3/06 ,  H05K3/30 ,  H05K3/42 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4647 ,  H05K2201/10204

    Abstract: The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.

    Abstract translation: 制造基板的方法包括：在基层中形成贯通孔; 将金属虚设部件插入穿透孔中; 形成由合成树脂制成的绝缘部分，以填充所述穿透孔和所述虚拟部件之间的环形间隙; 在所述基底层的底面上形成覆盖所述虚拟部的底面的由合成树脂制成的下绝缘层，以与所述绝缘部连续; 在所述基底层的顶表面上形成覆盖所述虚拟部分的上表面的由合成树脂制成的上绝缘层，以与所述绝缘部分连续; 通过在上绝缘层中布线来形成暴露孔以暴露虚拟部分的顶表面; 并且通过蚀刻去除暴露在暴露孔中的虚拟部分来形成空腔。

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